Resistance-type random access memory device having three-dimensional bit line and word line patterning
    1.
    发明授权
    Resistance-type random access memory device having three-dimensional bit line and word line patterning 有权
    具有三维位线和字线图案的电阻型随机存取存储器件

    公开(公告)号:US08338224B2

    公开(公告)日:2012-12-25

    申请号:US12621007

    申请日:2009-11-18

    IPC分类号: H01L21/06

    摘要: Provided is a resistance random access memory device and a method of fabricating, the same. The method includes forming a bit-line stack in which a plurality of local bit-lines are vertically stacked on a substrate, forming a word-line including a plurality of local word-lines that extend in a vertical direction toward a side of the bit-line stack and a connection line that extends in a horizontal direction to connect the plurality of local word-lines with one another, and forming a resistance memory thin film between the bit-line stack and the word-line. The present inventive concept can realize a highly dense memory array with 3D cross-point architecture by simplified processes.

    摘要翻译: 提供一种电阻随机存取存储器件及其制造方法。 该方法包括形成位线堆叠,其中多个局部位线垂直堆叠在基板上,形成包括在垂直方向上朝向该位的一侧延伸的多个局部字线的字线 线堆叠和连接线,其在水平方向上延伸以将多个本地字线彼此连接,并且在位线堆叠和字线之间形成电阻存储器薄膜。 本发明的概念可以通过简化的过程实现具有3D交叉点架构的高密度存储器阵列。

    Resistance-Type Random Access Memory Device Having Three-Dimensional Bit Line and Word Line Patterning
    2.
    发明申请
    Resistance-Type Random Access Memory Device Having Three-Dimensional Bit Line and Word Line Patterning 有权
    具有三维位线和字线图形的电阻型随机存取存储器件

    公开(公告)号:US20100178729A1

    公开(公告)日:2010-07-15

    申请号:US12621007

    申请日:2009-11-18

    IPC分类号: H01L21/16

    摘要: Provided is a resistance random access memory device and a method of fabricating, the same. The method includes forming a bit-line stack in which a plurality of local bit-lines are vertically stacked on a substrate, forming a word-line including a plurality of local word-lines that extend in a vertical direction toward a side of the bit-line stack and a connection line that extends in a horizontal direction to connect the plurality of local word-lines with one another, and forming a resistance memory thin film between the bit-line stack and the word-line. The present inventive concept can realize a highly dense memory array with 3D cross-point architecture by simplified processes.

    摘要翻译: 提供一种电阻随机存取存储器件及其制造方法。 该方法包括形成位线堆叠,其中多个局部位线垂直堆叠在基板上,形成包括在垂直方向上朝向该位的一侧延伸的多个局部字线的字线 线堆叠和连接线,其在水平方向上延伸以将多个本地字线彼此连接,并且在位线堆叠和字线之间形成电阻存储器薄膜。 本发明的概念可以通过简化的过程实现具有3D交叉点架构的高密度存储器阵列。

    NONVOLATILE MEMORY DEVICE
    3.
    发明申请
    NONVOLATILE MEMORY DEVICE 有权
    非易失性存储器件

    公开(公告)号:US20100271862A1

    公开(公告)日:2010-10-28

    申请号:US12765411

    申请日:2010-04-22

    IPC分类号: G11C11/00 G11C8/00

    摘要: A nonvolatile memory device includes resistive memory devices in a three-dimensional structure. A block select circuit generates a block select signal for selecting a memory block. In response to the block select signal, local word line selection units connected to each memory block connect global word lines connected to a word line decoder and local word lines, and local bit line selection units connected to each memory block connect global bit lines connected to a sense amplifier and local bit lines. Each memory block includes local word lines which extend in a first direction and are stacked in a second direction perpendicular to the first direction on a second plane perpendicular to a first plane. Local bit lines extend in the second direction to cross local word lines. Memory cells are formed at cross-points where local word lines and local bit lines cross one another.

    摘要翻译: 非易失性存储器件包括三维结构中的电阻式存储器件。 块选择电路产生用于选择存储块的块选择信号。 响应于块选择信号,连接到每个存储器块的局部字线选择单元连接连接到字线解码器和本地字线的全局字线,并且连接到每个存储器块的局部位线选择单元将连接到 一个读出放大器和本地位线。 每个存储块包括在垂直于第一平面的第二平面上沿第一方向延伸并且沿垂直于第一方向的第二方向堆叠的局部字线。 局部位线在第二个方向上延伸以跨越局部字线。 存储单元在本地字线和局部位线交叉的交点处形成。

    Nonvolatile memory device
    5.
    发明授权
    Nonvolatile memory device 有权
    非易失性存储器件

    公开(公告)号:US08331152B2

    公开(公告)日:2012-12-11

    申请号:US12765411

    申请日:2010-04-22

    IPC分类号: G11C11/34

    摘要: A nonvolatile memory device includes resistive memory devices in a three-dimensional structure. A block select circuit generates a block select signal for selecting a memory block. In response to the block select signal, local word line selection units connected to each memory block connect global word lines connected to a word line decoder and local word lines, and local bit line selection units connected to each memory block connect global bit lines connected to a sense amplifier and local bit lines. Each memory block includes local word lines which extend in a first direction and are stacked in a second direction perpendicular to the first direction on a second plane perpendicular to a first plane. Local bit lines extend in the second direction to cross local word lines. Memory cells are formed at cross-points where local word lines and local bit lines cross one another.

