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公开(公告)号：US20240222225A1
公开(公告)日：2024-07-04
申请号：US18347313
申请日：2023-07-05
发明人： Suk Hyun Lim , Hyun Koo Lee , Sang Hun Lee , Se Heun Kwon , Ki Young Jang , Jun Hee Park
IPC分类号： H01L23/473 , H01L23/00 , H01L25/07 , H01L25/18
CPC分类号： H01L23/473 , H01L24/37 , H01L24/40 , H01L25/072 , H01L25/18 , H01L2224/37013 , H01L2224/40137 , H01L2224/40175
摘要： An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.
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公开(公告)号：US09173329B2
公开(公告)日：2015-10-27
申请号：US13856019
申请日：2013-04-03
发明人： Jung Hong Joo , Ki Young Jang , Woo Yong Jeon , Sang Cheol Shin
IPC分类号： H05K7/20 , H01L23/473 , H01L23/373 , H01L23/433 , H01L23/31 , H01L23/00 , H01L25/11
CPC分类号： H05K7/20927 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/473 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L25/115 , H01L2224/04026 , H01L2224/06181 , H01L2224/291 , H01L2224/32225 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/014 , H01L2924/00
摘要： A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (DBMs) are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs. Faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion.
摘要翻译： 一种用于混合动力汽车，电动车辆或燃料电池车辆等环保车辆的逆变器的电力模块，即散热器集成的双面冷却电力模块，其中冷却效率为 通过采用使用通过挤出法制造的散热器的双面直接冷却方法来最大化。 特别地，散热器设置在功率模块的上部和下部，并且直接接合材料（DBM）沉积在上部和下部散热器之间，其中芯片插入在DBM之间。 通过焊料将散热片，芯片和DBM之间的面相互结合，并且通过模具部分完成芯片和DBM的整个周边。
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公开(公告)号：US10911041B2
公开(公告)日：2021-02-02
申请号：US15834576
申请日：2017-12-07
发明人： Jiwoong Jang , Ki Jong Lee , Sangcheol Shin , Ki Young Jang , Kangho Jeong , Kwang Hee Nam , Sung Jin Kim
IPC分类号： H03K17/0812 , B60R16/03 , H02M1/08 , G01C21/26 , H03K17/082 , H02M1/00
摘要： An electronic circuit module is provided. The electronic circuit module prevents damage by efficiently detecting an overcurrent in the electronic circuit module using an SiC MOSFET. The electronic circuit module includes an input unit that is configured to input a reference voltage and a switching unit that is configured to output a first voltage based on a current flow. A converter is configured to output a second voltage based on the first voltage and the reference voltage. An output unit is configured to compare a magnitude of the reference voltage with a magnitude of the second voltage to output a feedback signal when the second voltage is greater than the reference voltage.
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公开(公告)号：US10771005B2
公开(公告)日：2020-09-08
申请号：US16389450
申请日：2019-04-19
发明人： Beom Sik Kim , Jin Hwan Jung , Sang Cheol Shin , Ji Woong Jang , Ki Young Jang , Ki Jong Lee
摘要： An inverter system for a vehicle includes: an energy storage device configured to store electrical energy, a first inverter including a plurality of first switching elements and configured to convert the electrical energy stored in the energy storage device into alternating-current (AC) electric power, a second inverter including a plurality of second switching elements different from the plurality of first switching elements, a motor configured to be driven by receiving the AC power converted by the first inverter and the second inverter, current sensors disposed between the first inverter and the motor and the second inverters and the motor, respectively, and configured to detect a current input to the motor, and a controller configured to generate a pulse width modulation (PWM) signal for controlling driving of the motor.
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公开(公告)号：US10651775B2
公开(公告)日：2020-05-12
申请号：US16132828
申请日：2018-09-17
发明人： Ji Woong Jang , Ki Young Jang , Jin Hwan Jung , Sang Cheol Shin , Beom Sik Kim , Ki Jong Lee
IPC分类号： H02P27/08 , H02P23/14 , H02P25/024 , B60L50/51 , H03K17/082
摘要： An inverter system for a vehicle may include an energy storage device configured to store electrical energy; a first inverter including a plurality of first switching elements, and converting the energy into AC power; a second inverter including a plurality of second switching elements different from the first switching elements, being connected to the energy storage device in parallel with the first inverter, and converting the energy into AC power; a motor driven by receiving the AC power; a PWM signal generating device configured to generate a reference Pulse-width modulation (PWM) signal for controlling driving of the motor; and a PWM signal converting device configured to convert the reference PWM signal into both a first PWM signal input into the first inverter to drive the first switching elements, and a second PWM signal input into the second inverter to drive the second switching elements.
