公开(公告)号：US20150236693A1

公开(公告)日：2015-08-20

申请号：US14699920

申请日：2015-04-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： DIRK PFEIFFER ,  JEAN-OLIVIER PLOUCHART ,  PEILIN SONG

IPC: H03K19/003

CPC classification number: H03K19/003

Abstract: Methods, systems and devices related to authentication of chips using physical unclonable functions (PUFs) are disclosed. In preferred systems, differentials of PUFs are employed to minimize sensitivity to temperature variations as well as other factors that affect the reliability of PUF states. In particular, a PUF system can include PUF elements arranged in series and in parallel with respect to each other to facilitate the measurement of the differentials and generation of a resulting bit sequence for purposes of authenticating the chip. Other embodiments are directed to determining and filtering reliable and unreliable states that can be employed to authenticate a chip.

Abstract translation: 公开了使用物理不可克隆功能（PUF）的芯片认证相关的方法，系统和设备。 在优选的系统中，使用PUF的差异来最小化对温度变化的敏感性以及影响PUF状态的可靠性的其它因素。 特别地，PUF系统可以包括相对于彼此串联并联布置的PUF元件，以促进对差分的测量并产生所得到的位序列以便认证芯片。 其他实施例涉及确定和过滤可用于认证芯片的可靠和不可靠的状态。

公开(公告)号：US20180006855A1

公开(公告)日：2018-01-04

申请号：US15197058

申请日：2016-06-29

Applicant: International Business Machines Corporation

Inventor： WOORAM LEE ,  JEAN-OLIVIER PLOUCHART ,  ALBERTO VALDES GARCIA

IPC: H04L27/20 ,  H03D7/12 ,  H03C3/02

CPC classification number: H04L27/20 ,  H03C3/02 ,  H03C3/245 ,  H03D7/12 ,  H03D7/1433

Abstract: A commutating circuit includes a single-ended mixer and a passive network. The single-ended mixer includes a differential local oscillator terminal. The passive network includes a plurality of inductors and a capacitor. The plurality of inductors can be coupled to the differential local oscillator terminal. The plurality of inductors can provide an impedance in accordance with a common mode or a differential mode. The commutating circuit can be implemented via a device, a system and/or a method.

公开(公告)号：US20170229783A1

公开(公告)日：2017-08-10

申请号：US15493750

申请日：2017-04-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： DUIXIAN LIU ,  ARUN S. NATARAJAN ,  JEAN-OLIVIER PLOUCHART ,  SCOTT K. REYNOLDS

IPC: H01Q15/14 ,  H01Q1/38 ,  H01L25/00 ,  H01Q9/04

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

公开(公告)号：US20150288052A1

公开(公告)日：2015-10-08

申请号：US14725845

申请日：2015-05-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： DUIXIAN LIU ,  ARUN S. NATARAJAN ,  JEAN-OLIVIER PLOUCHART ,  SCOTT K. REYNOLDS

IPC: H01Q1/22 ,  H01L23/66 ,  H01L21/50 ,  H01L21/48 ,  H01L21/302

CPC classification number: H01Q15/142 ,  H01L21/302 ,  H01L21/486 ,  H01L21/50 ,  H01L23/5227 ,  H01L23/66 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/16225 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/0407

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Abstract translation: 公开了天线装置，天线系统及其制造方法。 一种这样的天线装置包括半导体芯片和芯片封装。 半导体芯片包括集成到半导体芯片的电介质层中的至少一个天线，并被配置为传输电磁波。 此外，芯片封装包括至少一个接地平面，其中半导体芯片安装在芯片封装上，使得接地平面设置在离天线预定距离处，以实现至少一部分 电磁波。

公开(公告)号：US20140071021A1

公开(公告)日：2014-03-13

申请号：US13796404

申请日：2013-03-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： DUIXIAN LIU ,  ARUN S. NATARAJAN ,  JEAN-OLIVIER PLOUCHART ,  SCOTT K. REYNOLDS

IPC: H01Q1/36 ,  H01L21/50

CPC classification number: H01Q15/142 ,  H01L21/302 ,  H01L21/486 ,  H01L21/50 ,  H01L23/5227 ,  H01L23/66 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/16225 ,  H01Q1/2283 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/0407

Abstract: Antenna devices, antenna systems and methods of their fabrication are disclosed. One such antenna device includes a semiconductor chip and a chip package. The semiconductor chip includes at least one antenna that is integrated into a dielectric layer of the semiconductor chip and is configured to transmit electromagnetic waves. In addition, the chip package includes at least one ground plane, where the semiconductor chip is mounted on the chip package such that the ground plane(s) is disposed at a predetermined distance from the antenna to implement a reflection of at least a portion of the electromagnetic waves.

Abstract translation: 公开了天线装置，天线系统及其制造方法。 一种这样的天线装置包括半导体芯片和芯片封装。 半导体芯片包括集成到半导体芯片的电介质层中的至少一个天线，并被配置为传输电磁波。 此外，芯片封装包括至少一个接地平面，其中半导体芯片安装在芯片封装上，使得接地平面设置在离天线预定距离处，以实现至少一部分 电磁波。