公开(公告)号：US20170141772A1

公开(公告)日：2017-05-18

申请号：US15047692

申请日：2016-02-19

Applicant: International Business Machines Corporation

Inventor： JINWOO CHOI

IPC: H01P5/04

CPC classification number: H03K5/02 ,  H01L23/64 ,  H03F1/56 ,  H03F7/02 ,  H05K1/0236 ,  H05K1/09

Abstract: A method amplifies a signal on a transmission line. A driver transmits an initial signal on a transmission line, which is overlaid on an Alternating Impedance-Electromagnetic BandGap (AI-EBG) structure (i.e., a reference plane) on a circuit board. The AI-EBG structure induces an alternating change to an impedance in the transmission line. The alternating change to the impedance creates a reflection signal to an initial signal on the transmission line, and the reflection signal and the initial signal combine to create an amplified signal.

公开(公告)号：US20140331482A1

公开(公告)日：2014-11-13

申请号：US14341834

申请日：2014-07-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JINWOO CHOI ,  SUNGJUN CHUN ,  JASON L. FRANKEL ,  PAUL R. WALLING ,  ROGER D. WEEKLY

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0224 ,  G06F17/5081 ,  H05K1/116 ,  H05K2201/09681 ,  H05K2201/09718 ,  H05K2201/09727 ,  Y10T29/49004 ,  Y10T29/49155 ,  Y10T29/53022

Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

Abstract translation: 计算机系统接收初始多层陶瓷封装设计。 计算机系统以第一宽度维持网格线段的网格线段的第一选择，并且将多个网格线段的网格线段的第二选择调整到第二宽度。 计算机系统基于改进的多层陶瓷封装设计来控制多层陶瓷封装的制造。

公开(公告)号：US20180213636A1

公开(公告)日：2018-07-26

申请号：US15928090

申请日：2018-03-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JINWOO CHOI ,  SUNGJUN CHUN ,  JASON L. FRANKEL ,  PAUL R. WALLING ,  ROGER D. WEEKLY

IPC: H05K1/02 ,  G06F17/50

CPC classification number: H05K1/0224 ,  G06F17/5081 ,  H05K1/116 ,  H05K2201/09681 ,  H05K2201/09718 ,  H05K2201/09727 ,  Y10T29/49004 ,  Y10T29/49155 ,  Y10T29/53022

Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

公开(公告)号：US20170141742A1

公开(公告)日：2017-05-18

申请号：US14940189

申请日：2015-11-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JINWOO CHOI

IPC: H01P5/04 ,  H03F1/56 ,  H03F7/02

CPC classification number: H03K5/02 ,  H01L23/64 ,  H03F1/56 ,  H03F7/02 ,  H05K1/0236 ,  H05K1/09

Abstract: An electronic structure includes a conductor layer; an insulation layer adjacent to the conductor layer; an Alternating Impedance Electromagnetic Bandgap (AI-EBG) layer adjacent to the conductor layer; and a signal driver, a transmission line, and a destination device overlaid on the AI-EBG layer, such that the AI-EBG layer induces an alternating change to an impedance in the transmission line. The alternating change to the impedance creates a reflection signal to an initial signal on the transmission line, and the reflection signal and the initial signal combine to create an amplified signal.