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    SOLDERING JIG FOR DOUBLE-FACED COOLING POWER MODULE
    1.
    发明申请
    SOLDERING JIG FOR DOUBLE-FACED COOLING POWER MODULE 审中-公开

    公开(公告)号：US20170216948A1

    公开(公告)日：2017-08-03

    申请号：US15213840

    申请日：2016-07-19

    申请人： Hyundai Motor Company ,  Hyundai Autron Co., Ltd.

    发明人： Sung Won Park ,  Ki Young Jang ,  Hyun Koo Lee ,  Sung Min Park ,  Woo Yong Jeon ,  Jeong Min Son ,  Moo Soo Jeong ,  Mun Ki Ko

    IPC分类号： B23K3/08 ,  B23K1/00

    CPC分类号： B23K3/085 ,  B23K1/0016 ,  B23K3/087 ,  H01L2224/33

    摘要： A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process.

    Power module having dual-sided cooling
    3.
    发明授权
    Power module having dual-sided cooling 有权

    公开(公告)号：US10147665B2

    公开(公告)日：2018-12-04

    申请号：US15639256

    申请日：2017-06-30

    申请人： HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION

    发明人： Jun Hee Park ,  Jeong Min Son

    IPC分类号： H01L23/34 ,  H01L23/10 ,  H01L23/373 ,  H01L23/367 ,  H01L23/538 ,  H01L25/07 ,  H01L23/42 ,  H01L23/473 ,  B60L15/00 ,  H02P6/08

    摘要： A power module having dual-sided cooling is provided with a semiconductor chip between an upper board and a lower board of the power module. In particular, the upper board includes: a first bonding layer made of a dielectric material, and a first electrode made of a copper material and provided on a first surface of the first bonding layer, and the first electrode is connected to the semiconductor chip. The lower board includes: a second bonding layer made of a dielectric material, and a second electrode made of a copper material and provided on a first surface of the second bonding layer, and the second electrode is connected to the semiconductor chip. More specifically, a thickness of the first electrode is greater than a thickness of the first bonding layer, and a thickness of the second electrode is greater than a thickness of the second bonding layer.