-
公开(公告)号：US20110235408A1
公开(公告)日：2011-09-29
申请号：US12987109
申请日：2011-01-08
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/0069 , G11C2013/008 , G11C2213/71 , G11C2213/75 , H01L27/2409 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/1286 , H01L45/1293 , H01L45/144
摘要： For decreasing a recording current and suppressing a cross erase simultaneously, a three-dimensional phase-change memory for attaining higher sensitivity and higher reliability by the provision of a chalcogenide type interface layer is provided, in which an electric resistivity, a thermal conductivity, and a melting point of the material of the interface layer are selected appropriately, thereby improving the current concentration to the phase-change material and thermal and material insulation property with Si channel upon writing.
摘要翻译： 为了同时降低记录电流和抑制交叉擦除，提供了一种用于通过提供硫族化物型界面层来获得更高灵敏度和更高可靠性的三维相变存储器，其中电阻率，热导率和 适当地选择界面层的材料的熔点，从而提高相变材料的电流浓度和写入时Si通道的热和材料绝缘性能。
-
公开(公告)号：US08735865B2
公开(公告)日：2014-05-27
申请号：US12987109
申请日：2011-01-08
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/0069 , G11C2013/008 , G11C2213/71 , G11C2213/75 , H01L27/2409 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/1286 , H01L45/1293 , H01L45/144
摘要： For decreasing a recording current and suppressing a cross erase simultaneously, a three-dimensional phase-change memory for attaining higher sensitivity and higher reliability by the provision of a chalcogenide type interface layer is provided, in which an electric resistivity, a thermal conductivity, and a melting point of the material of the interface layer are selected appropriately, thereby improving the current concentration to the phase-change material and thermal and material insulation property with Si channel upon writing.
摘要翻译： 为了同时降低记录电流和抑制交叉擦除，提供了一种用于通过提供硫族化物型界面层来获得更高灵敏度和更高可靠性的三维相变存储器，其中电阻率，热导率和 适当地选择界面层的材料的熔点，从而提高相变材料的电流浓度和写入时Si通道的热和材料绝缘性能。
-
公开(公告)号：US20130048938A1
公开(公告)日：2013-02-28
申请号：US13589457
申请日：2012-08-20
IPC分类号： H01L45/00
CPC分类号： H01L45/06 , H01L27/2454 , H01L27/2481 , H01L45/124 , H01L45/144 , H01L45/1691
摘要： An object of the present invention is to provide a technique for suppressing thermal disturbance of a phase change memory device having a three-dimensional structure. In the phase change memory device having a three-dimensional structure, a material having a high thermal conductivity is used as a gate insulation film of a MOS transistor for selection, and causes heat transmitted to a Si channel layer from a phase change recording film to successfully diffuse to a gate electrode. In this way, since heat generated from a recording bit diffuses to a non-selected bit adjacent to it, it is possible to suppress thermal disturbance. BN, Al2O3, AlN, TiO2, Si3N4, ZnO and the like are useful as a gate insulation film having a high thermal conductivity.
摘要翻译： 本发明的目的是提供一种用于抑制具有三维结构的相变存储装置的热扰动的技术。 在具有三维结构的相变存储器件中，使用具有高热导率的材料作为用于选择的MOS晶体管的栅极绝缘膜，并且将从相变记录膜传输到Si沟道层的热量 成功地扩散到栅电极。 以这种方式，由于从记录位产生的热扩散到与其相邻的非选择位，因此可以抑制热扰动。 BN，Al 2 O 3，AlN，TiO 2，Si 3 N 4，ZnO等可以用作具有高导热性的栅极绝缘膜。
-
公开(公告)号：US09082955B2
公开(公告)日：2015-07-14
申请号：US13589457
申请日：2012-08-20
CPC分类号： H01L45/06 , H01L27/2454 , H01L27/2481 , H01L45/124 , H01L45/144 , H01L45/1691
摘要： An object of the present invention is to provide a technique for suppressing thermal disturbance of a phase change memory device having a three-dimensional structure. In the phase change memory device having a three-dimensional structure, a material having a high thermal conductivity is used as a gate insulation film of a MOS transistor for selection, and causes heat transmitted to a Si channel layer from a phase change recording film to successfully diffuse to a gate electrode. In this way, since heat generated from a recording bit diffuses to a non-selected bit adjacent to it, it is possible to suppress thermal disturbance. BN, Al2O3, AlN, TiO2, Si3N4, ZnO and the like are useful as a gate insulation film having a high thermal conductivity.
