利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

23 条记录 (耗时 0.021 秒)

    Fuse and fuse production method
    2.
    发明授权
    Fuse and fuse production method 失效
    保险丝和保险丝的生产方法

    公开(公告)号：US06917277B2

    公开(公告)日：2005-07-12

    申请号：US10368394

    申请日：2003-02-20

    申请人： Hitoshi Ohashi ,  Tatsuya Kato ,  Hitoshi Ushijima ,  Hiroyo Ayuzawa

    发明人： Hitoshi Ohashi ,  Tatsuya Kato ,  Hitoshi Ushijima ,  Hiroyo Ayuzawa

    IPC分类号： H01H85/041 ,  H01H85/055 ,  H01H85/10 ,  H01H85/11 ,  H01H85/06

    CPC分类号： H01H85/055 ,  H01H85/0417 ,  H01H85/10 ,  H01H85/11 ,  Y10T29/49107

    摘要： The invention is to offer a fuse and a fuse production method excellent in reducing manufacturing cost. A fuse having an electrically conductive fuse element. The fuse element has a pair of terminal connection portions and a fusible member for electrically connecting the terminal connection portions to each other and for being fused and broken when an overload electric current flows. At least a part of the fusible portion is formed by spouting or dropping the melting metal drops.

    摘要翻译： 本发明是提供一种在降低制造成本方面优异的保险丝和保险丝制造方法。 具有导电保险丝元件的保险丝。 保险丝元件具有一对端子连接部和用于将端子连接部彼此电连接并且在过载电流流动时被熔断和断开的可熔部件。 通过喷射或滴落熔融金属液滴形成熔融部分的至少一部分。

    Method for forming electrical circuit by jetting molten metal
    3.
    发明授权
    Method for forming electrical circuit by jetting molten metal 有权
    通过喷射熔融金属形成电路的方法

    公开(公告)号：US07833567B2

    公开(公告)日：2010-11-16

    申请号：US10047992

    申请日：2002-01-17

    申请人： Hitoshi Ohashi ,  Kinya Horibe ,  Hitoshi Ushijima ,  Tatsuya Kato

    发明人： Hitoshi Ohashi ,  Kinya Horibe ,  Hitoshi Ushijima ,  Tatsuya Kato

    IPC分类号： B05D5/12 ,  C23C16/52

    CPC分类号： B60R16/0215 ,  H05K1/0284 ,  H05K3/10 ,  H05K3/125 ,  H05K2203/128

    摘要： The apparatus forms an electric circuit on a construction member of a machine based on a set of three-dimensional data. The data defines a position and a profile of the construction member, a position of the electric circuit, and a shape of the electric circuit. The electric circuit is used for electrical connection between electric instruments mounted on the machine. The data is associated with a reference coordinate system provided in the machine, and the data includes coordinates of points for determining arrangement of the electric circuit, a distance between any two of the points adjacent to each other, and a cross-sectional area of the electric circuit associated extended between the two points. The apparatus has a storage means for storing the data, a jet means for jetting a molten metal, a first transfer means for moving the construction member relative to the jet means, and a control means for jetting the molten metal against the construction member to deposit the molten metal and for controlling the relative movement between the construction member and the jet means based on the data. The jet means can jet the molten metal against the construction member so that the molten metal can be deposited on a surface of the construction member to form the electric circuit on the construction member.

    摘要翻译： 该装置基于一组三维数据在机器的构造构件上形成电路。 数据定义了构造构件的位置和轮廓，电路的位置以及电路的形状。 电路用于安装在机器上的电子仪器之间的电气连接。 该数据与机器中提供的参考坐标系相关联，并且数据包括用于确定电路布置的点的坐标，彼此相邻的任何两个点之间的距离，以及横截面积 电路相关联的两点之间延伸。 该装置具有用于存储数据的存储装置，用于喷射熔融金属的喷射装置，用于使建筑构件相对于喷射装置移动的第一传送装置，以及用于将熔融金属喷射到建筑构件以沉积的控制装置 熔融金属，并且用于基于数据控制构造构件和喷射装置之间的相对运动。 喷射装置可以将熔融金属喷射到构造构件上，使得熔融金属可以沉积在构造构件的表面上以在构造构件上形成电路。

    Multi-function rotary vehicle switch mounted to a fixed stalk
    5.
    发明授权
    Multi-function rotary vehicle switch mounted to a fixed stalk 失效
    多功能旋转车开关安装在固定杆上

