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公开(公告)号：US20210020494A1
公开(公告)日：2021-01-21
申请号：US16927707
申请日：2020-07-13
Applicant: IMEC vzw
Inventor： Thomas Hantschel
IPC: H01L21/687 , H01L21/02
Abstract: According to one aspect, a reconditioning wafer can include a carrier substrate that supports at least one array of regularly spaced protrusions configured to form indentations in a support surface of a wafer holding stage. The protrusions within the same array can have substantially the same shape and dimensions, thereby enabling a more reliable reconditioning process compared to prior art solutions. The protrusions may have the form of pyramids or pillars or other similar shapes with at least the tip of the protrusions formed of a material suitable to make the indentations. The reconditioning wafer can be obtainable by a molding technique wherein an array of molds can be created in a mold substrate. The molds can be filled with an indentation material such as diamond, and can be bonded to the carrier substrate. The mold substrate can be removed by thinning and wet etching.
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2.发明公开公开(公告)号：US20240175896A1
公开(公告)日：2024-05-30
申请号：US18524772
申请日：2023-11-30
Applicant: IMEC VZW
Inventor： Thomas Hantschel , XiuMei Xu
Abstract: One embodiment of the present disclosure is related to a method for producing a substrate comprising a plurality of tips suitable to be used in scanning probe microscopy (SPM), wherein as a first step, a substrate is produced or provided comprising a plurality of nano-sized tips, preferably arranged in a regular array and spaced apart by nano-sized interspacings. A mask is applied to this substrate, comprising multiple mask portions, wherein each mask portion covers at least one tip, whereafter the substrate is subjected to an etching process relative to the mask portions. After the removal of the mask portions, the method results in the creation of a substrate comprising multiple pedestals having each at least one nanotip on the upper surface thereof and spaced apart at a distance suitable for performing an SPM measurement of a given type.
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公开(公告)号：US11035880B2
公开(公告)日：2021-06-15
申请号：US16802944
申请日：2020-02-27
Applicant: IMEC VZW , Katholieke Universiteit Leuven, KU LEUVEN R&D
Inventor： Thomas Hantschel , Thijs Boehme
Abstract: Example embodiments relate to methods for producing a probe suitable for scanning probe microscopy. One embodiment includes a method for producing a probe tip suitable for scanning probe microscopy. The method includes producing a probe tip body that includes at least an outer layer of a probe material. The method also includes, during the production of the probe tip body or after the production, forming a mask layer on the outer layer of probe material. Further, the method includes subjecting the probe tip body to a plasma etch procedure. The mask layer acts as an etch mask for the plasma etch procedure. The plasma etch procedure and the etch mask are configured to produce one or more tip portions formed of the probe material. The one or more tip portions are smaller and more pointed than the probe tip body prior to the plasma etch procedure.
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Patent Agency Ranking
公开(公告)号：US20210116476A1
公开(公告)日：2021-04-22
申请号：US17069228
申请日：2020-10-13
Applicant: IMEC VZW
Inventor： Thomas Hantschel , Hugo Bender , Kristof Paredis , Antti Kanniainen
Abstract: The disclosure is related to a method for performing SPM measurements, wherein a sample is attached to a cantilever and scanned across a tip. The tip is one of several tips present on a substrate comprising at least two different types of tips on its surface, thereby enabling performance of multiple SPM measurements requiring a different type of tip, without replacing the cantilever. The at least two different types of tips are different in terms of their material, in terms of their shape or size, and/or in terms of the presence or the type of active or passive components mounted on or incorporated in the substrate, and associated to tips of one or more of the different types. The disclosure is equally related to a substrate comprising a plurality of tips suitable for use in the method of the disclosure.
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公开(公告)号：US20200278379A1
公开(公告)日：2020-09-03
申请号：US16802944
申请日：2020-02-27
Applicant: IMEC VZW , Katholieke Universiteit Leuven, KU LEUVEN R&D
Inventor： Thomas Hantschel , Thijs Boehme
Abstract: Example embodiments relate to methods for producing a probe suitable for scanning probe microscopy. One embodiment includes a method for producing a probe tip suitable for scanning probe microscopy. The method includes producing a probe tip body that includes at least an outer layer of a probe material. The method also includes, during the production of the probe tip body or after the production, forming a mask layer on the outer layer of probe material. Further, the method includes subjecting the probe tip body to a plasma etch procedure. The mask layer acts as an etch mask for the plasma etch procedure. The plasma etch procedure and the etch mask are configured to produce one or more tip portions formed of the probe material. The one or more tip portions are smaller and more pointed than the probe tip body prior to the plasma etch procedure.
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公开(公告)号：US20250067771A1
公开(公告)日：2025-02-27
申请号：US18802294
申请日：2024-08-13
Applicant: IMEC VZW
Inventor： Thomas Hantschel , Hyeon-Su Kim
Abstract: A method is provided for fabricating a substrate comprising on its surface one or more scanning probe microscopy tips, the method including: a) underetching beneath one or more hardmasks, each having rotational symmetry, present on a substrate, thereby forming a corresponding number of pre-tip structures having an upper part, a lower part, and a neck region linking the upper part to the lower part; b) then, etching the substrate underneath each pre-tip structure in a vertical manner using the respective hardmask as an etching mask, thereby forming a pedestal beneath the lower part of each pre-tip structure; c) then, selectively removing the hardmask from each structure; d) then, thinning down the neck until the upper part is physically detached from the lower part, thereby forming the substrate comprising on its surface the one or more scanning probe microscopy tips.
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公开(公告)号：US11955368B2
公开(公告)日：2024-04-09
申请号：US16927707
申请日：2020-07-13
Applicant: IMEC vzw
Inventor： Thomas Hantschel
IPC: H01L21/687 , H01L21/02
CPC classification number: H01L21/68785 , H01L21/02035 , H01L21/02527
Abstract: According to one aspect, a reconditioning wafer can include a carrier substrate that supports at least one array of regularly spaced protrusions configured to form indentations in a support surface of a wafer holding stage. The protrusions within the same array can have substantially the same shape and dimensions, thereby enabling a more reliable reconditioning process compared to prior art solutions. The protrusions may have the form of pyramids or pillars or other similar shapes with at least the tip of the protrusions formed of a material suitable to make the indentations. The reconditioning wafer can be obtainable by a molding technique wherein an array of molds can be created in a mold substrate. The molds can be filled with an indentation material such as diamond, and can be bonded to the carrier substrate. The mold substrate can be removed by thinning and wet etching.
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公开(公告)号：US11112427B2
公开(公告)日：2021-09-07
申请号：US17069228
申请日：2020-10-13
Applicant: IMEC VZW
Inventor： Thomas Hantschel , Hugo Bender , Kristof Paredis , Antti Kanniainen
Abstract: The disclosure is related to a method for performing SPM measurements, wherein a sample is attached to a cantilever and scanned across a tip. The tip is one of several tips present on a substrate comprising at least two different types of tips on its surface, thereby enabling performance of multiple SPM measurements requiring a different type of tip, without replacing the cantilever. The at least two different types of tips are different in terms of their material, in terms of their shape or size, and/or in terms of the presence or the type of active or passive components mounted on or incorporated in the substrate, and associated to tips of one or more of the different types. The disclosure is equally related to a substrate comprising a plurality of tips suitable for use in the method of the disclosure.
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