摘要翻译： 本发明的目的是提供一种用于抑制具有三维结构的相变存储装置的热扰动的技术。 在具有三维结构的相变存储器件中，使用具有高热导率的材料作为用于选择的MOS晶体管的栅极绝缘膜，并且将从相变记录膜传输到Si沟道层的热量 成功地扩散到栅电极。 以这种方式，由于从记录位产生的热扩散到与其相邻的非选择位，因此可以抑制热扰动。 BN，Al 2 O 3，AlN，TiO 2，Si 3 N 4，ZnO等可以用作具有高导热性的栅极绝缘膜。
-
公开(公告)号：US08427865B2
公开(公告)日：2013-04-23
申请号：US13440225
申请日：2012-04-05
申请人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译： 提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。 每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以构成三维存储器 单元格阵列。 存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。 通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。
-
公开(公告)号：US20130234101A1
公开(公告)日：2013-09-12
申请号：US13884331
申请日：2010-11-22
IPC分类号： H01L45/00
CPC分类号： H01L27/2436 , H01L27/1157 , H01L27/11582 , H01L27/2409 , H01L27/2454 , H01L27/2481 , H01L27/249 , H01L29/66833 , H01L29/7926 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/144 , H01L45/1608 , H01L45/1616 , H01L45/1683
摘要： A vertical chain memory includes two-layer select transistors having first select transistors which are vertical transistors arranged in a matrix, and second select transistors which are vertical transistors formed on the respective first select transistors, and a plurality of memory cells connected in series on the two-layer select transistors. With this configuration, the adjacent select transistors are prevented from being selected by respective shared gates, the plurality of two-layer select transistors can be selected, independently, and a storage capacity of a non-volatile storage device is prevented from being reduced.
-
公开(公告)号：US08169819B2
公开(公告)日：2012-05-01
申请号：US12688886
申请日：2010-01-17
申请人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译： 提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。 每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以配置三维存储器 单元格阵列。 存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。 通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。
-
公开(公告)号：US20100182828A1
公开(公告)日：2010-07-22
申请号：US12688886
申请日：2010-01-17
申请人： Akio SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译： 提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。 每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以构成三维存储器 单元格阵列。 存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。 通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。
-
公开(公告)号：US20120211718A1
公开(公告)日：2012-08-23
申请号：US13440225
申请日：2012-04-05
申请人： AKIO SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： AKIO SHIMA , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
IPC分类号： H01L45/00
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译： 提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。 每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以配置三维存储器 单元格阵列。 存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。 通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。
-
公开(公告)号：US08866123B2
公开(公告)日：2014-10-21
申请号：US13884331
申请日：2010-11-22
IPC分类号： H01L47/00 , H01L45/00 , H01L29/792 , H01L27/24 , H01L29/66 , H01L27/115
CPC分类号： H01L27/2436 , H01L27/1157 , H01L27/11582 , H01L27/2409 , H01L27/2454 , H01L27/2481 , H01L27/249 , H01L29/66833 , H01L29/7926 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/144 , H01L45/1608 , H01L45/1616 , H01L45/1683
摘要： A vertical chain memory includes two-layer select transistors having first select transistors which are vertical transistors arranged in a matrix, and second select transistors which are vertical transistors formed on the respective first select transistors, and a plurality of memory cells connected in series on the two-layer select transistors. With this configuration, the adjacent select transistors are prevented from being selected by respective shared gates, the plurality of two-layer select transistors can be selected, independently, and a storage capacity of a non-volatile storage device is prevented from being reduced.
摘要翻译： 垂直链式存储器包括具有第一选择晶体管的两层选择晶体管，它们是以矩阵形式排列的垂直晶体管，第二选择晶体管是形成在各个第一选择晶体管上的垂直晶体管，以及多个存储单元串联连接 双层选择晶体管。 利用这种配置，防止相邻的选择晶体管被相应的共享栅极选择，可以独立地选择多个两层选择晶体管，并且防止非易失性存储装置的存储容量减小。
-
-
-
-
-
-
-
-
-
搜索结果
25 条记录 (耗时 0.026 秒)