    公开(公告)号：US06774323B2

    公开(公告)日：2004-08-10

    申请号：US10252186

    申请日：2002-09-23

    申请人： Hitoshi Ohashi ,  Gerald O. Morrison ,  Bruce Banter ,  Brent A. Kuhn

    发明人： Hitoshi Ohashi ,  Gerald O. Morrison ,  Bruce Banter ,  Brent A. Kuhn

    IPC分类号： H01H900

    CPC分类号： B60Q1/1476 ,  H01H21/22 ,  H01H25/00 ,  Y10T74/20256

    摘要： A switch assembly for a vehicle includes a stalk and a rotary switch. The stalk is fixed at one end to a steering column. The rotary switch is connected at one end to the other end of the stalk. The rotary switch is rotatable about a pivot axis normal to the other end of the stalk for switching between different rotary switch positions each associated with a respective vehicle control function. A rotatable knob may be connected to the other end of the rotary switch. The rotatable knob is rotatable about a rotational axis normal to the pivot axis of the rotary switch for switching between different rotatable knob positions each associated with a respective vehicle control function. The rotary switch may include control buttons each associated with a respective vehicle control function.

    摘要翻译： 用于车辆的开关组件包括杆和旋转开关。 秸秆一端固定在转向柱上。 旋转开关的一端连接到杆的另一端。 旋转开关可以绕垂直于杆的另一端的枢转轴线旋转，以在各自与各个车辆控制功能相关联的不同旋转开关位置之间切换。 旋转旋钮可以连接到旋转开关的另一端。 可旋转旋钮可绕旋转开关的枢转轴线旋转的旋转轴线旋转，以在各个与各自的车辆控制功能相关联的不同可旋转旋钮位置之间切换。 旋转开关可以包括各自与各个车辆控制功能相关联的控制按钮。

    Surface-protecting sheet and semiconductor wafer lapping method
    6.
    发明授权
    Surface-protecting sheet and semiconductor wafer lapping method 有权
    表面保护片和半导体晶片研磨方法

    公开(公告)号：US07438631B2

    公开(公告)日：2008-10-21

    申请号：US10575510

    申请日：2004-10-14

    申请人： Koichi Nagamoto ,  Hitoshi Ohashi ,  Kazuhiro Takahashi

    发明人： Koichi Nagamoto ,  Hitoshi Ohashi ,  Kazuhiro Takahashi

    IPC分类号： B24B1/00

    CPC分类号： B24B37/34 ,  B24B37/042 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/304 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.

    摘要翻译： 本发明的目的是提供一种表面保护片和用于研磨半导体晶片的方法，即使没有形成任何凹坑，也不会发生晶片的断裂和结垢，即使当具有高凸点的晶片 高度密集地被研磨成非常小的厚度，此外，在剥离表面保护片之后，在凸块的根部处不留下粘合剂。 本发明的表面保护片用于研磨半导体晶片的背面，并且在表面保护片中，基片的一个表面设置有直径小于半导体晶片的外径的开口部 在所述开口部分上没有形成粘合剂层，以及设置在开口部分周围并且形成有粘合剂层的部分。

    Surface-protecting sheet and semiconductor wafer lapping method
    7.
    发明申请
    Surface-protecting sheet and semiconductor wafer lapping method 有权
    表面保护片和半导体晶片研磨方法

    公开(公告)号：US20070066184A1

    公开(公告)日：2007-03-22

    申请号：US10575510

    申请日：2004-10-14

    申请人： Koichi Nagamoto ,  Hitoshi Ohashi ,  Kazuhiro Takahashi

    发明人： Koichi Nagamoto ,  Hitoshi Ohashi ,  Kazuhiro Takahashi

    IPC分类号： B24B7/30

    CPC分类号： B24B37/34 ,  B24B37/042 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/304 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly densely arranged is ground to an extremely small thickness, and besides, no adhesive is left at the roots of the bumps after the surface protective sheet is peeled. The surface protective sheet of the invention is used for grinding a back surface of a semiconductor wafer, and in the surface protective sheet, one surface of a base sheet is provided with an opening portion having a diameter smaller than an outer diameter of a semiconductor wafer to be stuck, on said opening portion no adhesive layer being formed, and a portion which is provided around the opening portion and on which an adhesive layer is formed.

