公开(公告)号：US12167530B2

公开(公告)日：2024-12-10

申请号：US17127407

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  James Panakkal ,  Min Suet Lim ,  Aiswarya M. Pious

IPC: H05K1/02 ,  H05K9/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

公开(公告)号：US11616000B2

公开(公告)日：2023-03-28

申请号：US17359085

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Jaejin Lee ,  Jerrod Peterson ,  Kyle Arrington

IPC: H01L23/373 ,  H01L23/60 ,  H01L23/552 ,  H01L23/528

Abstract: Methods and apparatus are disclosed to provide electrical shielding for integrated circuit packages using a thermal interface material. An integrated circuit package includes a substrate including a ground plane layer and a solder mask; a semiconductor die attached to the substrate, the solder mask layer separating the semiconductor die from the ground plane layer; and a thermal interface material surrounding at least a portion of the semiconductor die, the thermal interface material electrically coupled to the ground plane layer.

公开(公告)号：US11081450B2

公开(公告)日：2021-08-03

申请号：US16585052

申请日：2019-09-27

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

IPC: H01L23/552 ,  H01L21/48 ,  H01L23/367 ,  H01L23/498

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

公开(公告)号：US20210104995A1

公开(公告)日：2021-04-08

申请号：US17122075

申请日：2020-12-15

Applicant: Intel Corporation

Inventor： Kae-An Liu ,  Jaejin Lee ,  David W. Browning

IPC: H03H7/01 ,  H05K7/20 ,  H01Q1/02

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

公开(公告)号：US20200027844A1

公开(公告)日：2020-01-23

申请号：US16585052

申请日：2019-09-27

Applicant: Intel Corporation

Inventor： Dong-Ho Han ,  Jaejin Lee ,  Je-Young Chang ,  Jerrod Peterson ,  Mark Carbone

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/367 ,  H01L21/48

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

公开(公告)号：US10181682B2

公开(公告)日：2019-01-15

申请号：US15392054

申请日：2016-12-28

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Hao-Han Hsu

IPC: H01R13/648 ,  H01R13/6581 ,  H01R13/6598 ,  H01R43/26

Abstract: Particular embodiments described herein provide for a connector shield that can include a main body, a shield portion to shield electromagnetic radiation from a connector, and a support portion. The main body can be removably secured to the connector. The shield portion includes lossy material and the shield portion is not grounded. The connector can include connection lines and the connection lines are at least partially inside a cavity of the shield portion.

公开(公告)号：US11177680B2

公开(公告)日：2021-11-16

申请号：US15478501

申请日：2017-04-04

Applicant: INTEL CORPORATION

Inventor： Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen

IPC: H02J7/02 ,  H02J50/12 ,  H01F38/14 ,  H04B5/00 ,  H01F27/255 ,  H02J50/10 ,  H02J50/70 ,  H01F27/36 ,  H02J50/80 ,  B60L53/12 ,  H02J7/00

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

公开(公告)号：US11145568B2

公开(公告)日：2021-10-12

申请号：US16215228

申请日：2018-12-10

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Hao-Han Hsu

IPC: H01L23/40 ,  H01F7/02 ,  H01L23/427 ,  H01L23/42

Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.

公开(公告)号：US20210120665A1

公开(公告)日：2021-04-22

申请号：US17133113

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  Isaac Simpson ,  Dong-Ho Han ,  Jose Salazar Delgado ,  Arturo Navarro Alvarez

IPC: H05K1/02

Abstract: Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.

公开(公告)号：US10950555B2

公开(公告)日：2021-03-16

申请号：US16481031

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Kaladhar Radhakrishnan ,  Jaejin Lee ,  Hao-Han Hsu ,  Chung-Hao J. Chen ,  Dong-Ho Han

IPC: H01L23/66 ,  H01L23/552 ,  H01L21/48 ,  H01L23/498 ,  H01L25/18 ,  H05K1/18 ,  H01L23/64 ,  H01L49/02

Abstract: Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.