Load leveler
    3.
    发明授权

    公开(公告)号:US11263059B2

    公开(公告)日:2022-03-01

    申请号:US16125466

    申请日:2018-09-07

    Abstract: An example operation may include one or more of connecting, by a load leveler, to a blockchain network comprising a plurality of nodes and configured to store a common work item, computing, by the load leveler, loads across the plurality of the nodes that need to execute the common work item upon completion of current tasks, determining, by the load leveler, a network load impact based on execution of a common blockchain consensus checking process on the network nodes, executing, by the load leveler, a work assessment process based on the loads computed across the plurality of the nodes and on the determined network load impact of the blockchain network, and assigning, by the load leveler, new tasks to the nodes based on results of the execution of the work assessment process.

    Formation of VTFET fin and vertical fin profile

    公开(公告)号:US10692776B2

    公开(公告)日:2020-06-23

    申请号:US16181977

    申请日:2018-11-06

    Abstract: A semiconductor device includes etching fins into a bulk substrate in an active region, the bulk substrate including an intermediate layer formed over a base layer and a first semiconductor layer formed over the intermediate layer such that the fins extend through the first semiconductor layer into the intermediate layer to form tapered bottom portions of the fins within the intermediate layer and vertical fin sidewalls of a semiconductor portions of the fins within the first semiconductor layer. A second semiconductor layer is formed around the tapered bottom portions below the semiconductor portions of the fins such that the second semiconductor layer covers the tapered bottom portions to form a top surface proximal to the semiconductor portions of the fins that is substantially parallel to a bottom surface of the top surface of the base layer. A gate structure is formed around the fins.

    FORMATION OF VTFET FIN AND VERTICAL FIN PROFILE

    公开(公告)号:US20200144131A1

    公开(公告)日:2020-05-07

    申请号:US16181977

    申请日:2018-11-06

    Abstract: A semiconductor device includes etching fins into a bulk substrate in an active region, the bulk substrate including an intermediate layer formed over a base layer and a first semiconductor layer formed over the intermediate layer such that the fins extend through the first semiconductor layer into the intermediate layer to form tapered bottom portions of the fins within the intermediate layer and vertical fin sidewalls of a semiconductor portions of the fins within the first semiconductor layer. A second semiconductor layer is formed around the tapered bottom portions below the semiconductor portions of the fins such that the second semiconductor layer covers the tapered bottom portions to form a top surface proximal to the semiconductor portions of the fins that is substantially parallel to a bottom surface of the top surface of the base layer. A gate structure is formed around the fins.

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