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    Light emitting device
    1.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号：US08324649B2

    公开(公告)日：2012-12-04

    申请号：US13216932

    申请日：2011-08-24

    申请人： Sang Youl Lee ,  Hwan Hee Jeong ,  Ji Hyung Moon ,  Young Kyu Jeong ,  Kwang Ki Choi ,  June O Song

    发明人： Sang Youl Lee ,  Hwan Hee Jeong ,  Ji Hyung Moon ,  Young Kyu Jeong ,  Kwang Ki Choi ,  June O Song

    IPC分类号： H01L33/00

    CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/22 ,  H01L33/382 ,  H01L33/46 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/00

    摘要： A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.

    摘要翻译： 提供一种发光器件，其包括发光结构（包括第一导电类型半导体层，有源层和第二导电类型半导体层），导电层，绝缘层和电流阻挡层。 导电层可以具有穿过第二导电类型半导体层和有源层以接触第一导电类型半导体层的第一导电部分。 绝缘层可以具有围绕导电层的第一导电部分的第一绝缘部分。 电流阻挡层可以基本上围绕绝缘层的第一绝缘部分，设置在电流阻挡层和第一导电部分之间的第一绝缘部分。

    Light emitting device, method of manufacturing the same, light emitting device package, and illumination system
    2.
    发明授权
    Light emitting device, method of manufacturing the same, light emitting device package, and illumination system 有权
    发光器件，其制造方法，发光器件封装和照明系统

    公开(公告)号：US08179039B2

    公开(公告)日：2012-05-15

    申请号：US13028686

    申请日：2011-02-16

    申请人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    发明人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    IPC分类号： H05B33/00 ,  F21V1/00

    CPC分类号： H01L33/62 ,  H01L33/08 ,  H01L33/20 ,  H01L33/42 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and an illumination system. The light emitting device includes a transmissive substrate, an ohmic layer on the transmissive substrate, a light emitting structure on the ohmic layer and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers, a electrode layer on a bottom surface of the transmissive substrate, and a conductive via electrically connecting the light emitting structure with the electrode layer through the transmissive substrate wherein an area of the transmissive substrate is increased toward an upper portion thereof from a lower portion.

    摘要翻译： 公开了发光器件，其制造方法，发光器件封装和照明系统。 发光器件包括透射衬底，透射衬底上的欧姆层，欧姆层上的发光结构，并且包括第一和第二半导体层之间的第一导电半导体层，第二导电半导体层和有源层 ，透射基板的底面上的电极层，以及通过透射基板将发光结构与电极层电连接的导电通孔，其中透射基板的面积从下部向其上部增加。

    LIGHT EMITTING DEVICE
    3.
    发明申请
    LIGHT EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20120007121A1

    公开(公告)日：2012-01-12

    申请号：US13216932

    申请日：2011-08-24

    申请人： Sang Youl LEE ,  Hwan Hee Jeong ,  Ji Hyung Moon ,  Young Kyu Jeong ,  Kwang Ki Choi ,  June O. Song

    发明人： Sang Youl LEE ,  Hwan Hee Jeong ,  Ji Hyung Moon ,  Young Kyu Jeong ,  Kwang Ki Choi ,  June O. Song

    IPC分类号： H01L33/60

    CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/145 ,  H01L33/22 ,  H01L33/382 ,  H01L33/46 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/00

    摘要： A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.

    摘要翻译： 提供一种发光器件，其包括发光结构（包括第一导电类型半导体层，有源层和第二导电类型半导体层），导电层，绝缘层和电流阻挡层。 导电层可以具有穿过第二导电类型半导体层和有源层以接触第一导电类型半导体层的第一导电部分。 绝缘层可以具有围绕导电层的第一导电部分的第一绝缘部分。 电流阻挡层可以基本上围绕绝缘层的第一绝缘部分，设置在电流阻挡层和第一导电部分之间的第一绝缘部分。

    Light emitting device, light emitting device package, and lighting system
    7.
    发明授权
    Light emitting device, light emitting device package, and lighting system 有权
    发光装置，发光装置封装和照明系统

    公开(公告)号：US08471241B2

    公开(公告)日：2013-06-25

    申请号：US13049126

    申请日：2011-03-16

    申请人： Kwang Ki Choi ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song ,  Ji Hyung Moon

    发明人： Kwang Ki Choi ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song ,  Ji Hyung Moon

    IPC分类号： H01L33/06

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/385 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.

    摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。 发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。 导电层设置在发光结构层的下方。 接合层设置在导电层下方。 支撑构件设置在接合层下方。 第一衬垫设置在支撑构件的下方。 第二垫片设置在支撑构件的下方距离第一垫片一定距离处。 第一电极连接在第一导电类型半导体层和第一焊盘之间。 第二电极连接在接合层和第二焊盘之间。

    Light emitting device and light emitting device package having the same
    8.
    发明授权
    Light emitting device and light emitting device package having the same 有权
    发光器件和具有该发光器件的发光器件封装

    公开(公告)号：US08421112B2

    公开(公告)日：2013-04-16

    申请号：US12986592

    申请日：2011-01-07

    申请人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    发明人： Hwan Hee Jeong ,  Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi

    IPC分类号： H01L31/0224

    CPC分类号： H01L33/44 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0016 ,  H01L2924/00014

    摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode.

    摘要翻译： 公开了一种发光器件和具有该发光器件的发光器件封装。 发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层下方的有源层和有源层下的第二导电半导体层; 第二导电半导体层下面的第一电极层; 电极，其包括与所述第一导电半导体层的底表面的一部分接触的顶表面; 以及用于覆盖电极的外周面的绝缘构件，其中绝缘构件的一部分从电极的底面延伸到第二导电半导体层和第一电极层之间的区域中。

    Light emitting device and light emitting device package thereof
    10.
    发明授权
    Light emitting device and light emitting device package thereof 有权
    发光器件及其发光器件封装

    公开(公告)号：US08643040B2

    公开(公告)日：2014-02-04

    申请号：US13102478

    申请日：2011-05-06

    申请人： Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi ,  Chung Song Kim ,  Hwan Hee Jeong

    发明人： Sang Youl Lee ,  Ji Hyung Moon ,  June O Song ,  Kwang Ki Choi ,  Chung Song Kim ,  Hwan Hee Jeong

    IPC分类号： H01L33/00

    CPC分类号： H01L33/38 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/382 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

    摘要： A light emitting device includes a light emitting structure including a second conduction type semiconductor layer, an active layer, and a first conduction type semiconductor layer, a second electrode layer arranged under the light emitting structure, a first electrode layer having at least portion extending to contact the first conduction type semiconductor layer passing the second conduction type semiconductor layer and the active layer, and an insulating layer arranged between the second electrode layer and the first electrode layer, between the second conduction type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer, wherein said at least one portion of the first electrode layer contacting the first conduction type semiconductor layer has a roughness.

    摘要翻译： 发光器件包括：发光结构，包括第二导电类型半导体层，有源层和第一导电类型半导体层;布置在发光结构下方的第二电极层;第一电极层，至少部分延伸到 接触通过第二导电类型半导体层和有源层的第一导电类型半导体层，以及布置在第二电极层和第一电极层之间，在第二导电类型半导体层和第一电极层之间以及介于 所述有源层和所述第一电极层，其中所述与所述第一导电型半导体层接触的所述第一电极层的所述至少一部分具有粗糙度。