公开(公告)号：US06734551B2

公开(公告)日：2004-05-11

申请号：US10126606

申请日：2002-04-22

申请人： Hiroyuki Yoshihara ,  Kenichi Hayashi ,  Hisashi Kawafuji ,  Mitsugu Tajiri

发明人： Hiroyuki Yoshihara ,  Kenichi Hayashi ,  Hisashi Kawafuji ,  Mitsugu Tajiri

IPC分类号： H01L2310

CPC分类号： H01L23/4334 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Each lead frame for a power chip has one side main surface on which a power chip is mounted and a suspension lead part provided projectingly from a region reserved for forming mold resin in addition to a lead terminal. Thus, the lead frame can be supported by the plurality of suspension lead parts in a molding step. A metal block is provided on the other main surface of the lead frame to face the power chip. Consequently, a semiconductor device with good heat radiation properties and good insulation breakdown voltages can be obtained.

摘要翻译： 用于功率芯片的每个引线框架除了引线端子之外还具有安装有功率芯片的一个侧面主表面和从保留用于形成模制树脂的区域突出设置的悬挂引线部分。 因此，引线框架可以在成型步骤中被多个悬架引线部分支撑。 在引线框架的另一个主表面上设置金属块以面对功率芯片。 因此，可以获得具有良好的散热性能和良好的绝缘击穿电压的半导体器件。

公开(公告)号：US06791167B2

公开(公告)日：2004-09-14

申请号：US10386670

申请日：2003-03-13

申请人： Kenichi Hayashi ,  Hisashi Kawafuji ,  Mitsugu Tajiri ,  Taketoshi Shikano

发明人： Kenichi Hayashi ,  Hisashi Kawafuji ,  Mitsugu Tajiri ,  Taketoshi Shikano

IPC分类号： H01L23495

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A resin-molded device of an aspect of the present invention includes a plurality of electronic elements spaced from each other. It also has a plurality of lead members, each one of the lead members electrically connecting to the corresponding one of the electronic elements. Further, it has a plurality of metal blocks spaced from each other so that a plurality of channel portions are defined between the metal blocks. Each of the metal blocks is arranged so as to correspond to at least one of the electronic elements and the lead members connected to the electronic element. The resin-molded device includes a resin package of electrically insulating material molded so as to hold together the plurality of the electronic elements, the lead members, and the metal blocks. The resin package includes a plurality of resin inlets through which fluid resin is injected, and wherein each of the resin inlets opposes to the corresponding one of the channel portions.

摘要翻译： 本发明的一个方面的树脂模制装置包括彼此间隔开的多个电子元件。 它还具有多个引线构件，每个引线构件电连接到相应的一个电子元件。 此外，它具有彼此间隔开的多个金属块，使得在金属块之间限定多个通道部分。 每个金属块被布置成对应于连接到电子元件的电子元件和引线构件中的至少一个。 树脂模制装置包括模制成将多个电子元件，引线构件和金属块保持在一起的电绝缘材料的树脂封装。 树脂封装包括多个树脂入口，通过该树脂入口注入流体树脂，并且其中每个树脂入口与相应的一个通道部分相对。