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    Determining magnitude of compressive loading
    4.
    发明授权
    Determining magnitude of compressive loading 有权
    确定压缩载荷的大小

    公开(公告)号：US09366591B2

    公开(公告)日：2016-06-14

    申请号：US14339944

    申请日：2014-07-24

    Applicant: International Business Machines Corporation

    Inventor： Paul F. Bodenweber ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal K. Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

    IPC: G01N3/08 ,  G01L5/00 ,  G01N27/22

    CPC classification number: G01L5/0038 ,  G01L5/0057 ,  G01L5/0076 ,  G01N3/08 ,  G01N27/22 ,  G01N2203/0617 ,  G01N2203/0629 ,  G01N2203/0682

    Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

    Abstract translation: 提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。 该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一 和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

    DETERMINING MAGNITUDE OF COMPRESSIVE LOADING
    7.
    发明申请
    DETERMINING MAGNITUDE OF COMPRESSIVE LOADING 有权
    确定压缩载荷的大小

    公开(公告)号：US20140331792A1

    公开(公告)日：2014-11-13

    申请号：US14339944

    申请日：2014-07-24

    Applicant: International Business Machines Corporation

    Inventor： Paul F. Bodenweber ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal K. Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

    IPC: G01L5/00 ,  G01N27/22

    CPC classification number: G01L5/0038 ,  G01L5/0057 ,  G01L5/0076 ,  G01N3/08 ,  G01N27/22 ,  G01N2203/0617 ,  G01N2203/0629 ,  G01N2203/0682

    Abstract: An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

    Abstract translation: 提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。 该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一 和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

    CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION
    8.
    发明申请
    CHIP CORNER GUARD FOR CHIP-PACKAGE INTERACTION FAILURE MITIGATION 有权

    公开(公告)号：US20210233824A1

    公开(公告)日：2021-07-29

    申请号：US16750270

    申请日：2020-01-23

    Applicant: International Business Machines Corporation

    Inventor： Shidong Li ,  Kamal K. Sikka ,  Charles L. Arvin ,  Steven P. Ostrander

    IPC: H01L23/24 ,  H01L25/00 ,  H01L23/498

    Abstract: An integrated circuit (IC) package, and a method for fabricating an IC package is described. A set of semiconductor chips, a set of corner guard structures and a chip carrier are provided. The set of semiconductor chips and the set of corner guard structure placed and bonded to a first surface of the chip carrier. The set of semiconductor chips are in electrical contact with the chip carrier. Respective corner guard structures are placed proximate to the corners of respective semiconductor chips. The coefficient of thermal expansion (CTE) of the set of corner guard structures is selected to ameliorate chip-package interaction (CPI) related failures due to differences between a CTE of the set of semiconductor chips and a CTE of the chip carrier.

    ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER
    9.
    发明申请
    ELECTRONIC APPARATUS HAVING INTER-CHIP STIFFENER 有权

    公开(公告)号：US20210225665A1

    公开(公告)日：2021-07-22

    申请号：US16745278

    申请日：2020-01-16

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： TUHIN SINHA ,  Steven P. Ostrander ,  Bhupender Singh ,  Sylvain Ouimet

    IPC: H01L21/56 ,  H01L23/31

    Abstract: An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.

    Multipart lid for a semiconductor package with multiple components
    10.
    发明授权
    Multipart lid for a semiconductor package with multiple components 有权

    公开(公告)号：US10325830B1

    公开(公告)日：2019-06-18

    申请号：US15826856

    申请日：2017-11-30

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Charles L. Arvin ,  Steven P. Ostrander ,  Krishna R. Tunga

    IPC: F28F21/08 ,  H01L21/48 ,  H01L23/367 ,  H01L23/373

    Abstract: A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

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