    摘要翻译: 非易失性存储器件包括三维结构中的电阻式存储器件。 块选择电路产生用于选择存储块的块选择信号。 响应于块选择信号,连接到每个存储器块的局部字线选择单元连接连接到字线解码器和本地字线的全局字线,并且连接到每个存储器块的局部位线选择单元将连接到 一个读出放大器和本地位线。 每个存储块包括在垂直于第一平面的第二平面上沿第一方向延伸并且沿垂直于第一方向的第二方向堆叠的局部字线。 局部位线在第二个方向上延伸以跨越局部字线。 存储单元在本地字线和局部位线交叉的交点处形成。

    Semiconductor memory device
    7.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US08264018B2

    公开(公告)日:2012-09-11

    申请号:US12777683

    申请日:2010-05-11

    IPC分类号: H01L29/80

    摘要: Provided is a semiconductor memory device. The semiconductor memory device may include a local bitline extending in a direction substantially vertical to an upper surface of a semiconductor substrate and a local wordline intersecting the local bitline. The local bitline is electrically connected to a bitline channel pillar penetrating a gate of a bitline transistor, and the local wordline is electrically connected to a wordline channel pillar penetrating a gate of a wordline transistor.

    摘要翻译: 提供了一种半导体存储器件。 半导体存储器件可以包括在基本上垂直于半导体衬底的上表面的方向上延伸的局部位线和与局部位线相交的局部字线。 局部位线电连接到贯穿位线晶体管的栅极的位线通道柱,并且本地字线电连接到贯穿字线晶体管的栅极的字线通道柱。

    SEMICONDUCTOR MEMORY DEVICE
    8.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 审中-公开
    半导体存储器件

    公开(公告)号:US20120306004A1

    公开(公告)日:2012-12-06

    申请号:US13585119

    申请日:2012-08-14

    IPC分类号: H01L29/78

    摘要: Provided is a semiconductor memory device. The semiconductor memory device may include a local bitline extending in a direction substantially vertical to an upper surface of a semiconductor substrate and a local wordline intersecting the local bitline. The local bitline is electrically connected to a bitline channel pillar penetrating a gate of a bitline transistor, and the local wordline is electrically connected to a wordline channel pillar penetrating a gate of a wordline transistor.

    摘要翻译: 提供了一种半导体存储器件。 半导体存储器件可以包括在基本上垂直于半导体衬底的上表面的方向上延伸的局部位线和与局部位线相交的局部字线。 局部位线电连接到贯穿位线晶体管的栅极的位线通道柱,并且本地字线电连接到贯穿字线晶体管的栅极的字线通道柱。

    SEMICONDUCTOR MEMORY DEVICE
    9.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器件

    公开(公告)号:US20100289084A1

    公开(公告)日:2010-11-18

    申请号:US12777683

    申请日:2010-05-11

    IPC分类号: H01L29/78

    摘要: Provided is a semiconductor memory device. The semiconductor memory device may include a local bitline extending in a direction substantially vertical to an upper surface of a semiconductor substrate and a local wordline intersecting the local bitline. The local bitline is electrically connected to a bitline channel pillar penetrating a gate of a bitline transistor, and the local wordline is electrically connected to a wordline channel pillar penetrating a gate of a wordline transistor.

    摘要翻译: 提供了一种半导体存储器件。 半导体存储器件可以包括在基本上垂直于半导体衬底的上表面的方向上延伸的局部位线和与局部位线相交的局部字线。 局部位线电连接到贯穿位线晶体管的栅极的位线通道柱,并且本地字线电连接到贯穿字线晶体管的栅极的字线通道柱。

    Semiconductor memory devices
    10.
    发明授权
    Semiconductor memory devices 有权
    半导体存储器件

    公开(公告)号:US08824184B2

    公开(公告)日:2014-09-02

    申请号:US13587476

    申请日:2012-08-16

    摘要: A semiconductor memory device includes a stacked structure including a plurality of wordline structures sequentially stacked that each include: a plurality of wordlines with sidewalls and extending in a first direction on the substrate, and a connecting pad extending in a second direction on the substrate and being connected in common to the plurality of wordlines. A plurality of interconnections at a height over the substrate are connected to the connecting pads of the wordline structures, respectively. The device further includes bitlines substantially vertical to a top surface of the substrate and crossing one of the sidewalls of the plurality of wordlines, and memory elements between the bitlines and the plurality of wordlines, respectively. A length of the connecting pad in the second direction is substantially equal to a product of a minimum pitch between the interconnections and a stack number of one of the plurality of wordlines.

    摘要翻译: 半导体存储器件包括堆叠结构,其包括顺序层叠的多个字线结构,每个字线包括:具有侧壁并在衬底上沿第一方向延伸的多个字线,以及在衬底上沿第二方向延伸的连接焊盘, 与多个字线共同连接。 在衬底上的高度处的多个互连分别连接到字线结构的连接焊盘。 该装置还包括基本上垂直于衬底的顶表面并且跨越多个字线的侧壁中的一个以及位线和多个字线之间的存储元件的位线。 连接焊盘在第二方向上的长度基本上等于互连之间的最小间距和多个字线之一的堆叠数的乘积。