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公开(公告)号：US10395067B2
公开(公告)日：2019-08-27
申请号：US15249671
申请日：2016-08-29
摘要： Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US10178818B2
公开(公告)日：2019-01-08
申请号：US15835585
申请日：2017-12-08
摘要： Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).
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公开(公告)号：US10175064B2
公开(公告)日：2019-01-08
申请号：US14865610
申请日：2015-09-25
发明人： William L. Brodsky , Silvio Dragone , Roger S. Krabbenhoft , David C. Long , Stefano S. Oggioni , Michael T. Peets , William Santiago-Fernandez
摘要： Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
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公开(公告)号：US20180303011A1
公开(公告)日：2018-10-18
申请号：US16008112
申请日：2018-06-14
IPC分类号： H05K9/00 , H01R13/6584 , H01R13/6592 , H01R13/74
CPC分类号： H05K9/0016 , H01R13/6584 , H01R13/6592 , H01R13/74 , H05K9/0015
摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
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公开(公告)号：US10098235B2
公开(公告)日：2018-10-09
申请号：US14865591
申请日：2015-09-25
发明人： John R. Dangler , David C. Long , Michael T. Peets
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.
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公开(公告)号：US20170150656A1
公开(公告)日：2017-05-25
申请号：US15424924
申请日：2017-02-06
IPC分类号： H05K9/00 , H01R13/6592 , H01R13/74 , H01R13/6584
CPC分类号： H05K9/0016 , H01R13/6584 , H01R13/6592 , H01R13/74 , H05K9/0015
摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
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7.发明授权Enclosure with inner tamper-respondent sensor(s) and physical security element(s) 有权内部篡改传感器和物理安全元件的外壳公开(公告)号：US09578764B1
公开(公告)日：2017-02-21
申请号：US14865686
申请日：2015-09-25
CPC分类号： H05K13/00 , H05K3/10 , H05K5/0208
摘要： Tamper-respondent assemblies and methods of fabrication are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).
摘要翻译： 提供防篡改组件和制造方法，其包括电子外壳，篡改响应的电子电路结构以及至少一个安全元件。 电子外壳至少部分地包围至少一个待保护的电子部件，并且包括内表面。 防篡改电子电路结构包括篡改响应传感器，其至少部分地覆盖电子外壳的内表面，并且至少一个安全元件至少部分地覆盖并物理地固定在适当位置， 响应传感器至少部分地覆盖电子外壳的内表面。 在增强的实施例中，电子外壳被固定到包括嵌入式篡改响应传感器的多层电路板，并且一起覆盖电子外壳的内表面的篡改传感器传感器和多层电路内的嵌入式篡改响应传感器 板定义关于电子部件的安全卷。
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公开(公告)号：US10685146B2
公开(公告)日：2020-06-16
申请号：US16358956
申请日：2019-03-20
摘要： Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.
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公开(公告)号：US20190320560A1
公开(公告)日：2019-10-17
申请号：US16448236
申请日：2019-06-21
IPC分类号： H05K9/00 , H01R13/74 , H01R13/6584 , H01R13/6592
摘要： A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.
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公开(公告)号：US10378925B2
公开(公告)日：2019-08-13
申请号：US16162679
申请日：2018-10-17
发明人： William L. Brodsky , Silvio Dragone , Roger S. Krabbenhoft , David C. Long , Stefano S. Oggioni , Michael T. Peets , William Santiago-Fernandez
摘要： Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board. In certain embodiments, one or more of the tamper-respondent layers are divided into multiple, separate tamper-respondent circuit zones, with the tamper-respondent layers, including the circuit zones, being electrically connected to monitor circuitry within the secure volume.
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