公开(公告)号：USD689390S1

公开(公告)日：2013-09-10

申请号：US29415518

申请日：2012-03-12

申请人： Hisanobu Okawa ,  Hiroshi Ishida ,  Yasuyuki Hattori ,  Takashi Nishimizu ,  Hideki Kamimura

设计人： Hisanobu Okawa ,  Hiroshi Ishida ,  Yasuyuki Hattori ,  Takashi Nishimizu ,  Hideki Kamimura

公开(公告)号：US6008025A

公开(公告)日：1999-12-28

申请号：US902632

申请日：1997-07-29

申请人： Hideyuki Komatsubara ,  Masao Kitabayashi ,  Hideki Kamimura ,  Bunsei Kawakami ,  Yoshihisa Kawamura ,  Masahiro Takagi ,  Tadayuki Imanaka

发明人： Hideyuki Komatsubara ,  Masao Kitabayashi ,  Hideki Kamimura ,  Bunsei Kawakami ,  Yoshihisa Kawamura ,  Masahiro Takagi ,  Tadayuki Imanaka

IPC分类号： C12N9/12 ,  C12N15/54 ,  C12Q1/68 ,  C12P19/34

CPC分类号： C12Q1/686 ,  C12N9/1252 ,  C12Q1/6848

摘要： A modified thermostable DNA polymerase having 5% or less of the 3'-5' exonuclease activity of the enzyme before modification and a DNA polymerase composition for amplifying nucleic acid, which comprises the modified thermostable DNA polymerase having 0 to 5% of the 3'-5' exonuclease activity of the enzyme before modification and an unmodified thermostable DNA polymerase having 3'-5' exonuclease activity or a modified thermostable DNA polymerase having 100 to 6% of the 3'-5' exonuclease activity of a thermostable DNA polymerase before modification; a method for amplifying nucleic acid by use of said modified thermostable polymerase or said DNA polymerase composition; and a reagent therefor.

摘要翻译： 一种修饰前的酶的3'5'核酸外切酶活性的5％以下的扩增型热稳定型DNA聚合酶和扩增核酸的DNA聚合酶组合物，其含有3' -5'核酸外切酶活性和具有3'-5'核酸外切酶活性的未修饰的热稳定DNA聚合酶或经热稳定DNA聚合酶的3'-5'核酸外切酶活性的修饰的热稳定DNA聚合酶的100-6％ 修改; 通过使用所述修饰的热稳定聚合酶或所述DNA聚合酶组合物来扩增核酸的方法; 和其试剂。

公开(公告)号：US08776597B2

公开(公告)日：2014-07-15

申请号：US13232589

申请日：2011-09-14

申请人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

发明人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

IPC分类号： G01N27/22 ,  B81B7/00

CPC分类号： G01N27/223 ,  B81B7/0032 ,  G01N27/225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  Y10T29/49007 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

摘要翻译： 提供了一种电容式湿度传感器，其中传感器芯片基板具有静电电容根据湿度变化的传感器部分，静电电容不变的参考部分和作为每个部分的输出端子的多个焊盘， 并且电连接到焊盘并将这些部分之间的电容差输出为电压的IC基板固定到相同的支撑基板，其中形成围绕传感器部分的密封区域的保护构件， 覆盖参考部分，设置在传感器芯片基板上，除了由保护部件覆盖的区域之外，支撑基板被密封树脂​​覆盖，传感器部分在被保护件包围的区域处暴露于空气中 构件，并且其它构成元件被密封树脂​​覆盖。

公开(公告)号：US20120000285A1

公开(公告)日：2012-01-05

申请号：US13232589

申请日：2011-09-14

申请人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

发明人： Satoshi Waga ,  Sumihito Morita ,  Masaru Sakurai ,  Masaya Yamatani ,  Hideki Kamimura

IPC分类号： G01N27/22 ,  G01R3/00

CPC分类号： G01N27/223 ,  B81B7/0032 ,  G01N27/225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  Y10T29/49007 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A capacitive type humidity sensor is provided, where a sensor chip substrate, with a sensor section where electrostatic capacitance changes in accordance with humidity, a reference section where electrostatic capacitance does not change, and a plurality of pads which are output terminals of each section, and an IC substrate, which is electrically connected to the pads and which outputs the difference in capacitance between the sections as a voltage, are fixed to the same support substrate, where a protective member, which forms a sealed region surrounding the sensor section and which covers the reference section, is provided on the sensor chip substrate, the support substrate is covered by a sealing resin except for the region which is covered by the protective member, the sensor section is exposed to air at the region which is surrounded by the protective member, and the other constituent elements are covered by the sealing resin.

