公开(公告)号：US20250028675A1

公开(公告)日：2025-01-23

申请号：US18791963

申请日：2024-08-01

Applicant: Intel Corporation

Inventor： JOYDEEP RAY ,  SELVAKUMAR PANNEER ,  SAURABH TANGRI ,  BEN ASHBAUGH ,  SCOTT JANUS ,  ABHISHEK APPU ,  VARGHESE GEORGE ,  RAVISHANKAR IYER ,  NILESH JAIN ,  PATTABHIRAMAN K ,  ALTUG KOKER ,  MIKE MACPHERSON ,  JOSH MASTRONARDE ,  ELMOUSTAPHA OULD-AHMED-VALL ,  JAYAKRISHNA P. S ,  ERIC SAMSON

IPC: G06F15/78 ,  G06F7/544 ,  G06F7/575 ,  G06F7/58 ,  G06F9/30 ,  G06F9/38 ,  G06F9/50 ,  G06F12/02 ,  G06F12/06 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0811 ,  G06F12/0862 ,  G06F12/0866 ,  G06F12/0871 ,  G06F12/0875 ,  G06F12/0882 ,  G06F12/0888 ,  G06F12/0891 ,  G06F12/0893 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/1009 ,  G06F12/128 ,  G06F15/80 ,  G06F17/16 ,  G06F17/18 ,  G06N3/08 ,  G06T1/20 ,  G06T1/60 ,  G06T15/06 ,  H03M7/46

Abstract: Embodiments described herein include software, firmware, and hardware that provides techniques to enable deterministic scheduling across multiple general-purpose graphics processing units. One embodiment provides a multi-GPU architecture with uniform latency. One embodiment provides techniques to distribute memory output based on memory chip thermals. One embodiment provides techniques to enable thermally aware workload scheduling. One embodiment provides techniques to enable end to end contracts for workload scheduling on multiple GPUs.

公开(公告)号：US20220122215A1

公开(公告)日：2022-04-21

申请号：US17428216

申请日：2020-03-14

Applicant: Intel Corporation

Inventor： JOYDEEP RAY ,  SELVAKUMAR PANNEER ,  SAURABH TANGRI ,  BEN ASHBAUGH ,  SCOTT JANUS ,  ABHISHEK APPU ,  VARGHESE GEORGE ,  RAVISHANKAR IYER ,  NILESH JAIN ,  PATTABHIRAMAN K ,  ALTUG KOKER ,  MIKE MACPHERSON ,  JOSH MASTRONARDE ,  ELMOUSTAPHA OULD-AHMED-VALL ,  JAYAKRISHNA P. S ,  ERIC SAMSON

IPC: G06T1/60 ,  G06F12/06 ,  G06F12/1009 ,  G06T1/20 ,  G06F12/0875 ,  G06F9/38

Abstract: Embodiments described herein include software, firmware, and hardware that provides techniques to enable deterministic scheduling across multiple general-purpose graphics processing units. One embodiment provides a multi-GPU architecture with uniform latency. One embodiment provides techniques to distribute memory output based on memory chip thermals. One embodiment provides techniques to enable thermally aware workload scheduling. One embodiment provides techniques to enable end to end contracts for workload scheduling on multiple GPUs.

公开(公告)号：US20220066931A1

公开(公告)日：2022-03-03

申请号：US17310540

申请日：2020-03-14

Applicant: INTEL CORPORATION

Inventor： JOYDEEP RAY ,  NIRANJAN COORAY ,  SUBRAMANIAM MAIYURAN ,  ALTUG KOKER ,  PRASOONKUMAR SURTI ,  VARGHESE GEORGE ,  VALENTIN ANDREI ,  ABHISHEK APPU ,  GUADALUPE GARCIA ,  PATTABHIRAMAN K ,  SUNGYE KIM ,  SANJAY KUMAR ,  PRATIK MAROLIA ,  ELMOUSTAPHA OULD-AHMED-VALL ,  VASANTH RANGANATHAN ,  WILLIAM SADLER ,  LAKSHMINARAYANAN STRIRAMASSARMA

IPC: G06F12/0802

Abstract: Embodiments described herein provide techniques to enable the dynamic reconfiguration of memory on a general-purpose graphics processing unit. One embodiment described herein enables dynamic reconfiguration of cache memory bank assignments based on hardware statistics. One embodiment enables for virtual memory address translation using mixed four kilobyte and sixty-four kilobyte pages within the same page table hierarchy and under the same page directory. One embodiment provides for a graphics processor and associated heterogenous processing system having near and far regions of the same level of a cache hierarchy.