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    METHOD FOR MANUFACTURING DISPLAY PANEL
    1.
    发明申请
    METHOD FOR MANUFACTURING DISPLAY PANEL 审中-公开
    制造显示面板的方法

    公开(公告)号：US20140290841A1

    公开(公告)日：2014-10-02

    申请号：US14197159

    申请日：2014-03-04

    Applicant: InnoLux Corporation

    Inventor： Chi-Che TSAI ,  Wei-Yen WU ,  Yu-Ren WANG

    IPC: G02F1/1333

    CPC classification number: H01L27/1266

    Abstract: The present invention provides a method for manufacturing a display panel, comprising the following steps: (A) providing a carrier with a separation layer formed thereon; (B) laminating a glass substrate on the hydrophobic surface of the separation layer to make the separation layer between the carrier and the glass substrate; (C) forming a display unit on the glass substrate; and (D) separating the glass substrate from the carrier and the separation layer to obtain a display panel; wherein the separation layer has a hydrophobic surface with a water contacting angle in a range from 25° to 180°.

    Abstract translation: 本发明提供了一种制造显示面板的方法，包括以下步骤：（A）提供载体上形成有分离层; （B）将玻璃基板层叠在分离层的疏水性表面上，使载体和玻璃基板之间的分离层形成; （C）在玻璃基板上形成显示单元; 和（D）从载体和分离层分离玻璃基板以获得显示面板; 其中所述分离层具有水接触角在25°至180°范围内的疏水表面。

    ELEMENT SUBSTRATE, DISPLAY APPARATUS AND MANUFACTURING METHOD OF ELEMENT SUBSTRATE
    5.
    发明申请
    ELEMENT SUBSTRATE, DISPLAY APPARATUS AND MANUFACTURING METHOD OF ELEMENT SUBSTRATE 审中-公开
    元件基板，显示装置和元件基板的制造方法

    公开(公告)号：US20150062842A1

    公开(公告)日：2015-03-05

    申请号：US14456376

    申请日：2014-08-11

    Applicant: InnoLux Corporation

    Inventor： Chi-Che TSAI ,  Hui-Chen HSU ,  Wei-Yen WU ,  Wei-Yun CHANG

    IPC: H05K1/02 ,  H05K3/46 ,  H05K3/00 ,  H05K1/03

    CPC classification number: G02F1/133305

    Abstract: An element substrate comprises a flexible substrate, an element layer, a buffer layer and an interface layer. The element layer is disposed on the flexible substrate. The buffer layer is disposed on the flexible substrate. The buffer layer and the element layer are disposed on the opposite sides of the flexible substrate. The interface layer is disposed between the flexible substrate and the buffer layer and includes partial material of both of the flexible substrate and the buffer layer. A display apparatus including the element substrate and a manufacturing method of the element substrate are disclosed.

    Abstract translation: 元件衬底包括柔性衬底，元件层，缓冲层和界面层。 元件层设置在柔性基板上。 缓冲层设置在柔性基板上。 缓冲层和元件层设置在柔性基板的相对侧上。 界面层设置在柔性基板和缓冲层之间，并且包括柔性基板和缓冲层两者的部分材料。 公开了一种包括元件基板的显示装置和元件基板的制造方法。

    Method for manufacturing electronic device
    7.
    发明申请
    Method for manufacturing electronic device 审中-公开

    公开(公告)号：US20190027458A1

    公开(公告)日：2019-01-24

    申请号：US16142151

    申请日：2018-09-26

    Applicant: InnoLux Corporation

    Inventor： Yan-Syun WANG ,  Chi-Che TSAI ,  Chien-Feng LI ,  Wei-Yun CHANG ,  Wei-Hsien CHANG ,  Po-Ching LIN

    IPC: H01L23/00 ,  H01L21/762 ,  H01L21/02

    Abstract: A method for manufacturing an electronic device is disclosed, which includes the following steps: providing a first substrate and modifying a surface of the first substrate to obtain a modified surface; applying silane or derivatives thereof on the modified surface to form an adhesion precursor layer; heat-treating the adhesion precursor layer to form an adhesion layer; forming an inorganic layer on the adhesion layer; and forming an active unit on the inorganic layer, wherein the inorganic layer is disposed between the adhesion layer and the active unit.

    HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20200281068A1

    公开(公告)日：2020-09-03

    申请号：US16878675

    申请日：2020-05-20

    Applicant: Innolux Corporation

    Inventor： Yan-Syun WANG ,  Chi-Che TSAI ,  Wei-Yen WU ,  I-Yin LI

    IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22 ,  H01P3/08

    Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

    HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20180206329A1

    公开(公告)日：2018-07-19

    申请号：US15858004

    申请日：2017-12-29

    Applicant: Innolux Corporation

    Inventor： Yan-Syun WANG ,  Chi-Che TSAI ,  Wei-Yen WU ,  I-Yin LI

    IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

    Abstract: A high-frequency electronic device including a dielectric substrate, a first patterned metal layer and a second patterned metal layer is provided. The dielectric substrate has a first region and a second region. The first patterned metal layer is disposed on a first side of the dielectric substrate and corresponds to the first region, wherein the first region and the second region have different etching rates with respect to an etching solution. The second patterned metal layer is disposed on the first side or a second side opposite to the first side of the dielectric substrate.

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