摘要翻译： 提供了一种电容式湿度传感器，其中传感器芯片基板具有静电电容根据湿度变化的传感器部分，静电电容不变的参考部分和作为每个部分的输出端子的多个焊盘， 并且电连接到焊盘并将这些部分之间的电容差输出为电压的IC基板固定到相同的支撑基板，其中形成围绕传感器部分的密封区域的保护构件， 覆盖参考部分，设置在传感器芯片基板上，除了由保护部件覆盖的区域之外，支撑基板被密封树脂​​覆盖，传感器部分在被保护件包围的区域处暴露于空气中 构件，并且其它构成元件被密封树脂​​覆盖。

公开(公告)号：US20120000284A1

公开(公告)日：2012-01-05

申请号：US13169918

申请日：2011-06-27

申请人： Shinya Yokoyama ,  Satoshi Waga ,  Atsushi Tondokoro ,  Tadashi Sakashita ,  Hideki Hasegawa ,  Sumihito Morita ,  Hideki Kamimura ,  Masaya Yamatani

发明人： Shinya Yokoyama ,  Satoshi Waga ,  Atsushi Tondokoro ,  Tadashi Sakashita ,  Hideki Hasegawa ,  Sumihito Morita ,  Hideki Kamimura ,  Masaya Yamatani

IPC分类号： G01N27/22 ,  B23P25/00

CPC分类号： G01D11/245 ,  G01N33/0014 ,  Y10T29/4998

摘要： A humidity sensor package includes: a humidity sensor that is mounted on a main surface of a package substrate and that have a humidity-sensing area; a control IC that is mounted on the main surface of the package substrate; a sealing resin that seals at least an external connection portion of the humidity sensor; and a partition member that partitions a sealing area of the sealing resin and the humidity-sensing area from each other so as to expose the humidity-sensing area to an external environment. Here, a first distance in the thickness direction from the package substrate to the top surface of the partition member is smaller than a second distance in the thickness direction from the package substrate to the top surface of the sealing resin.

摘要翻译： 一种湿度传感器包括：湿度传感器，其安装在封装基板的主表面上并具有湿度感测区域; 控制IC，其安装在所述封装基板的主表面上; 至少密封湿度传感器的外部连接部分的密封树脂; 以及分隔构件，其将密封树脂的密封区域和湿度感测区域彼此分隔开，以将湿度感测区域暴露于外部环境。 这里，从封装基板到分隔部件的顶面的厚度方向的第一距离小于从封装基板到密封树脂的顶面的厚度方向的第二距离。

公开(公告)号：USD683634S1

公开(公告)日：2013-06-04

申请号：US29417020

申请日：2012-03-29

申请人： Yasuo Hayakawa ,  Satoshi Waga ,  Hideki Kamimura ,  Masaya Yamatani ,  Motoki Hirayama

设计人： Yasuo Hayakawa ,  Satoshi Waga ,  Hideki Kamimura ,  Masaya Yamatani ,  Motoki Hirayama

公开(公告)号：US5990302A

公开(公告)日：1999-11-23

申请号：US893561

申请日：1997-07-11

申请人： Toshihiro Kuroita ,  Hideki Kamimura ,  Bunsei Kawakami ,  Yoshihisa Kawamura

发明人： Toshihiro Kuroita ,  Hideki Kamimura ,  Bunsei Kawakami ,  Yoshihisa Kawamura

IPC分类号： C12N15/10 ,  C07H21/00 ,  C12N15/00 ,  C12Q1/68

CPC分类号： C12N15/1013

摘要： A method for isolating a ribonucleic acid, which comprises dissolution of a sample containing the ribonucleic acid, such as cells, in an acidic solution containing a lithium salt and a chaotropic agent, bringing the ribonucleic acid into contact with a nucleic acid-binding carrier such as silica particles, thereby to allow selective adsorption of the ribonucleic acid alone onto said carrier, and eluting the ribonucleic acid from the nucleic acid-bound carrier; a reagent therefor; and a method for producing a cDNA from the ribonucleic acid isolated by this method. According to the present invention, a high purity ribonucleic acid can be isolated quickly and safely from a sample containing the ribonucleic acid.

摘要翻译： 一种分离核糖核酸的方法，其包括将含有核糖核酸例如细胞的样品溶解在含有锂盐和离液剂的酸性溶液中，使核糖核酸与核酸结合载体接触，如 作为二氧化硅颗粒，从而允许单核糖核酸选择性吸附到所述载体上，并从核酸结合载体洗脱核糖核酸; 一种试剂; 以及通过该方法分离的核糖核酸产生cDNA的方法。 根据本发明，可以从含有核糖核酸的样品中快速，安全地分离出高纯度的核糖核酸。