公开(公告)号：US20230183533A1

公开(公告)日：2023-06-15

申请号：US17681994

申请日：2022-02-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ming-Tzung WU ,  Te-Yi CHANG ,  Yao-Jheng HUANG ,  Yu-Chin LIN ,  Chen-Cheng YU ,  Yu-Ying HSU ,  Shuang-Huei CHEN

IPC: C09J133/08 ,  G02F1/1335 ,  C08F292/00 ,  C08K3/08 ,  C08K3/36

CPC classification number: C09J133/08 ,  G02F1/133514 ,  C08F292/00 ,  C08K3/08 ,  C08K3/36 ,  G02F2202/28 ,  C08K2201/011 ,  C08K2003/0831

Abstract: An adhesive composition includes 0.1 to 1 part by weight of nano panicles, 50 to 95 parts by weight of acrylate resin, and 5 to 50 parts by weight of a monomer or oligomer of acrylate or acrylic acid containing multi-functional groups, and the acrylate resin and the monomer or oligomer of acrylate or acrylic acid containing multi-functional groups have a total weight of 100 parts by weight, in which the acrylate resin has a weight average molecular weight of 100,000 to 1,500,000. The nano particle has a shell covering parts of the surface of the core, and acrylate groups grafted to the surface of the core.

公开(公告)号：US20160185878A1

公开(公告)日：2016-06-30

申请号：US14965264

申请日：2015-12-10

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Ying HSU ,  Te-Yi CHANG ,  Ju-Feng LIAO ,  Sheng-Ju LIAO ,  Yao-Jheng HUANG

IPC: C08B3/10 ,  C08L23/12 ,  C08B3/12 ,  C08G81/02

CPC classification number: C08B3/10 ,  C07H15/04 ,  C07H15/10 ,  C07H15/20 ,  C08B3/12 ,  C08G81/02 ,  C08G81/024 ,  C08L1/10 ,  C08L23/10 ,  C08L23/12

Abstract: A modified cellulose is provided. The modified cellulose is represented by the chemical formula (1): wherein n is between 60 and 2500, at least one R is selected from one of the group consisting of R1 is C11 to C32 alkyl group or C11 to C32 alkenyl group, R2 is hydrogen, C3 to C29 alkyl group or C3 to C29 alkenyl group, R3 is C3 to C29 alkyl group or C3 to C29 alkenyl group, R4 is C4 to C8 cycloalkyl group or C4 to C8 cycloalkenyl group, n2 is between 15 and 33, n4 is between 20 and 40.

Abstract translation: 提供了改性纤维素。 改性纤维素由化学式（1）表示：其中n为60至2500，至少一个R选自R1为C11至C32烷基或C11至C32烯基，R2为 氢，C3至C29烷基或C3至C29烯基，R3为C3至C29烷基或C3至C29烯基，R4为C4至C8环烷基或C4至C8环烯基，n2为15至33，n4 在20到40之间。

公开(公告)号：US20240192597A1

公开(公告)日：2024-06-13

申请号：US18493972

申请日：2023-10-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Ying HSU ,  Yao-Jheng HUANG ,  Ming-Tzung WU ,  Chin-Hua CHANG ,  Te-Yi CHANG

IPC: G03F7/039 ,  C08G59/16 ,  C08G59/24 ,  C08G59/42 ,  C08G59/62 ,  G03F7/32

CPC classification number: G03F7/0392 ,  C08G59/1455 ,  C08G59/245 ,  C08G59/4238 ,  C08G59/628 ,  G03F7/322

Abstract: A polymer is formed by a reaction of phenolic epoxy resin or bisphenol epoxy resin and carboxylic acid, wherein the phenolic epoxy resin has a chemical structure of




wherein W is H, alkyl group, or halogen. R1 is methylene, methylene diphenyl, dimethylene benzene, tetrahydrodicyclopentadiene, or




n=1 to 8. The bisphenol epoxy resin has a chemical structure of




wherein Z is H or alkyl group; R4 is methylene, methylmethylene, dimethylmethylene, ethylmethylmethylene, bi(trifluoromethyl)methylene, fluorenylidene, or sulfonyl group; and p=1 to 10. The carboxylic acid has a chemical structure of HOOC—Ar—(—X)m, HOOC—R2, or a combination thereof, wherein Ar is benzene or naphthalene; X is hydroxy group, alkoxy group, or alkyl group, and at least one X is hydroxy group; m=1 to 3, wherein R2 is C3-7 alkyl group.

公开(公告)号：US20220334480A1

公开(公告)日：2022-10-20

申请号：US17481961

申请日：2021-09-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yao-Jheng HUANG ,  Te-Yi CHANG ,  Chin-Hua CHANG ,  Ming-Tzung WU ,  Yu-Ying HSU

IPC: G03F7/031 ,  C07C309/76 ,  G03F7/032

Abstract: A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.