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1.
公开(公告)号:US09205525B2
公开(公告)日:2015-12-08
申请号:US13852431
申请日:2013-03-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Chao-Chuang Mai , Chih-Ping Cheng , Chang-Sheng Chen , Chin-Hui Chen , Chia-Sheng Chiang
IPC: B23Q17/09
CPC classification number: B23Q17/0923
Abstract: A method and a system, for offsetting measurement of machine tool, includes following steps. A tool seat is chosen, a first coordinate is set based on a first datum mark of the tool seat. There is a total tool seat assembling length in between the first datum mark and the tool seat. A tool is chosen, assembled in the tool seat, and includes a total tool length. A second coordinate is set based on a second datum mark of a measuring unit. The tool seat is moved to make a machining end of the tool contact with the second coordinate to obtain a relative total length in between the first and the second coordinate. The total tool length subtracts from the relative total length equals an assembled offset length. The total tool seat assembling length subtracts from the relative total length equals and obtains a tool assembling length.
Abstract translation: 一种用于抵消机床测量的方法和系统,包括以下步骤。 选择工具座,基于工具座的第一基准标记来设定第一坐标。 在第一基准标记和工具座之间存在总的工具座组装长度。 选择工具,组装在工具座中,并包括总工具长度。 基于测量单元的第二基准标记来设定第二坐标。 移动工具座以使刀具接触的加工端与第二坐标相乘以获得第一和第二坐标之间的相对总长度。 总刀具长度从相对总长度减去等于组装的偏移长度。 刀具组合总长度从相对总长度减去等于并获得刀具组装长度。
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公开(公告)号:US20230197680A1
公开(公告)日:2023-06-22
申请号:US17564197
申请日:2021-12-28
Applicant: Industrial Technology Research Institute
Inventor: Po-Kai Chiu , Sheng-Tsai Wu , Yu-Min Lin , Wen-Hung Liu , Ang-Ying Lin , Chang-Sheng Chen
IPC: H01L25/065 , H01L23/367 , H01L23/498 , H01L23/66 , H01L23/31 , H01L23/00
CPC classification number: H01L25/0652 , H01L23/367 , H01L23/49822 , H01L23/66 , H01L23/3107 , H01L23/49811 , H01L24/16 , H01L2223/6677 , H01L2224/16227
Abstract: An integrated antenna package structure includes a first redistribution structure, a first chip, a heat dissipation structure, a second chip, and an antenna structure. The first chip is located on a first side of the first redistribution structure, and is electrically connected to the first redistribution structure. The heat dissipation structure is thermally connected to the first chip, and the first chip is located between the heat dissipation structure and the first redistribution structure. The second chip is located on a second side of the first redistribution structure opposite to the first side, and is electrically connected to the first redistribution structure. The antenna structure is electrically connected to the first redistribution structure.
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公开(公告)号:US20240346351A1
公开(公告)日:2024-10-17
申请号:US18088807
申请日:2022-12-27
Applicant: Industrial Technology Research Institute
Inventor: Chang-Sheng Chen , Che-Hao Li , Cheng-Hua Tsai , Meng-Hsuan Chen , Wei Chaun Yu , Meng-Sheng Chen
Abstract: The disclosure provides a quantum device and a microwave device. The quantum device includes a first partition, a second partition, an upper circuit board, a lower circuit board and a flexible circuit. The second partition is arranged below the first partition. The first partition and the second partition are used to define an ultra-low temperature chamber of the quantum device. The upper circuit board, the lower circuit board and the flexible circuit are arranged in the ultra-low temperature chamber. The upper circuit board is disposed on a lower surface of the first partition. The lower circuit board is disposed on an upper surface of the second partition. The flexible circuit is electrically connected between the upper circuit board and the lower circuit board to provide multiple signal paths for mutual signal transmission between the upper circuit board and the lower circuit board.
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公开(公告)号:US12009341B2
公开(公告)日:2024-06-11
申请号:US17564197
申请日:2021-12-28
Applicant: Industrial Technology Research Institute
Inventor: Po-Kai Chiu , Sheng-Tsai Wu , Yu-Min Lin , Wen-Hung Liu , Ang-Ying Lin , Chang-Sheng Chen
IPC: H01L31/0203 , H01L23/00 , H01L23/31 , H01L23/367 , H01L23/498 , H01L23/66 , H01L25/065
CPC classification number: H01L25/0652 , H01L23/3107 , H01L23/367 , H01L23/49811 , H01L23/49822 , H01L23/66 , H01L24/16 , H01L2223/6677 , H01L2224/16227
Abstract: An integrated antenna package structure includes a first redistribution structure, a first chip, a heat dissipation structure, a second chip, and an antenna structure. The first chip is located on a first side of the first redistribution structure, and is electrically connected to the first redistribution structure. The heat dissipation structure is thermally connected to the first chip, and the first chip is located between the heat dissipation structure and the first redistribution structure. The second chip is located on a second side of the first redistribution structure opposite to the first side, and is electrically connected to the first redistribution structure. The antenna structure is electrically connected to the first redistribution structure.
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公开(公告)号:US11081805B2
公开(公告)日:2021-08-03
申请号:US16796421
申请日:2020-02-20
Applicant: Industrial Technology Research Institute
Inventor: Chun-Chi Lin , Chang-Sheng Chen , Guo-Shu Huang
IPC: H01Q21/06 , G01S13/931 , H01Q1/32
Abstract: An antenna array is provided, which may include a connection portion and a plurality of antenna units. The antenna units may be disposed on the two sides of the connection portion respectively. The proximal end of each of the antenna units may be connected to the connection portion and the distal end of one or more of the antenna units may be grounded. The length of each of the antenna units may be less than or equal to ¼ wavelength of the operating frequency of the antenna array, and the distance between any two adjacent antenna units may be less than or equal to ½ wavelength of the operating frequency of the antenna array.
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6.
公开(公告)号:US20140130571A1
公开(公告)日:2014-05-15
申请号:US13852431
申请日:2013-03-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Chao-Chuang MAI , Chih-Ping Cheng , Chang-Sheng Chen , Chin-Hui Chen , Chia-Sheng Chiang
IPC: G01B5/012
CPC classification number: B23Q17/0923
Abstract: A method and a system, for offsetting measurement of machine tool, includes following steps. A tool seat is chosen, a first coordinate is set based on a first datum mark of the tool seat. There is a total tool seat assembling length in between the first datum mark and the tool seat. A tool is chosen, assembled in the tool seat, and includes a total tool length. A second coordinate is set based on a second datum mark of a measuring unit. The tool seat is moved to make a machining end of the tool contact with the second coordinate to obtain a relative total length in between the first and the second coordinate. The total tool length subtracts from the relative total length equals an assembled offset length. The total tool seat assembling length subtracts from the relative total length equals and obtains a tool assembling length.
Abstract translation: 一种用于抵消机床测量的方法和系统,包括以下步骤。 选择工具座,基于工具座的第一基准标记来设定第一坐标。 在第一基准标记和工具座之间存在总的工具座组装长度。 选择工具,组装在工具座中,并包括总工具长度。 基于测量单元的第二基准标记来设定第二坐标。 移动工具座以使刀具接触的加工端与第二坐标相乘以获得第一和第二坐标之间的相对总长度。 总刀具长度从相对总长度减去等于组装的偏移长度。 刀具组合总长度从相对总长度减去等于并获得刀具组装长度。
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