Abstract:
A PROCESS FOR PREPARING METAL-OXIDE SEMICONDUCTOR DEVICES (MOSFET''S) USING ION IMPLANATION IS DESCRIBED WHEREIN ALUMINUM SOURCE AND DRAIN CONTACTS ARE ADDED AFTER ION IMPLANTATION THROUGH A HIGHLY REFRECATORY METAL GATE SO THAT VERY HIGH TEMPERATURE ANNEALING CAN BE USED. IF THE ALUMINUM CONTACTS ARE PUT DOWN BEFORE THE HIGH TEMPERATURE ANNEALING, NOT ONLY DOES A REACTION BETWEEN THE ALUMINUM AND THIN OXIDE CHANNEL REGION OF THE MOSFET OCCUR, BUT OHMIC CONTACTS AT THE SOURCE AND DRAIN DETERIORATE, RESULTING IN DEFECTIVE DEVIES.
Abstract:
An amplifier for Rayleigh surface acoustic waves in which an additional control is provided. A region of variable conductivity is located in close proximity to the surface on which the acoustic wave travels. Examples of this region are an inversion layer whose conductivity is controlled by electrical bias, and a bulk region whose conductivity is controlled by a variable width depletion region. The electric field produced by moving charge carriers in the variable conductivity region interacts with the piezoelectric field produced by the acoustic wave to transfer energy to the acoustic wave, or extract energy from this wave.
Abstract:
A parametric device for acoustic waves which does not depend on the non-linearities of a medium for operation. Both degenerate and non-degenerate parametric amplifier/converters are provided in which first order velocity changes give parametric interactions. The electric field associated with an acoustic wave in a piezolectric medium is modulated by an electric pump wave. This is accomplished by modulating the conductivity of a region in the piezoelectric medium, or close to that medium. The resulting modulation of the K-vector of the acoustic wave leads to parametric interactions between the acoustic signal wave, the electric pump wave, and the generated idler wave. Various effects, such as the field effect and the photoconductive effect, are used to modulate the conductivity of the region.
Abstract:
This disclosure provides a control feature for a solid state device which has a negative resistance characteristic in the current-voltage curve due to an insulator in the current path. A negative resistance device is fabricated by planar technology to have an insulator layer interposed between a semiconductor layer and a metal layer in the negative resistance current path. The control feature is provided through a control electrode which has a lateral junction in the semiconductor layer and near to the current path through the insulator layer. Control voltage pulses of opposite polarities applied to the control electrode obtain switching between stable states of the device in both directions without a requirement of turning off the current.