公开(公告)号：US20220210950A1

公开(公告)日：2022-06-30

申请号：US17697894

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA

IPC: H05K7/20 ,  H01L23/40

Abstract: A molded ceramic layer of a multilayer cooling assembly back plate is described. The molded ceramic layer has an opening on a side of the molded ceramic layer that is to face a back side of a circuit board. The opening is aligned with a location of a back side component on the back side of the circuit board.

公开(公告)号：US20220208645A1

公开(公告)日：2022-06-30

申请号：US17696694

申请日：2022-03-16

Applicant: Intel Corporation

Inventor： Olaotan ELENITOBA-JOHNSON ,  Eric ERIKE ,  Jeffory L. SMALLEY ,  Ulises ENCARNACION ,  Ralph V. MIELE ,  Phil GENG ,  Sri Priyanka TUNUGUNTLA ,  Shaun G. IMMEKER

IPC: H01L23/40

Abstract: An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

公开(公告)号：US20180276911A1

公开(公告)日：2018-09-27

申请号：US15572334

申请日：2016-12-31

Applicant: INTEL CORPORATION

Inventor： Eric Dwight MCAFEE ,  Andrew LARSON ,  Mark E. SPRENGER ,  Mark Angus MACDONALD ,  Ralph V. MIELE

IPC: G07C5/08 ,  G01M17/007 ,  G07C5/00

CPC classification number: G07C5/085 ,  G01M17/007 ,  G07C5/006 ,  G07C5/008 ,  G07C5/08 ,  G07C5/0808

Abstract: In an example, there is disclosed a smart sensor for monitoring a vehicle, including: a sensor array comprising a mechanical input sensor; a network interface; a processor; and one or more logic elements providing a data engine to: collect an vibration input from the mechanical input sensor; and report the data from the mechanical input sensor to a data aggregator via the network interface. There is also disclosed a data aggregation server engine to aggregate and correlate inputs from the smart sensor.

公开(公告)号：US20220174843A1

公开(公告)日：2022-06-02

申请号：US17676100

申请日：2022-02-18

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Sandeep AHUJA ,  Jeffory L. SMALLEY

IPC: H05K7/20 ,  H05K7/14

Abstract: An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

公开(公告)号：US20210378099A1

公开(公告)日：2021-12-02

申请号：US17381092

申请日：2021-07-20

Applicant: Intel Corporation

Inventor： Phil GENG ,  Timothy Glen HANNA ,  Xiaoning YE ,  Sandeep AHUJA ,  Jacob MCMILLIAN ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY

IPC: H05K1/18 ,  H01L23/367 ,  H01L23/40 ,  H05K1/02

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

公开(公告)号：US20220117079A1

公开(公告)日：2022-04-14

申请号：US17555250

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Jeffory L. SMALLEY ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.

公开(公告)号：US20210410329A1

公开(公告)日：2021-12-30

申请号：US17475026

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Mengqi LIU ,  Phil GENG ,  Ralph V. MIELE ,  Sandeep AHUJA ,  David SHIA

IPC: H05K7/20 ,  H01L23/367

Abstract: An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

公开(公告)号：US20210307153A1

公开(公告)日：2021-09-30

申请号：US16828447

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Feroz MOHAMMAD ,  Ralph V. MIELE ,  Thomas BOYD ,  Steven A. KLEIN ,  Gregorio R. MURTAGIAN ,  Eric W. BUDDRIUS ,  Daniel NEUMANN ,  Rolf LAIDO

IPC: H05K1/02 ,  H01R12/85 ,  H05K1/18

Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

公开(公告)号：US20240096741A1

公开(公告)日：2024-03-21

申请号：US18520425

申请日：2023-11-27

Applicant: Intel Corporation

Inventor： Phil GENG ,  David SHIA ,  Ralph V. MIELE ,  Guixiang TAN ,  Jimmy CHUANG ,  Sandeep AHUJA ,  Sanjoy K. SAHA ,  Jeffory L. SMALLEY ,  Mark E. SPRENGER

IPC: H01L23/427

CPC classification number: H01L23/427

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.

公开(公告)号：US20220117080A1

公开(公告)日：2022-04-14

申请号：US17555340

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Phil GENG ,  Sandeep AHUJA ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Casey WINKEL

IPC: H05K1/02 ,  H01L23/40 ,  H05K1/18

Abstract: An apparatus is described. The apparatus includes a ball grid array (BGA) chip package cooling assembly includes a back plate and a bolster plate. The bolster plate has frame arms. The BGA chip package is to be placed in a window formed by the frame arms and soldered to a region of a printed circuit board. The frame arms surround the region. The printed circuit board is to be subjected to a compressive force between the back plate and the bolster plate.