利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

5 条记录 (耗时 0.025 秒)

    Semiconductor device and a method of manufacturing the same
    2.
    发明申请
    Semiconductor device and a method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20020102771A1

    公开(公告)日：2002-08-01

    申请号：US10108483

    申请日：2002-03-29

    申请人： Hitachi, Ltd. and Hitachi Yonezawa Electronics Co. , Ltd.

    发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

    IPC分类号： H01L021/48

    CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a. In the manufacture method, the sealing body 3 is polished, after resin-molded, at its back face 3a with a brush to form the two widthwise edge portions, as exposed from the back face 3a of the sealing body 3, of the lead 1a into rounded faces, and the mounted face 1d of the lead 1a including the rounded faces is protruded at its central portion from the back face 3a of the sealing body 3 thereby to improve the connection reliability at the packaging time.

    摘要翻译： 为了提高封装半导体器件时的连接可靠性，并且在半导体器件制造方法中使得方法管理变得容易。 半导体装置包括：用于支撑半导体芯片2的桶1e; 通过用树脂密封半导体芯片2形成的密封体3; 多个由铜合金制成的引线1a，暴露于密封体3的背面3a，并且在暴露的安装面1d上具有焊接层8; 以及用于连接半导体芯片2的焊盘2a和相应引线1a的导线4。 在制造方法中，密封体3在树脂模制后用刷子在其背面3a上被抛光，以形成从密封体3的背面3a露出的两个横向边缘部分，引线1a 包括圆形面的引线1a的安装面1d在其中心部分从密封体3的背面3a突出，从而提高包装时的连接可靠性。

    Semiconductor device and a method of manufacturing the same
    3.
    发明申请
    Semiconductor device and a method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号：US20040058479A1

    公开(公告)日：2004-03-25

    申请号：US10669564

    申请日：2003-09-25

    申请人： Hitachi, Ltd. ,  Hitachi Yonezawa Electronics Co., Ltd.

    发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

    IPC分类号： H01L021/44 ,  H01L021/48 ,  H01L021/50

    CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a. In the manufacture method, the sealing body 3 is polished, after resin-molded, at its back face 3a with a brush to form the two widthwise edge portions, as exposed from the back face 3a of the sealing body 3, of the lead 1a into rounded faces, and the mounted face 1d of the lead 1a including the rounded faces is protruded at its central portion from the back face 3a of the sealing body 3 thereby to improve the connection reliability at the packaging time.

    摘要翻译： 为了提高封装半导体器件时的连接可靠性，并且在半导体器件制造方法中使得方法管理变得容易。 半导体装置包括：用于支撑半导体芯片2的桶1e; 通过用树脂密封半导体芯片2形成的密封体3; 多个由铜合金制成的引线1a，暴露于密封体3的背面3a，并且在暴露的安装面1d上具有焊接层8; 以及用于连接半导体芯片2的焊盘2a和相应引线1a的导线4。 在制造方法中，密封体3在树脂模制后用刷子在其背面3a上被抛光，以形成从密封体3的背面3a露出的两个横向边缘部分，引线1a 包括圆形面的引线1a的安装面1d在其中心部分从密封体3的背面3a突出，从而提高包装时的连接可靠性。

    Semiconductor device and a method of manufacturing the same
    5.
    发明申请
    Semiconductor device and a method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号：US20020106836A1

    公开(公告)日：2002-08-08

    申请号：US10108439

    申请日：2002-03-29

    申请人： Hitachi, Ltd.

    发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

    IPC分类号： H01L021/44

    CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： To improve the connection reliability at the time of packaging a semiconductor device and to make the method management easy in a semiconductor device manufacturing method. The semiconductor device comprises: a tub 1e for supporting a semiconductor chip 2; a sealing body 3 formed by sealing the semiconductor chip 2 with a resin; a plurality of leads 1a made of a copper alloy, exposed to the back face 3a of the sealing body 3, and having a soldered layer 8 on the exposed mounted face 1d; and wires 4 for connecting the pads 2a of the semiconductor chip 2 and the corresponding leads 1a. In the manufacture method, the sealing body 3 is polished, after resin-molded, at its back face 3a with a brush to form the two widthwise edge portions, as exposed from the back face 3a of the sealing body 3, of the lead la into rounded faces, and the mounted face 1d of the lead la including the rounded faces is protruded at its central portion from the back face 3a of the sealing body 3 thereby to improve the connection reliability at the packaging time.

    摘要翻译： 为了提高封装半导体器件时的连接可靠性，并且在半导体器件制造方法中使得方法管理变得容易。 半导体装置包括：用于支撑半导体芯片2的桶1e; 通过用树脂密封半导体芯片2形成的密封体3; 多个由铜合金制成的引线1a，暴露于密封体3的背面3a，并且在暴露的安装面1d上具有焊接层8; 以及用于连接半导体芯片2的焊盘2a和相应引线1a的导线4。 在制造方法中，密封体3在树脂模制后用刷子在其背面3a处被抛光，以形成从密封体3的背面3a露出的两个横向边缘部分的引线1a 并且包括圆形面的引线1a的安装面1d在其中心部分处从密封体3的背面3a突出，从而提高包装时的连接可靠性。