公开(公告)号：US09755334B2

公开(公告)日：2017-09-05

申请号：US14750875

申请日：2015-06-25

Applicant: Intel Corporation

Inventor： Xiang Li ,  Yun Ling ,  Chung-Hao J. Chen ,  Hao-Han Hsu ,  Shyamjith Mohan ,  Kuan-Yu Chen

IPC: H01R12/00 ,  H01R12/70 ,  H01R13/6585 ,  H01R12/79 ,  H01R13/6592 ,  H01R12/77 ,  H01R12/59 ,  H01R12/88

CPC classification number: H01R12/7076 ,  H01R12/594 ,  H01R12/7011 ,  H01R12/774 ,  H01R12/775 ,  H01R12/79 ,  H01R12/88 ,  H01R13/6585 ,  H01R13/6592

Abstract: A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.

公开(公告)号：US09219463B2

公开(公告)日：2015-12-22

申请号：US13760363

申请日：2013-02-06

Applicant: INTEL CORPORATION

Inventor： Chung-Hao J. Chen

IPC: H03H7/00 ,  H03H7/42

CPC classification number: H03H7/427

Abstract: A system, hybrid common mode choke, and method are described herein. The system includes a differential signal transmitter and a differential signal receiver. A differential signal transmitter ground and a differential signal receiver ground are electrically disconnected in a manner that enables a common mode filter. The transmitter ground and the receiver ground may be coupled using an inductor, a resistor, a capacitor, or any combination thereof.

Abstract translation: 本文描述了系统，混合共模扼流圈和方法。 该系统包括差分信号发射器和差分信号接收器。 差分信号发射器接地和差分信号接收器接地以能够实现共模滤波器的方式电气断开。 发射机接地和接收机接地可以使用电感器，电阻器，电容器或其任何组合来耦合。

公开(公告)号：US10403581B2

公开(公告)日：2019-09-03

申请号：US15721729

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen ,  Dong-Ho Han

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L21/02 ,  H05K1/02 ,  H01L23/66 ,  H01L23/00 ,  H01L23/16

Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.

公开(公告)号：US20190103366A1

公开(公告)日：2019-04-04

申请号：US15721729

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen ,  Dong-Ho Han

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L21/48 ,  H01L21/02 ,  H05K1/02 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/02227 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/142 ,  H01L23/16 ,  H01L23/3114 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/153 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271

Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.

公开(公告)号：US20180287411A1

公开(公告)日：2018-10-04

申请号：US15478501

申请日：2017-04-04

Applicant: INTEL CORPORATION

Inventor： Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen

IPC: H02J7/02 ,  H02J50/12 ,  H02J50/80 ,  H02J50/90 ,  H01F38/14 ,  H01F41/04 ,  H01F27/29 ,  H01F27/245

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

公开(公告)号：US20170288445A1

公开(公告)日：2017-10-05

申请号：US15088277

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Chung-Hao J. Chen ,  Zhen Yao ,  Songnan Yang ,  Jonathan Rosenfeld ,  Sreenivas Kasturi

IPC: H02J7/02 ,  H02J7/04

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce the strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.

公开(公告)号：US09525441B2

公开(公告)日：2016-12-20

申请号：US14567778

申请日：2014-12-11

Applicant: Intel Corporation

Inventor： Chung-Hao J. Chen ,  Howard L. Heck ,  Pujitha Davuluri ,  Hao-Han Hsu

IPC: H04B1/04 ,  H04L25/02

CPC classification number: H04B1/0475 ,  H04L25/0272 ,  H04L25/0274 ,  H04L25/0276 ,  H04L25/028 ,  H04L25/0282 ,  H04L25/14

Abstract: Techniques for noise reduction are described herein. The techniques include an apparatus for noise reduction including a voltage tuner to adjust a voltage swing for a signal line in a differential signal line pair. The apparatus may also include a timing module to adjust a timing skew between the differential signal line pair, wherein the voltage swing and timing skew adjustment introduce a common mode noise in the differential signal line pair to reduce a radio frequency interference (RFI) noise coupling.

Abstract translation: 本文描述了降噪技术。 这些技术包括用于噪声降低的装置，包括用于调整差分信号线对中的信号线的电压摆幅的电压调谐器。 该装置还可以包括用于调整差分信号线对之间的定时偏移的定时模块，其中电压摆幅和定时偏移调整在差分信号线对中引入共模噪声，以减少射频干扰（RFI）噪声耦合 。

公开(公告)号：US20160173142A1

公开(公告)日：2016-06-16

申请号：US14567778

申请日：2014-12-11

Applicant: Intel Corporation

Inventor： Chung-Hao J. Chen ,  Howard L. Heck ,  Pujitha Davuluri ,  Hao-Han Hsu

IPC: H04B1/04

CPC classification number: H04B1/0475 ,  H04L25/0272 ,  H04L25/0274 ,  H04L25/0276 ,  H04L25/028 ,  H04L25/0282 ,  H04L25/14

Abstract: Techniques for noise reduction are described herein. The techniques include an apparatus for noise reduction including a voltage tuner to adjust a voltage swing for a signal line in a differential signal line pair. The apparatus may also include a timing module to adjust a timing skew between the differential signal line pair, wherein the voltage swing and timing skew adjustment introduce a common mode noise in the differential signal line pair to reduce a radio frequency interference (RFI) noise coupling.

Abstract translation: 本文描述了降噪技术。 这些技术包括用于噪声降低的装置，包括用于调整差分信号线对中的信号线的电压摆幅的电压调谐器。 该装置还可以包括用于调整差分信号线对之间的定时偏移的定时模块，其中电压摆幅和定时偏移调整在差分信号线对中引入共模噪声，以减少射频干扰（RFI）噪声耦合 。

公开(公告)号：US11177680B2

公开(公告)日：2021-11-16

申请号：US15478501

申请日：2017-04-04

Applicant: INTEL CORPORATION

Inventor： Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen

IPC: H02J7/02 ,  H02J50/12 ,  H01F38/14 ,  H04B5/00 ,  H01F27/255 ,  H02J50/10 ,  H02J50/70 ,  H01F27/36 ,  H02J50/80 ,  B60L53/12 ,  H02J7/00

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

公开(公告)号：US10950555B2

公开(公告)日：2021-03-16

申请号：US16481031

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Kaladhar Radhakrishnan ,  Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen ,  Dong-Ho Han

IPC: H01L23/66 ,  H01L23/552 ,  H01L21/48 ,  H01L23/498 ,  H01L25/18 ,  H05K1/18 ,  H01L23/64 ,  H01L49/02

Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.