公开(公告)号：US09249008B2

公开(公告)日：2016-02-02

申请号：US14094568

申请日：2013-12-02

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu Wen Hsu ,  Chin Fu Kuo ,  Chao Ta Huang ,  Chun Kai Mao ,  Chin Hung Wang

IPC: A61B19/00 ,  B81B3/00 ,  G01L9/00 ,  G01P15/08 ,  G01P15/125

CPC classification number: B81B3/0086 ,  A61B2562/028 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  G01L9/0073 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0837

Abstract: A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.

Abstract translation: 公开了具有第一电极，第二电极和第三电极的MEMS器件。 这些电极以这样的方式设置在基板上：（1）第一电极的指向方向与基板的法线方向平行，（2）第三电极的指向方向垂直于 第一电极，（3）第二电极包括感测部分和静止部分，（4）第一电极和感测部分被配置为限定感测电容器，以及（5）第三电极和固定部分被配置 以定义参考电容器。 这种布置方便MEMS器件如差压传感器，差分气压计，差分麦克风和去耦电容器小型化。

公开(公告)号：US09382112B2

公开(公告)日：2016-07-05

申请号：US14184496

申请日：2014-02-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu Wen Hsu ,  Shih Ting Lin ,  Jen Yi Chen ,  Chao Ta Huang

IPC: B81B3/00 ,  B81C1/00 ,  G01C19/5762

CPC classification number: B81C1/00301 ,  B81B3/0086 ,  B81B2201/0242 ,  B81B2207/07 ,  B81C2203/0792 ,  G01C19/5762

Abstract: A method for manufacturing a MEMS device includes the following operations. An SOI wafer including a device layer, an insulating layer and a handle layer is provided. The device layer is etched to form a recess and an annular protrusion surrounding the recess. A moving part and a spring of the MEMS device are formed on the recess by etching the device layer, the insulating layer and the handle layer. An anchor of the MEMS device is formed at the annular protrusion by etching the device layer, the insulating layer and the handle layer. The moving part and the anchor are connected to each other by the spring. The insulating layer is disposed between a first conductive portion and a second conductive portion of the moving part. The insulating layer is disposed between a first conductive portion and a second conductive portion of the anchor.

Abstract translation: MEMS器件的制造方法包括以下操作。 提供了包括器件层，绝缘层和手柄层的SOI晶片。 蚀刻器件层以形成凹部和围绕凹部的环形突起。 通过蚀刻器件层，绝缘层和手柄层，在凹部上形成MEMS器件的移动部件和弹簧。 通过蚀刻器件层，绝缘层和手柄层，在环形突起处形成MEMS器件的锚。 活动部分和锚通过弹簧相互连接。 绝缘层设置在移动部件的第一导电部分和第二导电部分之间。 绝缘层设置在锚的第一导电部分和第二导电部分之间。