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公开(公告)号:US08114303B2
公开(公告)日:2012-02-14
申请号:US12397923
申请日:2009-03-04
申请人: Ho Joon Park , Byeung Gyu Chang , Hee Ju Son , Sang Jin Kim
发明人: Ho Joon Park , Byeung Gyu Chang , Hee Ju Son , Sang Jin Kim
IPC分类号: H01B13/00
CPC分类号: G01R3/00 , G01R1/06727
摘要: Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.
摘要翻译: 提供一种制造陶瓷探针卡的方法。 制备具有多个陶瓷生片的陶瓷层叠体和形成在多个陶瓷生片中的导电通孔和导电线的层间电路。 然后,通过在陶瓷层叠体上选择性地除去多个具有陶瓷粉末和感光性有机成分的感光陶瓷片而形成与层间电路连接的至少一个探针插脚结构,并且通过在 多个感光陶瓷片已被去除。 然后,通过同时烧制陶瓷层叠体和感光陶瓷片,并且通过除去感光陶瓷片来提供具有至少一个探针引脚结构的陶瓷基片。
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公开(公告)号:US20100116676A1
公开(公告)日:2010-05-13
申请号:US12502652
申请日:2009-07-14
申请人: Sang Jin Kim , Byeung Gyu Chang , Hee Ju Son , Ho Joon Park
发明人: Sang Jin Kim , Byeung Gyu Chang , Hee Ju Son , Ho Joon Park
IPC分类号: C25D5/02
摘要: Provided is a method of fabricating a probe pin. In the method, a concave region for a probe pin is formed on a mold substrate. The surface roughness of the concave region is reduced to smooth the surface of the concave region. A release layer is formed on the surface of the concave region of the mold substrate. A plating process is performed to form a probe pin corresponding to the concave region. After the performing of the plating process, the mold substrate having the probe pin is disposed on a circuit substrate and the probe pin is connected to a desired portion of the circuit substrate. Thereafter, the mold substrate is separated from the probe pin in such a way that the mold substrate remains unchanged. Also, the separated mold substrate may be reused.
摘要翻译: 提供了一种制造探针的方法。 在该方法中,在模具基板上形成用于探针的凹部。 凹区域的表面粗糙度减小以使凹面的表面平滑。 剥离层形成在模具基板的凹部的表面上。 进行电镀处理以形成与凹区对应的探针。 在进行电镀处理之后,具有探针的模具基板设置在电路基板上,探针连接到电路基板的期望部分。 此后,将模具基板与探针分离,使得模具基板保持不变。 而且,分离的模具基板可以重复使用。
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公开(公告)号:US20100039129A1
公开(公告)日:2010-02-18
申请号:US12364829
申请日:2009-02-03
申请人: Ho Joon Park , Byeung Gyu Chang , Sang Jin Kim , Hee Ju Son
发明人: Ho Joon Park , Byeung Gyu Chang , Sang Jin Kim , Hee Ju Son
CPC分类号: G01R1/07342 , G01R1/06727 , G01R3/00
摘要: Provided is a probe card. The probe card includes a ceramic substrate including a signal line, and a plurality of probe pins formed on the ceramic substrate, and including probe bodies having one end connected to the signal line and probe tips formed at other end of the probe body. The probe body is divided into a first section adjacent to the signal line and second section adjacent the probe tips. The first section is united by an insulating support, and the second sections are divergently arranged to position the probe tips at different measurement regions, respectively.
摘要翻译: 提供探针卡。 探针卡包括陶瓷基板,其包括信号线和形成在陶瓷基板上的多个探针,并且包括一端连接到信号线的探针体和形成在探针本体的另一端的探针尖端。 探针体被分成与信号线相邻的第一部分和与探针尖端相邻的第二部分。 第一部分通过绝缘支撑结合在一起,第二部分分别布置成将探头尖端分别放置在不同的测量区域。
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公开(公告)号:US20100040984A1
公开(公告)日:2010-02-18
申请号:US12350746
申请日:2009-01-08
申请人: Young Ho Cho , Yoon Ji Kim , Ho Joon Park , Young Soo Oh , Hee Ju Son , Byeung Gyu Chang , Sang Jin Kim
发明人: Young Ho Cho , Yoon Ji Kim , Ho Joon Park , Young Soo Oh , Hee Ju Son , Byeung Gyu Chang , Sang Jin Kim
CPC分类号: B81C1/00238 , B81B2203/0118 , B81B2207/017 , B81C2201/019 , Y10T156/10
摘要: A method of manufacturing a micro electro-mechanical component having a three-dimensional structure includes preparing a conductive substrate, selectively insulating or removing the conductive substrate to form a functional structure for performing a desired electro-mechanical function, forming a plated structure serving as an electrical connection portion on at least one surface of the functional structure, and mounting the functional structure on a circuit substrate so that the electrical connection portion is connected to a circuit pattern of the circuit substrate.
