Abstract:
An integrated circuit is provided in which a heavily doped buried layer within the collector of a transistor extends into contact with the base thereof to form the major portion of the collector-base junction. The buried layer enhances the current gain bandwidth by minimizing the width of the collector-base depletion region and the shift thereof into the collector for high-current densities. The effects of capacitances at the collector-base junction and at the junctions of resistors and isolating walls adjacent the transistor are minimized by a lightly doped epitaxial layer within the collector of the transistor.
Abstract:
An integrated clamping circuit is provided in which the bulk collector resistance of a transistor is coupled to the base contact by a second collector contact to bias the collector-base junction in response to a potential difference between the base and main collector contacts. The level of collector-base junction bias is determined in part by the size of the auxiliary collector contact and its location relative to a heavily doped buried layer in the collector. The biased transistor conducts in a manner so as to clamp the voltage at the output terminal of an associated electrical device for load current above a threshold value.
Abstract:
A PROCESS FOR MAKING SEMICONDUCTOR BODIES, SAID BODIES HAVING POWER CONNECTIONS AND DECOUPLING MEANS INTERNAL THERETO, SAID CONNECTIONS CONPRISING DIFFUSED LOW RESISTANCE SEMICONDUCTOR REGIONS, WHEREIN SAID PROCESS COMPRISES THE STEPS OF FORMING THE LOW RESISTANCE REGIONS AND THE DECOUPLING MEANS BY A SERIES OF DIFFUSIONS INCLUDING CONTROLLED OUT-DIFFUSIONS.