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公开(公告)号：US20190103865A1
公开(公告)日：2019-04-04
申请号：US15834576
申请日：2017-12-07
发明人： Jiwoong Jang , Ki Jong Lee , Sangcheol Shin , Ki Young Jang , Kangho Jeong , Kwang Hee Nam , Sung Jin Kim
IPC分类号： H03K17/0812 , H02M1/08 , B60R16/03
摘要： An electronic circuit module is provided. The electronic circuit module prevents damage by efficiently detecting an overcurrent in the electronic circuit module using an SiC MOSFET. The electronic circuit module includes an input unit that is configured to input a reference voltage and a switching unit that is configured to output a first voltage based on a current flow. A converter is configured to output a second voltage based on the first voltage and the reference voltage. An output unit is configured to compare a magnitude of the reference voltage with a magnitude of the second voltage to output a feedback signal when the second voltage is greater than the reference voltage.
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公开(公告)号：US10032689B2
公开(公告)日：2018-07-24
申请号：US15377768
申请日：2016-12-13
发明人： Woo Yong Jeon , Hyun Koo Lee , Sung Min Park , Ki Young Jang
IPC分类号： H01L23/367 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/00
摘要： Disclosed herein are a double-side cooling type power module and a producing method thereof. The double-side cooling type power module includes a pair of semiconductor chips disposed between an upper substrate and a lower substrate. The double-side cooling type power module includes output terminal leads configured to be disposed on a lower surface of the upper substrate and each connected to the pair of semiconductor chips, respectively; a plus terminal lead configured to be disposed at one side of an upper surface of the lower substrate to be connected to any one semiconductor chip selected from the pair of semiconductor chips; and a minus terminal lead configured to be disposed at the other side of the upper surface of the lower substrate to be connected to the other semiconductor chip of the pair of semiconductor chips.
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公开(公告)号：US10651772B2
公开(公告)日：2020-05-12
申请号：US16142594
申请日：2018-09-26
发明人： Beom Sik Kim , Jin Hwan Jung , Ki Young Jang
摘要： An inverter system for vehicles according to the present disclosure may include: an energy storage storing electrical energy; a first inverter which includes a plurality of first switches and converts the energy stored in the energy storage into AC power; a second inverter which includes a plurality of second switches, which are different from the first switches, is connected in parallel with the first inverter to the energy storage and converts the energy stored in the energy storage into AC power; a motor driven by receiving the AC power converted through the first inverter and the second inverter; and a controller for controlling operations of the first inverter and the second inverter based on power requirements of the motor.
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公开(公告)号：US10260967B2
公开(公告)日：2019-04-16
申请号：US15270524
申请日：2016-09-20
发明人： Ji Woong Jang , Ki Jong Lee , Kang Ho Jeong , Ki Young Jang , Sang Cheol Shin
摘要： An IGBT temperature sense circuit is provided. The IGBT temperature sense circuit automatically calibrates a temperature sense of a diode to minimize an error based on element characteristics of a temperature sense diode, precisely senses the temperature and removes a limit of a maximum current (to increase the maximum current) of an output of an IGBT. A temperature sense circuit includes an automatic calibrator that is configured to supply current of a current source to a current to a diode and a diode temperature sensor that is configured to measure a voltage of one side terminal of the diode based on the current of the diode based on a change of a temperature and adjustment of an operation of a protection object device.
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公开(公告)号：US20170216948A1
公开(公告)日：2017-08-03
申请号：US15213840
申请日：2016-07-19
发明人： Sung Won Park , Ki Young Jang , Hyun Koo Lee , Sung Min Park , Woo Yong Jeon , Jeong Min Son , Moo Soo Jeong , Mun Ki Ko
CPC分类号： B23K3/085 , B23K1/0016 , B23K3/087 , H01L2224/33
摘要： A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process.
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