Abstract:
A liquid discharge device includes a liquid discharge unit that discharges a liquid and a cleaner. The liquid discharge unit has a first end, a second end, and a third end extending in a direction intersecting the first end and the second end. The cleaner moves relative to the liquid discharge unit in a movement direction from the first end toward the second end while contacting the liquid discharge unit with a contact force and a contact pressure. The contact force of the cleaner contacting one of the first end and the second end is smaller than the contact force of the cleaner contacting a portion of the liquid discharge unit other than the first end and the second end.
Abstract:
A liquid discharge apparatus includes a head including a nozzle plate having a plurality of nozzles lined in a row and configured to discharge a liquid, a conveyor configured to convey the liquid application target, and a liquid receptacle configured to receive the liquid discharged from the head. The conveyor defines a conveyance passage of a liquid application target to which the head applies the liquid. The liquid receptacle has an opening through which the liquid discharged from the head passes. A longitudinal direction of the opening is along a movement direction of the liquid application target. A width of the opening is greater than a width of the liquid application target in a direction orthogonal to the movement direction.
Abstract:
An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage,a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.
Abstract:
When it is determined that an engine operating condition is in a high-engine load HCCI range (A2) where an engine load is higher than a specified load X1 within a HCCI range A where a compression self combustion is performed, an after-TDC injection F2s is executed at a point T1 when an internal pressure of a combustion chamber drops below a specified pressure Y after the top dead center of an exhaust stroke during a minus valve overlap period NVO during which intake and exhaust valves are both closed. Then, a main injection F2m as a main injection is executed. Accordingly, any improper detonation or deterioration of NOx emission which may be caused by the compression self-ignition combustion in the range where the engine load is relatively high can be prevented.
Abstract:
A liquid discharge apparatus includes: a liquid discharge head having a discharge face having a nozzle from which a liquid is discharged to a medium; a carriage, to which the liquid discharge head is mountable, and reciprocally movable in a main-scanning direction; a guide supporting the carriage to guide the carriage to move in the main-scanning direction; a cap to contact and seal the discharge face of the liquid discharge head; a suction device connected to the cap; and a cap cleaner, supported and guided by the guide to move in the main-scanning direction, to drop a cleaning liquid to the cap.
Abstract:
An embroidery device includes a needle including a hole through which a thread has been passed, a dyeing unit configured to dye the thread in different colors, an embroidery unit configured to move the needle to perform a sewing process on a medium with the thread dyed in the different colors by the dyeing unit, and a remover configured to remove the linear member in a vicinity of the needle.
Abstract:
An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.
Abstract:
In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.
Abstract:
A tumor marker comprising diacetylspermine, and a method of evaluating the state of a tumor, comprising reacting an antibody to diacetylspermine with a biological sample to thereby detect diacetylspermine and evaluating the state of the tumor using the obtained detection results as an indicator.
Abstract:
An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.