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    Wafer releasing
    1.
    发明授权
    Wafer releasing 有权

    公开(公告)号：US10186445B2

    公开(公告)日：2019-01-22

    申请号：US15209390

    申请日：2016-07-13

    Applicant: Infineon Technologies AG

    Inventor： Mathias Male ,  Christian Maier ,  Philemon Schweizer ,  Manfred Bucher ,  Thomas Steiner

    IPC: H01L21/683 ,  G03F7/20 ,  C23C16/458 ,  H01L21/687 ,  H02N13/00

    Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

    Wafer releasing
    2.
    发明授权
    Wafer releasing 有权
    晶圆释放

    公开(公告)号：US09410249B2

    公开(公告)日：2016-08-09

    申请号：US14279137

    申请日：2014-05-15

    Applicant: Infineon Technologies AG

    Inventor： Mathias Male ,  Christian Maier ,  Philemon Schweizer ,  Manfred Bucher ,  Thomas Steiner

    IPC: H01L21/683 ,  C23C16/458 ,  H01L21/687 ,  H02N13/00

    CPC classification number: H01L21/6833 ,  C23C16/458 ,  C23C16/4585 ,  G03F7/707 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785 ,  H02N13/00

    Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

    Abstract translation: 本发明的实施例提供一种用于处理包括第一和第二主表面的晶片的卡盘系统。 卡盘系统包括卡盘，卡盘构造成将晶片保持在面向卡盘的第二主表面和释放装置。 卡盘系统还包括构造成将释放装置提升离开卡盘的致动器。 释放装置构造成使得释放装置在被提升时在晶片的第二主表面的边缘部分处与晶片机械地接合，从而将晶片从卡盘释放。

    Wafer Releasing
    3.
    发明申请
    Wafer Releasing 有权
    晶圆释放

    公开(公告)号：US20150332951A1

    公开(公告)日：2015-11-19

    申请号：US14279137

    申请日：2014-05-15

    Applicant: Infineon Technologies AG

    Inventor： Mathias Male ,  Christian Maier ,  Philemon Schweizer ,  Manfred Bucher ,  Thomas Steiner

    IPC: H01L21/683

    CPC classification number: H01L21/6833 ,  C23C16/458 ,  C23C16/4585 ,  G03F7/707 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785 ,  H02N13/00

    Abstract: Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.

    Abstract translation: 本发明的实施例提供一种用于处理包括第一和第二主表面的晶片的卡盘系统。 卡盘系统包括卡盘，卡盘构造成将晶片保持在面向卡盘的第二主表面和释放装置。 卡盘系统还包括构造成将释放装置提升离开卡盘的致动器。 释放装置构造成使得释放装置在被提升时在晶片的第二主表面的边缘部分处与晶片机械地接合，从而将晶片从卡盘释放。

    SYSTEMS AND METHODS FOR NON-VOLATILE MEMORY
    4.
    发明申请
    SYSTEMS AND METHODS FOR NON-VOLATILE MEMORY 有权
    非易失性存储器的系统和方法

    公开(公告)号：US20150138906A1

    公开(公告)日：2015-05-21

    申请号：US14085991

    申请日：2013-11-21

    Applicant: Infineon Technologies AG

    Inventor： Wolfgang Scherr ,  Michael Sorger ,  Guenther Wellenzohn ,  Magdalena Forster ,  Philemon Schweizer ,  Katharina Schmut ,  Bernhard Goller ,  Mario Motz

    IPC: G11C5/14

    CPC classification number: G11C5/141

    Abstract: A self powered memory system is disclosed. The system includes a volatile supply component, a battery component, a switch component, and a volatile memory component. The volatile supply component is configured to provide a time varying supply. The battery component is configured to generate a non-volatile supply. The switch component is configured to generate a persistent supply from the time varying supply and the non-volatile supply. The volatile memory component is configured to maintain data by using the persistent supply.

    Abstract translation: 公开了一种自供电的存储器系统。 该系统包括易失性电源组件，电池组件，开关组件和易失性存储器组件。 易失性供应部件配置成提供时变电源。 电池组件配置成产生非易失性电源。 开关组件被配置为从时变电源和非易失性电源产生持续电源。 易失性存储器组件被配置为通过使用持续电源来维护数据。

    Systems and methods for non-volatile memory
    7.
    发明授权
    Systems and methods for non-volatile memory 有权
    用于非易失性存储器的系统和方法

    公开(公告)号：US09064557B2

    公开(公告)日：2015-06-23

    申请号：US14085991

    申请日：2013-11-21

    Applicant: Infineon Technologies AG

    Inventor： Wolfgang Scherr ,  Michael Sorger ,  Guenther Wellenzohn ,  Magdalena Forster ,  Philemon Schweizer ,  Katharina Schmut ,  Bernhard Goller ,  Mario Motz

    IPC: G11C7/00 ,  G11C5/14

    CPC classification number: G11C5/141

    Abstract: A self powered memory system is disclosed. The system includes a volatile supply component, a battery component, a switch component, and a volatile memory component. The volatile supply component is configured to provide a time varying supply. The battery component is configured to generate a non-volatile supply. The switch component is configured to generate a persistent supply from the time varying supply and the non-volatile supply. The volatile memory component is configured to maintain data by using the persistent supply.

    Abstract translation: 公开了一种自供电的存储器系统。 该系统包括易失性电源组件，电池组件，开关组件和易失性存储器组件。 易失性供应部件配置成提供时变电源。 电池组件配置成产生非易失性电源。 开关组件被配置为从时变电源和非易失性电源产生持续电源。 易失性存储器组件被配置为通过使用持续电源来维护数据。

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