公开(公告)号：US20210288022A1

公开(公告)日：2021-09-16

申请号：US17334937

申请日：2021-05-31

申请人： International Business Machines Corporation

发明人： William EMMETT BERNIER ,  BING DANG ,  JOHN KNICKERBOCKER ,  SON KIM TRAN ,  Mario J. Interrante

IPC分类号： H01L23/00 ,  H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/60

摘要： An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

公开(公告)号：US20160246337A1

公开(公告)日：2016-08-25

申请号：US14627657

申请日：2015-02-20

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： EVAN G. COLGAN ,  MONTY M. DENNEAU ,  JOHN KNICKERBOCKER

IPC分类号： G06F1/18 ,  G06F1/20 ,  H01L23/498 ,  H01L23/473 ,  H01L23/367

CPC分类号： G06F1/185 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/367 ,  H01L23/473 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13109 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81805 ,  H01L2224/92125 ,  H01L2224/92242 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2224/81

摘要： A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

摘要翻译： 半导体结构包括具有冷却层的衬底，冷却通道，与冷却通道流体连通的冷却剂入口和出口，以及具有一个或多个连接点和器件层区域的冷却层上的器件层。 器件层的热膨胀系数基本上等于冷却层的热膨胀系数。 多个层叠基板设置在器件层上并电连接到器件层。 叠层基板的热膨胀系数与装置层的热膨胀系数不同，每个层压基板的尺寸小于与其相连的装置层部分，并且各层叠基板在相邻层叠基板的侧面之间具有间隙。 层压基板在它们之间的间隙彼此不电或机械连接，并且层叠基板足够小以防止由于热膨胀而引起的装置，互连和冷却层翘曲。

公开(公告)号：US20200288991A1

公开(公告)日：2020-09-17

申请号：US16299311

申请日：2019-03-12

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： JOHN KNICKERBOCKER ,  Shriya Kumar

IPC分类号： A61B5/0205 ,  G16H20/30 ,  G16H10/65 ,  G16H40/63 ,  A61B5/145 ,  A61B5/00

摘要： A health & fitness tracking device may include a display that provides fitness information to a wearer of the health & fitness tracking device, at least one physiological sensor that obtains physiological data by monitoring at least one physiological condition of the wearer, at least one environmental sensor that obtains environmental data by monitoring at least one environmental condition, a data storage device that stores the physiological data, the environmental data, and medical history data relating to the wearer, a memory storing a computer program, and a processor that executes the computer program. The computer program may adjust a sensor configuration of the at least one physiological sensor based on the medical history data.