公开(公告)号：US10966355B2

公开(公告)日：2021-03-30

申请号：US16686310

申请日：2019-11-18

Applicant: Hitachi, Ltd.

Inventor： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/473 ,  H01L25/07 ,  H02M7/00 ,  H01L23/367 ,  H01L23/492 ,  H01L23/495 ,  H05K1/02 ,  B60L15/00 ,  H01L23/31 ,  H01L23/00 ,  H02M7/537 ,  H02P27/06 ,  B60L50/51 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

公开(公告)号：US10524398B2

公开(公告)日：2019-12-31

申请号：US15483630

申请日：2017-04-10

Applicant: Hitachi, Ltd.

Inventor： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/473 ,  H01L25/07 ,  H02M7/00 ,  H01L23/367 ,  H01L23/492 ,  H01L23/495 ,  H05K1/02 ,  B60L15/00 ,  H01L23/31 ,  H01L23/00 ,  H02M7/537 ,  H02P27/06 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L50/51

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

公开(公告)号：US10044220B2

公开(公告)日：2018-08-07

申请号：US14702936

申请日：2015-05-04

Applicant: Hitachi, Ltd.

Inventor： Yuichiro Konishi ,  Atsuo Nishihara ,  Keisuke Horiuchi

IPC: H02J7/00 ,  H02J9/00 ,  H02J9/06 ,  H01F37/00

Abstract: When the power is normally supplied from the commercial power supply, the storage battery is charged by reducing the DC voltage by the charge/discharge chopper. The switching unit is provided in the previous stage of the converter. When the commercial power supply is in an abnormal state, the three-phase AC converter is operated as three discharge choppers connected in parallel by supplying the power of the storage battery to the converter and boosting the power by the switching element included in the converter. The power of the storage battery is boosted by the charge/discharge chopper, and a part of the discharging power is supplied. One three-phase AC reactor is provided in the previous stage of the converter, and the three-phase AC reactor has three coils, magnetic leg iron cores having the coils winding around them, and one leg without a coil winding around it connected in parallel.

公开(公告)号：US08917509B2

公开(公告)日：2014-12-23

申请号：US13788805

申请日：2013-03-07

Applicant: Hitachi, Ltd.

Inventor： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC: H05K7/20 ,  H02M7/00 ,  H01L23/36 ,  H01L25/07 ,  H01L23/473

CPC classification number: H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract translation: 电力转换装置包括形成冷却水通道的通道壳体; 具有逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。 半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括直流 正极端子，直流负极端子和向外部突出的交流端子。 通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

公开(公告)号：US09013877B2

公开(公告)日：2015-04-21

申请号：US13689299

申请日：2012-11-29

Applicant: Hitachi, Ltd.

Inventor： Yu Harubeppu ,  Takayuki Kushima ,  Yasuhiro Nemoto ,  Keisuke Horiuchi ,  Hisashi Tanie

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/42 ,  H01L23/473

CPC classification number: H01L23/34 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract translation: 本发明的目的是提供一种重量轻，散热效率高，刚性高的功率半导体装置。 功率半导体器件包括基底1，布置在基底1上的半导体电路2和冷却翅片3，其冷却每个半导体电路2，其中一个或多个突出部分1a，1b形成在基座1上 突出部分1a，1b在平行于基底1表面的方向上的宽度比基体1的厚度长，从而提供功率半导体器件100,200,300,400，其具有重量轻，散热效率高 ，高刚性。

公开(公告)号：US09648791B2

公开(公告)日：2017-05-09

申请号：US14822446

申请日：2015-08-10

Applicant: Hitachi, Ltd.

Inventor： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC: H02M7/00 ,  H05K7/20 ,  H01L23/36 ,  H01L23/473 ,  H01L25/07 ,  H01L23/367 ,  H01L23/492 ,  H01L23/495 ,  H05K1/02

CPC classification number: H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

公开(公告)号：US09137932B2

公开(公告)日：2015-09-15

申请号：US14686375

申请日：2015-04-14

Applicant: Hitachi, Ltd.

Inventor： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract translation: 电力转换装置包括形成冷却水通道的通道壳体; 具有逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。 半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括直流 正极端子，直流负极端子和向外部突出的交流端子。 通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

公开(公告)号：US09042101B2

公开(公告)日：2015-05-26

申请号：US14546458

申请日：2014-11-18

Applicant: Hitachi, Ltd.

Inventor： Takeshi Tokuyama ,  Kinya Nakatsu ,  Ryuichi Saito ,  Keisuke Horiuchi ,  Toshiya Satoh ,  Hideki Miyazaki

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/473 ,  H01L23/492 ,  H01L23/495 ,  H02M7/00 ,  H05K1/02

CPC classification number: H05K7/20927 ,  B60K6/26 ,  B60K6/28 ,  B60K6/46 ,  B60K17/16 ,  B60L11/1803 ,  B60L15/007 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2240/429 ,  B60Y2200/92 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/473 ,  H01L23/492 ,  H01L23/49517 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/40137 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1203 ,  H01L2924/13055 ,  H02M7/003 ,  H02M7/537 ,  H02P27/06 ,  H05K1/0262 ,  H05K7/2089 ,  Y10S903/906 ,  Y10S903/907 ,  Y10S903/909 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

公开(公告)号：US11211881B2

公开(公告)日：2021-12-28

申请号：US16962308

申请日：2018-10-15

Applicant: HITACHI, LTD.

Inventor： Keisuke Horiuchi ,  Kiyoshi Nakata ,  Noriyoshi Urushiwara ,  Shuichi Terakado ,  Kiyoshi Terasawa

IPC: H02M7/5387 ,  B60L9/18 ,  B60L9/24 ,  H02M1/32 ,  H02M5/458 ,  H02M7/00 ,  H05K7/20 ,  H05K7/10

Abstract: A power conversion device achieves size reduction and reliability by reducing the number of components of the system. The power conversion device has a semiconductor module of a half-bridge configuration in which two semiconductor elements are arranged in series. The semiconductor module has a cuboidal shape and has, along a longitudinal direction thereof, a positive pole terminal, a negative pole terminal, and terminals for inputting or outputting alternating current or for forming a single phase of the power conversion device. In the vertical direction corresponding to a widthwise direction of the cuboid, a plurality of the semiconductor modules are arranged vertically, forming a plurality of phases of the power conversion device. The semiconductor modules of the plurality of phases are installed in contact with a cooling unit, and one or more capacitors are disposed so as to face the cooling unit across the semiconductor modules of the plurality of phases.

公开(公告)号：US20130135824A1

公开(公告)日：2013-05-30

申请号：US13689299

申请日：2012-11-29

Applicant: Hitachi, Ltd.

Inventor： Yu Harubeppu ,  Takayuki Kushima ,  Yasuhiro Nemoto ,  Keisuke Horiuchi ,  Hisashi Tanie

IPC: H01L23/34 ,  H01L23/42

CPC classification number: H01L23/34 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.

Abstract translation: 本发明的目的是提供一种重量轻，散热效率高，刚性高的功率半导体装置。 功率半导体器件包括基底1，布置在基底1上的半导体电路2和冷却翅片3，其冷却每个半导体电路2，其中一个或多个突出部分1a，1b形成在基座1上 突起部分1a，1b在平行于基底1表面的方向上的宽度比基体1的厚度长，从而提供功率半导体器件100,200,300,400，其具有重量轻，散热效率高 ，高刚性。