公开(公告)号：US20030205797A1

公开(公告)日：2003-11-06

申请号：US10453606

申请日：2003-06-04

申请人： Hitachi, Ltd. ,  Hitachi ULSI Systems Co., Ltd. ,  Hitachi Yonezawa Electronics Co., Ltd.

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： H01L021/44 ,  H01L023/02 ,  H01L023/52

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

公开(公告)号：US20030153127A1

公开(公告)日：2003-08-14

申请号：US10342238

申请日：2003-01-15

申请人： Hitachi, Ltd. Hitachi ULSI Systems Co., Ltd.

发明人： Takashi Wada ,  Kazunari Suzuki ,  Chuichi Miyazaki ,  Toshihiro Shiotsuki ,  Tomoko Higashino

IPC分类号： H01L021/44

CPC分类号： H01L24/83 ,  H01L23/3128 ,  H01L23/3164 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/75 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68336 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/13111 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Techniques are provided for preventing occurrence of damage to the top surface of a semiconductor chip at the time of die bonding the semiconductor chip by use of a contact collet. A protection tape is pasted to the top surface of the semiconductor chip before die bonding of the semiconductor chip is executed by pressing the back surface (underside) of the semiconductor chip sucked and securely held by the contact collect against respective chip-mounting regions of a multi-wiring board. The contact collect is, for example, substantially cylindrical in outside shape, and a bottom part (suction head) thereof is made of a soft synthetic rubber, and so forth. The protection tape pasted to pasted to the top surface of the semiconductor chip can prevent the top surface of the semiconductor chip from coming in direct contact with the contact collet even at the time of vacuum suction by pressing the suction head of the contact collect against the top surface of the semiconductor chip.

摘要翻译： 提供技术来防止在使用接触夹头芯片接合半导体芯片时对半导体芯片的顶表面造成的损坏。 将半导体芯片的裸片接合之前，通过将被触点收集并牢固地保持的半导体芯片的背面（下侧）按压到相应的芯片安装区域，将保护带粘贴到半导体芯片的顶表面 多线路板 接触收集体例如是大致圆筒形的外形，其底部（吸头）由软质合成橡胶制成，等等。 粘贴到半导体芯片顶表面上的保护胶带可以防止半导体芯片的顶表面甚至在真空抽吸时直接与接触夹头接触，通过将接触件的吸头压靠 半导体芯片的顶面。

公开(公告)号：US20040197959A1

公开(公告)日：2004-10-07

申请号：US10825678

申请日：2004-04-16

申请人： Renesas Technology Corp. ,  Hitachi ULSI Systems Co., Ltd.

发明人： Mikako Ujiie ,  Michiaki Sugiyama ,  Kazunari Suzuki ,  Masachika Masuda ,  Tamaki Wada

IPC分类号： H01L021/48

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A method of manufacturing a semiconductor device, comprises providing a wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film. A semiconductor chip is adhesively fixed to the insulating film. Conductive wires connect the electrodes on the main surface of the wiring substrate and electrodes on the chip. A groove is formed between the chip and the electrodes on the substrate. A protruding portion of the adhesive stays within the groove and does not reach the electrodes on the substrate.

摘要翻译： 一种制造半导体器件的方法，包括提供具有主表面，形成在主表面上的绝缘膜和形成在主表面上的电极以从绝缘膜暴露的布线基板。 半导体芯片粘接固定在绝缘膜上。 导电线将布线基板的主表面上的电极和芯片上的电极连接起来。 在芯片和基板上的电极之间形成凹槽。 粘合剂的突出部分停留在凹槽内并且不会到达基底上的电极。

公开(公告)号：US20040164428A1

公开(公告)日：2004-08-26

申请号：US10784276

申请日：2004-02-24

申请人： Renesas Technology Corp. ,  Hitachi ULSI System Co., Ltd. ,  Hitachi Yonezawa Electronics Co., Ltd.

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： H01L023/48

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

摘要翻译： 将其上安装有多个半导体芯片的带状基板的背面真空吸附到模具的下半模，并且在该状态下，多个半导体芯片同时用树脂密封以形成密封构件。 此后，带状基板和密封构件从模具中释放并切割成多个半导体器件。 由此获得的半导体器件的安装可靠性得到改善。

公开(公告)号：US20030052419A1

公开(公告)日：2003-03-20

申请号：US10225163

申请日：2002-08-22

申请人： Hitachi, Ltd.

发明人： Mikako Ujiie ,  Michiaki Sugiyama ,  Kazunari Suzuki ,  Masachika Masuda ,  Tamaki Wada

IPC分类号： H01L023/48

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a semiconductor chip fixed through an adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the semiconductor chip with each other, and a seal member, i.e., a package, which covers the semiconductor chip, the main surface of the wiring substrate and the electrodes, wherein a groove is formed between the semiconductor chip and the electrodes and the seal member and the wiring substrate have side faces cut by dicing. A protruding portion of the adhesive (an insulating resin) stays within the groove without getting over the groove and does not reach the electrodes. The groove is formed by removing the insulating film partially in the full depth direction of the film so as to extend through the film.

摘要翻译： 在半导体器件的制造中，通过采用通过粘合剂将半导体芯片固定在布线基板上的嵌段成型方法，可以防止由粘合剂流出而引起的缺陷的发生。 根据本发明的半导体器件包括布线基板，具有主表面的布线基板，形成在主表面上的绝缘膜，以及形成在主表面上以从绝缘膜露出的电极，半导体芯片 通过粘合剂固定在形成在布线基板的主表面上的绝缘膜上，用于将布线基板的主表面上的电极和半导体芯片上的电极彼此连接的导线，以及密封件 封装，其覆盖半导体芯片，布线基板的主表面和电极，其中在半导体芯片和电极之间形成凹槽，并且密封构件和布线基板具有通过切割切割的侧面。 粘合剂（绝缘树脂）的突出部分保持在槽内而不越过槽并且不会到达电极。 通过在膜的整个深度方向上部分地去除绝缘膜以便延伸穿过膜而形成凹槽。