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公开(公告)号：US20150364343A1
公开(公告)日：2015-12-17
申请号：US14836461
申请日：2015-08-26
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20160042976A1
公开(公告)日：2016-02-11
申请号：US14921026
申请日：2015-10-23
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L21/48 , H01L21/3105 , H01L21/52 , H01L21/56
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20160043015A1
公开(公告)日：2016-02-11
申请号：US14921051
申请日：2015-10-23
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L23/367 , H01L23/00
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20150364341A1
公开(公告)日：2015-12-17
申请号：US14836447
申请日：2015-08-26
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L21/48
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20150364342A1
公开(公告)日：2015-12-17
申请号：US14836454
申请日：2015-08-26
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L21/48
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
摘要翻译： 公开了一种封装的组件，包括分配在有机封装上的热界面材料和制造方法。 该方法包括在电子组件上分配热界面材料（TIM）。 该方法还包括在盖子放置在电子组件上之前去除TIM的挥发性物质。 该方法还包括将盖子放置在TIM上方的电子组件上。 该方法还包括将盖子按压到电子组件上。
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公开(公告)号：US20150206851A1
公开(公告)日：2015-07-23
申请号：US14162411
申请日：2014-01-23
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20180047655A1
公开(公告)日：2018-02-15
申请号：US15791815
申请日：2017-10-24
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L23/367 , H01L21/321 , H01L21/324 , H01L21/48 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/66 , H01L23/04 , H01L23/42 , H01L23/00 , H01L21/3105 , H01L25/00 , H01L23/373 , H01L23/50
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20160043016A1
公开(公告)日：2016-02-11
申请号：US14921067
申请日：2015-10-23
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L23/367 , H01L23/00
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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公开(公告)号：US20160042977A1
公开(公告)日：2016-02-11
申请号：US14921072
申请日：2015-10-23
发明人： Isabel DE SOUSA , Annique LAVOIE , Eric SALVAS , Michel TURGEON
IPC分类号： H01L21/48 , H01L23/00 , H01L21/3105 , H01L21/324 , H01L21/321 , H01L21/52
CPC分类号： H01L23/3675 , H01L21/3105 , H01L21/321 , H01L21/324 , H01L21/481 , H01L21/4817 , H01L21/4882 , H01L21/50 , H01L21/52 , H01L21/563 , H01L21/565 , H01L22/10 , H01L22/12 , H01L22/20 , H01L23/04 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L23/50 , H01L24/83 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/83048 , H01L2224/83191 , H01L2224/832 , H01L2224/83201 , H01L2224/838 , H01L2224/83855 , H01L2224/83908 , H01L2224/83986 , H01L2924/06 , H01L2924/16251 , H01L2924/1659 , H01L2924/20102 , H01L2924/00 , H01L2924/00014
摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
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