    摘要翻译： 本发明的目的是提供一种表面保护片和用于研磨半导体晶片的方法，即使没有形成任何凹坑，也不会发生晶片的断裂和结垢，即使当具有高凸起的晶片 高度密集地被研磨成非常小的厚度，此外，在剥离表面保护片之后，在凸块的根部处不留下粘合剂。 本发明的表面保护片用于研磨半导体晶片的背面，并且在表面保护片中，基片的一个表面设置有直径小于半导体晶片的外径的开口部 在所述开口部分上没有形成粘合剂层，以及设置在开口部分周围并且形成有粘合剂层的部分。

    Method of manufacturing optical element
    8.
    发明授权
    Method of manufacturing optical element 失效
    制造光学元件的方法

    公开(公告)号：US5843321A

    公开(公告)日：1998-12-01

    申请号：US229664

    申请日：1994-04-19

    申请人： Yasuhiro Kamihara ,  Hitoshi Ohashi ,  Ayami Imamura

    发明人： Yasuhiro Kamihara ,  Hitoshi Ohashi ,  Ayami Imamura

    IPC分类号： B29D11/00 ,  C03C15/00 ,  C03C17/06 ,  C03C17/25 ,  C03C17/32 ,  G02B3/02 ,  G02B5/18

    CPC分类号： C03C17/06 ,  C03C15/00 ,  C03C17/25 ,  C03C17/32 ,  G02B5/1852 ,  G02B5/1857 ,  C03C2218/113 ,  C03C2218/328

    摘要： Methods of manufacturing optical elements such as diffraction type lenses, aspherical lenses and diffraction gratings are disclosed. Deposited on a glass substrate is a workpiece film made of a material which can be machined much more easily than the substrate. Then the workpiece film is machined to form a predetermined shape or contour therein. After forming the predetermined shape or contour in the workpiece film, the workpiece film and substrate are subjected to etching to duplicate the predetermined shape or contour formed in the workpiece film into the substrate.

    摘要翻译： 公开了衍射型透镜，非球面透镜和衍射光栅等光学元件的制造方法。 沉积在玻璃基板上的是由能够比基板更容易加工的材料制成的工件薄膜。 然后将工件膜加工成在其中形成预定的形状或轮廓。 在工件薄膜中形成预定的形状或轮廓之后，对工件薄膜和基底进行蚀刻，将在工件薄膜中形成的预定形状或轮廓复制到基底中。

    Diffractive optical element and optical system including the same
    9.
    发明授权
    Diffractive optical element and optical system including the same 失效
    衍射光学元件和包括其的光学系统

    公开(公告)号：US5737125A

    公开(公告)日：1998-04-07

    申请号：US555222

    申请日：1995-10-31

    申请人： Hitoshi Ohashi

    发明人： Hitoshi Ohashi

    IPC分类号： G02B5/18 ,  G02B5/22 ,  G02B13/14

    CPC分类号： G02B5/1876

    摘要： An optical system for use in a relatively wide wavelength range including a plurality of diffractive optical elements whose diffraction efficiencies are optimized for different wavelengths within said predetermined wavelength range. A diffractive optical element for use in a wide wavelength range includes a light transmissive substrate having a plurality of surface regions and a plurality of surface relief diffractive gratings are formed in said surface regions such that diffraction efficiencies of these gratings are optimized for different wavelengths within said predetermined wavelength range. A diffractive optical element is formed by a single optical element having a light transmissive substrate which reveals a given spectral transmittance and a surface relief diffractive grating formed in a surface of said substrate such that a wavelength dependency of said grating provides a desired spectral transmittance together with said spectral transmittance of the substrate.

    摘要翻译： 一种在比较宽的波长范围内使用的光学系统，包括多个衍射光学元件，其衍射效率针对所述预定波长范围内的不同波长进行优化。 用于宽波长范围的衍射光学元件包括具有多个表面区域的透光基板，并且在所述表面区域中形成多个表面起伏衍射光栅，使得这些光栅的衍射效率针对所述表面区域内的不同波长进行了优化 预定波长范围。 衍射光学元件由具有透光基板的单个光学元件形成，其透射给定的光谱透射率，以及形成在所述基板的表面中的表面起伏衍射光栅，使得所述光栅的波长依赖性与 所述基板的所述光谱透射率。