公开(公告)号：US20230176115A1

公开(公告)日：2023-06-08

申请号：US17540835

申请日：2021-12-02

Applicant: International Business Machines Corporation

Inventor： Kushagra Sinha ,  Pablo Nieves ,  Reinaldo Vega

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2889

Abstract: A testing apparatus comprises a first electromagnet. The first electromagnet can be configured to expose a first test device to a first electromagnetic field. The testing apparatus also comprises a second electromagnet. The second electromagnet can be configured to expose a second test device to a second electromagnetic field.

公开(公告)号：US11119148B2

公开(公告)日：2021-09-14

申请号：US16164130

申请日：2018-10-18

Applicant: International Business Machines Corporation

Inventor： Pablo Nieves ,  Kushagra Sinha ,  Reinaldo Vega

IPC: G01R31/28 ,  G01R31/311 ,  G01R1/04 ,  G01R1/067 ,  H01L21/68

Abstract: A test probe assembly includes a probe card, a plurality of test probes mounted to the probe card with each of the test probes having a probe tip segment and a probe end for positioning adjacent respective individual test pads of a semiconductor wafer, and a fiber optic lead mounted to each test probe. The fiber optic leads are arranged to direct incident light toward respective individual test pads of the semiconductor wafer. A plurality of photodetectors may be arranged about the probe card with individual photodetectors configured for reception of light reflected off the respective individual test pads to emit output signals used to generate image data representative of the individual test pads on the semiconductor wafer. The image data may be utilized to align the test pads with the test probes for subsequent testing.

公开(公告)号：US11796590B2

公开(公告)日：2023-10-24

申请号：US17536211

申请日：2021-11-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Pablo Nieves ,  Kushagra Sinha ,  Reinaldo Vega

IPC: G01R31/28 ,  H01L21/66 ,  G01R31/319

CPC classification number: G01R31/2891 ,  G01R31/2884 ,  G01R31/31905 ,  H01L22/34

Abstract: A system includes probe pins each including a probe tip and a plurality of thermocouples arranged such that at least one thermocouple is positioned between a pair of the probe pins. The plurality of thermocouples can be placed adjacent or above a device under test (DUT). The probe tips of the probe pins are placed over a plurality of pads. The plurality of thermocouples are placed adjacent or between the plurality of pads. The at least one thermocouple positioned between the pair of the probe pins can be either a single thermocouple or a thermocouple array.

公开(公告)号：US11137418B2

公开(公告)日：2021-10-05

申请号：US16291755

申请日：2019-03-04

Applicant: International Business Machines Corporation

Inventor： Kushagra Sinha ,  Pablo Nieves ,  Reinaldo Vega

IPC: G01R31/00 ,  G01R1/073 ,  G01R31/28 ,  G01R1/04 ,  G01R3/00

Abstract: A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.

公开(公告)号：US11125780B2

公开(公告)日：2021-09-21

申请号：US16164223

申请日：2018-10-18

Applicant: International Business Machines Corporation

Inventor： Kushagra Sinha ,  Pablo Nieves ,  Reinaldo Vega

IPC: G01R1/07 ,  G01R31/28

Abstract: A test probe assembly for determining the integrity of a test pad of a semiconductor wafer. The test probe assembly includes a probe card, a plurality of test probes mounted to the probe card, a fiber optic lead mounted to each test probe and arranged to direct incident light toward individual test pads of the semiconductor wafer and a plurality of photodetectors arranged about the probe card. Individual photodetectors are configured to receive light reflected off a dielectric coating of the test pad corresponding to a first set of light rays emitted by the test pad and configured to receive light reflected off a metallic base of the test pad corresponding to a second set of light rays emitted by the test pad, and to generate first and second output signals associated with the first and second sets of light rays to create image data of the individual test pads.

公开(公告)号：US20230168297A1

公开(公告)日：2023-06-01

申请号：US17536211

申请日：2021-11-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Pablo Nieves ,  KUSHAGRA SINHA ,  REINALDO VEGA

IPC: G01R31/28 ,  G01R31/319 ,  H01L21/66

CPC classification number: G01R31/2891 ,  G01R31/31905 ,  G01R31/2884 ,  H01L22/34

Abstract: A system includes probe pins each including a probe tip and a plurality of thermocouples arranged such that at least one thermocouple is positioned between a pair of the probe pins. The plurality of thermocouples can be placed adjacent or above a device under test (DUT). The probe tips of the probe pins are placed over a plurality of pads. The plurality of thermocouples are placed adjacent or between the plurality of pads. The at least one thermocouple positioned between the pair of the probe pins can be either a single thermocouple or a thermocouple array.

公开(公告)号：US20200284823A1

公开(公告)日：2020-09-10

申请号：US16291755

申请日：2019-03-04

Applicant: International Business Machines Corporation

Inventor： Kushagra Sinha ,  Pablo Nieves ,  Reinaldo Vega

IPC: G01R1/073

Abstract: A test probe assembly for use in testing a semiconductor wafer includes a probe card, a plurality of test probes mounted to the probe card and one or more piezoelectric elements mounted to each test probe. The piezoelectric elements are configured to move respective probe ends of the individual test probes in at least one direction to facilitate realignment of the probe ends for semiconductor wafer testing.