摘要翻译: 制造具有三维结构的微电子机械部件的方法包括制备导电基板,选择性地绝缘或去除导电基板以形成用于执行所需电机功能的功能结构,形成用作 在所述功能结构的至少一个表面上的电连接部分,并且将所述功能结构安装在电路基板上,使得所述电连接部分连接到所述电路基板的电路图案。
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公开(公告)号:US20100032407A1
公开(公告)日:2010-02-11
申请号:US12397923
申请日:2009-03-04
申请人: Ho Joon Park , Byeung Gyu Chang , Hee Ju Son , Sang Jin Kim
发明人: Ho Joon Park , Byeung Gyu Chang , Hee Ju Son , Sang Jin Kim
IPC分类号: B44C1/22
CPC分类号: G01R3/00 , G01R1/06727
摘要: Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.
摘要翻译: 提供一种制造陶瓷探针卡的方法。 制备具有多个陶瓷生片的陶瓷层叠体和形成在多个陶瓷生片中的导电通孔和导电线的层间电路。 然后,通过在陶瓷层叠体上选择性地除去多个具有陶瓷粉末和感光性有机成分的感光陶瓷片而形成与层间电路连接的至少一个探针插脚结构,并且通过在 多个感光陶瓷片已被去除。 然后,通过同时烧制陶瓷层叠体和感光陶瓷片,并且通过除去感光陶瓷片来提供具有至少一个探针引脚结构的陶瓷基片。
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公开(公告)号:US20130081450A1
公开(公告)日:2013-04-04
申请号:US13363955
申请日:2012-02-01
申请人: Hee Ju Son , Sang Youl Jeon , Sang Jin Kim , Bo Sung Ku
发明人: Hee Ju Son , Sang Youl Jeon , Sang Jin Kim , Bo Sung Ku
IPC分类号: G01N1/14
CPC分类号: B01L3/0241 , B01L2200/146 , B41J2/16579 , G01L1/14 , G01N35/1016 , G01N2035/1041
摘要: There are provided a device for testing droplets and an operation method thereof. The device includes a receiving layer on which a sample is received; a plurality of pressure sensors disposed below the receiving layer, and generating changes in capacitance by the sample received on the receiving layer; and a control unit measuring changes in capacitance generated by the plurality of pressure sensors and determining whether the sample received on the receiving layer is defective. According to the present invention, a location and an amount of a sample received on a receiving layer are measured based on changes in capacitance generated by a plurality of respective pressure sensors disposed below the receiving layer, thereby precisely testing whether the sample ejected in droplet form is defective.
摘要翻译: 提供了一种用于测试液滴的装置及其操作方法。 该装置包括接收层,其上接收样本; 设置在所述接收层下方的多个压力传感器,并且通过在所述接收层上接收的样本产生电容变化; 以及控制单元,测量由所述多个压力传感器产生的电容的变化,并且确定在所述接收层上接收到的样本是否有缺陷。 根据本发明,接收层接收的样本的位置和数量根据设置在接收层下方的多个压力传感器产生的电容的变化来测量,从而精确地测试以液滴形式喷射的样品 有缺陷
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公开(公告)号:US08765078B2
公开(公告)日:2014-07-01
申请号:US13358880
申请日:2012-01-26
申请人: Sang Youl Jeon , Bo Sung Ku , Hee Ju Son
发明人: Sang Youl Jeon , Bo Sung Ku , Hee Ju Son
CPC分类号: B01J19/0046 , B01J2219/00317 , B01J2219/00382 , B01J2219/00387 , B01J2219/00509 , B01J2219/00743
摘要: There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.
摘要翻译: 提供了一种生物芯片冲压装置。 生物芯片冲压装置包括:冲压夹具,其中第一生物芯片对准; 翻转机构使第二生物芯片垂直翻转; 以及移动机构,其将所述垂直倒置的第二生物芯片传送到所述冲压夹具上,以组合所述第一生物芯片和所述第二生物芯片。
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公开(公告)号:US20130047399A1
公开(公告)日:2013-02-28
申请号:US13358880
申请日:2012-01-26
申请人: Sang Youl JEON , Bo Sung Ku , Hee Ju Son
发明人: Sang Youl JEON , Bo Sung Ku , Hee Ju Son
CPC分类号: B01J19/0046 , B01J2219/00317 , B01J2219/00382 , B01J2219/00387 , B01J2219/00509 , B01J2219/00743
摘要: There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.
摘要翻译: 提供了一种生物芯片冲压装置。 生物芯片冲压装置包括:冲压夹具,其中第一生物芯片对准; 翻转机构使第二生物芯片垂直翻转; 以及移动机构,其将所述垂直倒置的第二生物芯片传送到所述冲压夹具上,以组合所述第一生物芯片和所述第二生物芯片。
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