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公开(公告)号：US20230028233A1
公开(公告)日：2023-01-26
申请号：US17955796
申请日：2022-09-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chao SHEN , Zhiqiang XIANG , Xiaojing LIAO
IPC: H01H85/046 , H01H85/06 , H05K1/18
Abstract: This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.
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2.发明申请公开(公告)号：US20220384380A1
公开(公告)日：2022-12-01
申请号：US17826309
申请日：2022-05-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhiqiang XIANG
Abstract: The electronic component package body includes a substrate, an electronic component, and first pins. The substrate includes a bottom surface, a top surface, and a first side surface. The first side surface is connected between the bottom surface and the top surface. The electronic component is packaged inside the substrate. The first pins are embedded in the substrate, and penetrate from the bottom surface to the top surface. The first pins include a bottom surface and a side surface connected to the bottom surface. The bottom surface is exposed relative to the bottom surface, and at least a partial structure of the side surface is exposed relative to the first side surface. Both the bottom surface and the side surface are used for soldering with solder. Reliability of soldering the electronic component package body and a circuit board is high.
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公开(公告)号：US20210343663A1
公开(公告)日：2021-11-04
申请号：US17367895
申请日：2021-07-06
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhiqiang XIANG
IPC: H01L23/64 , H01L25/16 , H01L23/495 , H01L49/02
Abstract: A packaged module and a metal plate. The packaged module may include a bearing structure, at least one metal strip, a circuit element, and a magnetic material. Further, a first surface of the bearing structure may bear the circuit element; two ends of each of the at least one metal strip may be coupled to the bearing structure, and a part of each metal strip other than the two ends is spaced apart from the bearing structure; and the magnetic material may cover a surface of a winding functional region of the at least one metal strip, where the winding functional region may be a part or all of the metal strip to which the winding functional region belongs. The foregoing solution helps simplify a packaging process and reduce losses and manufacturing costs of the packaged module.
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公开(公告)号：US20240178160A1
公开(公告)日：2024-05-30
申请号：US18437428
申请日：2024-02-09
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Ming WU , Zhiqiang XIANG , Fei DING , Qidong WANG
IPC: H01L23/62 , H01L23/498
CPC classification number: H01L23/62 , H01L23/49822
Abstract: A package structure and an electronic apparatus includes a power semiconductor device, a wire, and a shape memory object. The wire is electrically connected to the power semiconductor device, the shape memory object is in contact with the wire, and the shape memory object is configured to deform when temperature of the shape memory object is not less than preset temperature, to enable a current in the wire to be cut off or reduced. In this way, impact of high temperature generated by the power semiconductor device when an overcurrent occurs in the power semiconductor device on the printed circuit board is reduced, a possibility that a printed circuit board is damaged is greatly reduced, and an overcurrent self-protection capability of the package structure is implemented.
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Patent Agency Ranking
公开(公告)号：US20220223510A1
公开(公告)日：2022-07-14
申请号：US17570889
申请日：2022-01-07
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhiqiang XIANG
IPC: H01L23/498 , H01L23/14 , H01L23/15 , H01L21/48
Abstract: This application provides an embedded packaging structure, a preparation method thereof, and a terminal device. The embedded packaging structure includes a substrate frame, and a first through hole and a second through hole that run through the substrate frame in a thickness direction of the substrate frame. A metal connection electrode is disposed in the first through hole, an electronic component is embedded in the second through hole, and a pin of the electronic component is exposed at a hole opening of the second through hole. The substrate frame is made of silicon or a ceramic. Compared with a prior art substrate frame formed by using a resin material, the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength in addition to providing insulation.
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公开(公告)号：US20230029565A1
公开(公告)日：2023-02-02
申请号：US17876419
申请日：2022-07-28
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Guolei YU , Shuchao SONG , Junliang QIN , Zhiqiang XIANG
Abstract: The three-level direct current converter includes: a flying capacitor, a plurality of switch groups, a drive circuit, and a control circuit. The control circuit includes at least an on-time generator. When a voltage on the flying capacitor deviates from a half of a power supply voltage, the on-time generator changes a charging current of a capacitor of the on-time generator to adjust an output on-time signal, and outputs the on-time signal to the drive circuit. The drive circuit generates a drive pulse signal based on the on-time signal to drive switch statuses of the plurality of switch groups, to adjust charging time and discharging time of the flying capacitor, where an absolute value of a difference between the voltage on the flying capacitor and the half of the power supply voltage is less than or equal to a preset threshold.
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公开(公告)号：US20220407422A1
公开(公告)日：2022-12-22
申请号：US17843213
申请日：2022-06-17
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Junliang QIN , Zhiqiang XIANG
Abstract: This application provides a COT parallel circuit and a power supply device. After receiving a first power signal output by a first phase converter, the COT multiphase parallel circuit may output a first pulse signal to a second phase converter, where the first pulse signal is used to indicate to the second phase converter to output a second power signal. Further, the COT multiphase parallel circuit may output a plurality of power signals in one period of a RAMP signal. A high-frequency power signal can be output without increasing a frequency of the RAMP signal, thereby reducing the difficulty of implementing a high-frequency COT multiphase parallel connection.
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8.发明申请公开(公告)号：US20220223506A1
公开(公告)日：2022-07-14
申请号：US17709100
申请日：2022-03-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xuanwei FANG , Zhiqiang XIANG
Abstract: Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow bezel, and a plurality of pins and connecting ribs that are disposed in the bezel. Each pin includes a first pin part and a second pin part that extend in a second direction and are integrally formed. The first pin part is disposed in the bezel, the first pin part is configured to electrically connect to a circuit board, and the second pin part is connected and fastened to the bezel. The second direction is perpendicular to the first direction. The connecting ribs are connected among the plurality of pins and the bezel.
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9.发明申请公开(公告)号：US20200161978A1
公开(公告)日：2020-05-21
申请号：US16750999
申请日：2020-01-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yujian LIN , Haitao CHEN , Yue CHEN , Zhiqiang XIANG
Abstract: A power supply circuit is disclosed. The circuit includes n capacitors, m power branches, and a control chip, where the m power branches include at least one first-type power branch and at least one second-type power branch, the first-type power branch includes a pre-boost topology structure and an open-loop topology structure connected in series to the pre-boost topology structure, the pre-boost topology structure is connected to the control chip, the pre-boost topology structure includes a straight-through state and a closed-loop state, and the control chip is configured to control, based on an output voltage of the power source, the pre-boost topology structure to switch between the straight-through state and the closed-loop state, so that the pre-boost topology structure pre-adjusts the output voltage of the power source and outputs a voltage range that meets a requirement of the open-loop topology structure.
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