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公开(公告)号:US3499203A
公开(公告)日:1970-03-10
申请号:US3499203D
申请日:1965-05-27
Applicant: IBM
Inventor: CLARK KENDALL , BECK GEORGE C , CREIGHTON EUGENE J , TURRIS FRANK L DE , DROP JOSEPH G , GODAT JEAN J L , LARSEN ARNE H , RAJAC THOMAS J , SANTILLO GEORGE R JR , SCHUELKE WALTER J
IPC: H01L21/00 , H01L21/683 , H05K13/04 , H01R15/00
CPC classification number: H01L21/67236 , H01L21/67144 , H01L21/6838 , H01L24/75 , H01L24/81 , H01L2224/16225 , H01L2924/14 , H05K13/0404 , H05K13/046 , Y10T29/53043 , Y10T29/53178 , Y10T29/53191 , H01L2924/00
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公开(公告)号:US3453714A
公开(公告)日:1969-07-08
申请号:US3453714D
申请日:1967-02-10
Applicant: IBM
Inventor: CLARK KENDALL , RAJAC THOMAS J , SANTILLO GEORGE R JR , SCHUELKE WALTER J
CPC classification number: H01L21/67144 , Y10T29/53061 , Y10T29/53178 , Y10T29/53191 , Y10T29/53378
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3.Method of and apparatus for mechanically testing the quality of bonded joints 失效
Title translation: 用于机械测试接合接头质量的方法和设备公开(公告)号:US3413839A
公开(公告)日:1968-12-03
申请号:US50784865
申请日:1965-11-15
Applicant: IBM
Inventor: KENDALL CLARK , SCHUELKE WALTER J
CPC classification number: G01M99/00 , G01N27/20 , G01R31/026 , G01R31/2801 , G01R31/2853 , G01R31/2886 , H05K13/0015 , H05K13/08
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