公开(公告)号：US20190229433A1

公开(公告)日：2019-07-25

申请号：US16370851

申请日：2019-03-29

Applicant: International Business Machines Corporation

Inventor： Jean Labonte ,  Sylvain Ouimet

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/52 ,  H01Q21/22 ,  H01L21/48 ,  H01L23/498

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements.

公开(公告)号：US20140359996A1

公开(公告)日：2014-12-11

申请号：US13910169

申请日：2013-06-05

Applicant: International Business Machines Corporation

Inventor： Stephanie Allard ,  Martin Beaumier ,  Jean-Francois Drapeau ,  Jean Labonte ,  Steven P. Ostrander ,  Sylvain Ouimet

IPC: H01L21/687

CPC classification number: H01L24/75 ,  H01L23/36 ,  H01L23/3675 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/8385 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/00 ,  Y10T29/49826 ,  Y10T29/49998 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.

Abstract translation: 一种在加工过程中向工件施加力的夹紧装置和方法包括限定工作区域的基座。 工作区域被配置为接收包括基板和管芯的接合结构。 组件可以在工作区域和结合结构上定位。 可调节的可释放结构可定位在部件和接合结构之上，并且包括弹性机构，该弹性机构具有用于接触部件的内部部件，以向部件施加内部向下的力。 弹性机构还包括外部构件，用于将外部向下的力施加到基底的相对的远侧边缘区域。 外部向下的力施加到可调节的可释放结构，使得内部和外部构件在接合的结构的加工期间分别将内部和外部向下的力施加到基板的部件和相对的远侧边缘区域。

公开(公告)号：US11211262B2

公开(公告)日：2021-12-28

申请号：US16745278

申请日：2020-01-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Tuhin Sinha ,  Steven P. Ostrander ,  Bhupender Singh ,  Sylvain Ouimet

IPC: H01L23/16 ,  H01L21/56 ,  H01L23/31 ,  G11C11/407 ,  H01L23/04

Abstract: An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.

公开(公告)号：US10374322B2

公开(公告)日：2019-08-06

申请号：US15806496

申请日：2017-11-08

Applicant: International Business Machines Corporation

Inventor： Jean Labonte ,  Sylvain Ouimet

IPC: H01L21/00 ,  H01L23/00 ,  H01Q21/00 ,  H01Q21/22 ,  H01Q1/52 ,  H01Q21/06 ,  H01L23/498 ,  H01L21/48

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements. A method for fabricating the antenna package is also described.

公开(公告)号：US20190140361A1

公开(公告)日：2019-05-09

申请号：US15806496

申请日：2017-11-08

Applicant: International Business Machines Corporation

Inventor： Jean Labonte ,  Sylvain Ouimet

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q1/52 ,  H01Q21/22

CPC classification number: H01Q21/0087 ,  H01L21/4885 ,  H01L23/49816 ,  H01L2223/6677 ,  H01L2224/4845 ,  H01Q1/2283 ,  H01Q1/523 ,  H01Q9/0457 ,  H01Q21/065 ,  H01Q21/22

Abstract: A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements. A method for fabricating the antenna package is also described.

公开(公告)号：US09793232B1

公开(公告)日：2017-10-17

申请号：US14988077

申请日：2016-01-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Luc Guerin ,  Sylvain Ouimet ,  Sylvain Pharand ,  Thomas A. Wassick

IPC: H01L21/44 ,  H01L23/00 ,  C22C9/06

CPC classification number: H01L24/13 ,  C22C9/06 ,  H01L24/05 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/10152 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/81815

Abstract: A standoff structure for providing improved interconnects is provided, wherein the structure employs nickel copper alloy or copper structures having increased resistivity.

公开(公告)号：US20210225665A1

公开(公告)日：2021-07-22

申请号：US16745278

申请日：2020-01-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： TUHIN SINHA ,  Steven P. Ostrander ,  Bhupender Singh ,  Sylvain Ouimet

IPC: H01L21/56 ,  H01L23/31

Abstract: An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.

公开(公告)号：US09219051B2

公开(公告)日：2015-12-22

申请号：US13910169

申请日：2013-06-05

Applicant: International Business Machines Corporation

Inventor： Stephanie Allard ,  Martin Beaumier ,  Jean-Francois Drapeau ,  Jean Labonte ,  Steven P. Ostrander ,  Sylvain Ouimet

IPC: B23Q7/00 ,  H01L21/687 ,  H01L23/00 ,  H05K3/00 ,  H01L23/367

CPC classification number: H01L24/75 ,  H01L23/36 ,  H01L23/3675 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/8385 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/00 ,  Y10T29/49826 ,  Y10T29/49998 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.

Abstract translation: 一种在加工过程中向工件施加力的夹紧装置和方法包括限定工作区域的基座。 工作区域被配置为接收包括基板和管芯的接合结构。 组件可以在工作区域和结合结构上定位。 可调节的可释放结构可定位在部件和接合结构之上，并且包括弹性机构，该弹性机构具有用于接触部件的内部部件，以向部件施加内部向下的力。 弹性机构还包括外部构件，用于将外部向下的力施加到基底的相对的远侧边缘区域。 外部向下的力施加到可调节的可释放结构，使得内部和外部构件在接合的结构的加工期间分别将内部和外部向下的力施加到基板的部件和相对的远侧边缘区域。