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    SEMICONDUCTOR DEVICE HAVING VOLTAGE REGULATORS EMBEDDED IN LAYERED PACKAGE
    4.
    发明申请
    SEMICONDUCTOR DEVICE HAVING VOLTAGE REGULATORS EMBEDDED IN LAYERED PACKAGE 有权

    公开(公告)号：US20210043620A1

    公开(公告)日：2021-02-11

    申请号：US17069517

    申请日：2020-10-13

    Applicant: Intel Corporation

    Inventor： Edward A. Burton

    IPC: H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00

    Abstract: A computing chip can include one or more voltage regulators to decrease a standard voltage, such as twelve volts, to a relatively low operating voltage of its processing cores, typically around one volt. Because the power consumed by the cores can be substantial, such as three hundred watts or more, it is desirable to locate the voltage regulators as close as possible to the cores, to reduce the distances that relatively large currents have to travel in the chip circuitry. The voltage regulators can be embedded within the package, such as in a layered structure, in a layer that electrically connects to the cores. While the cores are typically manufactured using the smallest possible lithographic features, the voltage regulators are less demanding and can instead use relatively large lithographic features, which can be formed using relatively old technology, and can therefore be relatively inexpensive.

    MULTIPLE RETICLE FIELD SEMICONDUCTOR DEVICES
    5.
    发明申请
    MULTIPLE RETICLE FIELD SEMICONDUCTOR DEVICES 审中-公开

    公开(公告)号：US20200066651A1

    公开(公告)日：2020-02-27

    申请号：US16611129

    申请日：2017-06-29

    Applicant: INTEL CORPORATION

    Inventor： Edward A. Burton ,  Mark T. Bohr ,  Murray Fitzpatrick Kelley ,  Shawn Michael Klauser

    IPC: H01L23/544 ,  H01L23/538 ,  G03F7/20

    Abstract: Techniques are described for fabricating integrated circuit devices that span multiple reticle fields. Integrated circuits formed within separate reticle fields are placed into electrical contact with each other by overlapping reticle fields to form an overlapping conductive interconnect. This overlapping conductive interconnect electrically connects an interconnect layer of a first reticle field with an interconnect layer of a second, laterally adjacent reticle field. The overlapping conductive interconnection extends into a common scribe zone between adjacent reticle fields.

    Semiconductor device having voltage regulators embedded in layered package
    10.
    发明授权
    Semiconductor device having voltage regulators embedded in layered package 有权

    公开(公告)号：US11502071B2

    公开(公告)日：2022-11-15

    申请号：US17069517

    申请日：2020-10-13

    Applicant: Intel Corporation

    Inventor： Edward A. Burton

    IPC: H01L25/18 ,  H01L23/538 ,  H01L23/31 ,  H01L25/00

    Abstract: A computing chip can include one or more voltage regulators to decrease a standard voltage, such as twelve volts, to a relatively low operating voltage of its processing cores, typically around one volt. Because the power consumed by the cores can be substantial, such as three hundred watts or more, it is desirable to locate the voltage regulators as close as possible to the cores, to reduce the distances that relatively large currents have to travel in the chip circuitry. The voltage regulators can be embedded within the package, such as in a layered structure, in a layer that electrically connects to the cores. While the cores are typically manufactured using the smallest possible lithographic features, the voltage regulators are less demanding and can instead use relatively large lithographic features, which can be formed using relatively old technology, and can therefore be relatively inexpensive.

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