公开(公告)号：US20180276911A1

公开(公告)日：2018-09-27

申请号：US15572334

申请日：2016-12-31

Applicant: INTEL CORPORATION

Inventor： Eric Dwight MCAFEE ,  Andrew LARSON ,  Mark E. SPRENGER ,  Mark Angus MACDONALD ,  Ralph V. MIELE

IPC: G07C5/08 ,  G01M17/007 ,  G07C5/00

CPC classification number: G07C5/085 ,  G01M17/007 ,  G07C5/006 ,  G07C5/008 ,  G07C5/08 ,  G07C5/0808

Abstract: In an example, there is disclosed a smart sensor for monitoring a vehicle, including: a sensor array comprising a mechanical input sensor; a network interface; a processor; and one or more logic elements providing a data engine to: collect an vibration input from the mechanical input sensor; and report the data from the mechanical input sensor to a data aggregator via the network interface. There is also disclosed a data aggregation server engine to aggregate and correlate inputs from the smart sensor.

公开(公告)号：US20240096741A1

公开(公告)日：2024-03-21

申请号：US18520425

申请日：2023-11-27

Applicant: Intel Corporation

Inventor： Phil GENG ,  David SHIA ,  Ralph V. MIELE ,  Guixiang TAN ,  Jimmy CHUANG ,  Sandeep AHUJA ,  Sanjoy K. SAHA ,  Jeffory L. SMALLEY ,  Mark E. SPRENGER

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

公开(公告)号：US20220210906A1

公开(公告)日：2022-06-30

申请号：US17697909

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Mark E. SPRENGER

IPC: H05K1/02 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes a cooling assembly. The cooling assembly includes a cooling mass; a first heat spreader; a second heat spreader; a spring element; and, hinge components to form a hinge that the first and second heat spreaders rotate about. The spring element to apply a force to the first and second heat spreaders that causes the first and second heat spreaders to rotate about the hinge toward a circuit board located between the first and second heat spreaders.

公开(公告)号：US20200278689A1

公开(公告)日：2020-09-03

申请号：US16649584

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： Andrew LARSON ,  Subhas BALAPPANAVAR ,  Daniel POHL ,  Koba NATROSHVILI ,  Cornelius BUERKLE ,  Ellann COHEN ,  Andreas HERDEN ,  Ralph V. MIELE ,  David PIDWERBECKI ,  Roman SCHICK ,  Henning SCHROEDER ,  Mark E. SPRENGER

IPC: G05D1/02 ,  G08G5/00 ,  H04N13/243 ,  H04N5/225 ,  H04N5/247 ,  H04N5/76 ,  B64C39/02 ,  B64D47/08

Abstract: Autonomous unmanned vehicles (UVs) for responding to situations are described. Embodiments include UVs that launch upon detection of a situation, operate in the area of the situation, and collect and send information about the situation. The UVs may launch from a vehicle involved in the situation, a vehicle responding to the situation, or from a fixed station. In other embodiments, the UVs also provide communications relays to the situation and may facilitate access to the situation by responders. The UVs further may act as decoupled sensors for vehicles. In still other embodiments, the collected information may be used to recreate the situation as it happened.

公开(公告)号：US20180332734A1

公开(公告)日：2018-11-15

申请号：US15595765

申请日：2017-05-15

Applicant: Intel Corporation

Inventor： Tozer J. BANDORAWALLA ,  Mark E. SPRENGER

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L21/4882 ,  G06F1/20 ,  H01L23/473 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064

Abstract: Apparatuses, systems and methods associated with design of cold plates for cooling electrical systems are disclosed herein. In embodiments, a cold plate may include a base and a lid affixed to a side of the base via a braze joint, wherein the braze joint may extend around a perimeter of the lid. The lid may include a dam having a perimeter located inside of the perimeter of the lid, wherein the dam may be compressed against the side of the base and may be liquid-tight to the side of the base, and wherein a cavity may be located between the base and the lid within the perimeter of the dam to provide a circulation passage for a liquid coolant. Other embodiments may be described and/or claimed.