Spatially-arranged chemical processing station
    1.
    发明授权
    Spatially-arranged chemical processing station 有权
    空间化学处理站

    公开(公告)号:US06939403B2

    公开(公告)日:2005-09-06

    申请号:US10299069

    申请日:2002-11-19

    摘要: The present invention discloses a station, e.g., for IC fabrication with a flexible configuration. It consists of an array of processing chambers, which are grouped into processing modules and arranged in a two-dimensional fashion, in vertical levels and horizontal rows, and is capable of operating independent of each other. Each processing chamber can perform electroless deposition and other related processing steps sequentially on a wafer with more than one processing fluid without having to remove it from the chamber. The system is served by a single common industrial robot, which may have random access to all the working chambers and cells of the storage unit for transporting wafers between the wafer cassettes and inlet/outlets ports of any of the chemical processing chambers. The station occupies a service-room floor space and a clean-room floor space. The processing modules and the main chemical management unit connected to the local chemical supply unit occupy a service-room floor space, while the robot and the wafer storage cassettes are located in a clean room. Thus, in distinction to the known cluster-tool machines, the station of the invention makes it possible to transfer part of the units from the expensive clean-room area to less-expensive service area.

    摘要翻译: 本发明公开了一种站,例如用于具有柔性配置的IC制造。 它由一系列处理室组成,它们分组成处理模块,并以垂直水平和水平行的二维方式布置,并且能够彼此独立运行。 每个处理室可以在具有多于一种处理流体的晶片上顺序地进行无电沉积和其它相关处理步骤,而不必将其从室中移除。 该系统由单个通用工业机器人服务,其可以随机访问存储单元的所有工作室和单元,用于在晶片盒之间传送晶片和任何化学处理室的入口/出口端口。 车站占用服务室的空间和洁净室的空间。 连接到本地化学品供应单元的处理模块和主要化学品管理单元占用服务室的空间,而机器人和晶片存储盒位于洁净室中。 因此,与已知的集群工具机器不同,本发明的工作站使得可以将部分单元从昂贵的清洁室区域转移到不太昂贵的服务区域。

    Apparatus and method for electroless deposition of materials on semiconductor substrates

    公开(公告)号:US06913651B2

    公开(公告)日:2005-07-05

    申请号:US10103015

    申请日:2002-03-22

    摘要: An apparatus of the invention has a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber contains a substrate holder that can be rotated around a vertical axis, and an edge-grip mechanism inside the substrate holder. The deposition chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus is also provided with reservoirs and tanks for processing liquids and gases, as well as with a solution heater and a control system for controlling temperature and pressure in the chamber. The heater can be located outside the working chamber or built into the substrate holder, or both heaters can be used simultaneously. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.

    Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates
    3.
    发明申请
    Apparatus and Method for Electroless Deposition of Materials on Semiconductor Substrates 有权
    半导体衬底上材料的无电沉积的装置和方法

    公开(公告)号:US20120213914A1

    公开(公告)日:2012-08-23

    申请号:US13408039

    申请日:2012-02-29

    IPC分类号: B05D5/12

    摘要: An apparatus is provided having a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus also includes a solution heater and a control system for controlling temperature and pressure in the chamber. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.

    摘要翻译: 提供一种装置,其具有能够被密封并且能够承受增加的压力和高温的可关闭室。 该室具有用于供应各种处理液体的多个入口,例如沉积溶液,用于冲洗的水等,以及用于在压力下供应气体的端口。 该装置还包括解决方案加热器和用于控制室内的温度和压力的控制系统。 通过在压力下和稍低于溶液沸点的温度下进行沉积工艺来实现均匀沉积。 该解决方案可以从上面通过形成在盖中的淋浴喷头或者通过室的底部供应。 冲洗或其它辅助溶液经由可平行于其上的衬底上方的可径向移动的化学分配臂供应。

    Universal substrate holder for treating objects in fluids
    4.
    发明授权
    Universal substrate holder for treating objects in fluids 有权
    用于处理流体中的物体的通用基板支架

    公开(公告)号:US06935638B2

    公开(公告)日:2005-08-30

    申请号:US10369878

    申请日:2003-02-21

    摘要: A universal substrate holder of the invention for treating wafer substrates in liquids is provided with a shaft and a rod slidingly inserted into the central opening of the shaft. The end of the shaft that protrudes into the bowl supports a base platform for the substrate, while the end of the rod that protrudes into the bowl has radial arms that rigidly support an annular plate with pins that can pass through the opening of the base platform so that they can support the substrate above the surface of the platform. The annular plate supports clamping jaws made in the form of two-arm levers with shorter arms and longer arms. The longer arms are heavier and therefore in the stationary state of the holder keep the jaws turned into an open position. When the shaft begins to rotate, the jaws are turned under the effect of centrifugal forces into positions of clamping the substrate with the shorter arms. When the rod is pulled down, the ends of the longer arms come into contact with the base platform and are turned into the clamping position. The substrate holder of the invention allows clamping and releasing of the substrate in positions of the substrate above the platform and in a position of the substrate on the base substrate, when the backside of the substrate is inaccessible to the process liquid.

    摘要翻译: 用于处理液体中的晶片基板的本发明的通用基板保持器设置有滑动地插入轴的中心开口中的轴和杆。 突出到碗中的轴的端部支撑用于基底的基座,而突出到碗中的杆的端部具有径向臂,其刚性地支撑环形板,销可以穿过基座的开口 使得它们可以支撑平台表面上方的基板。 环形板支撑以双臂杠杆的形式制成的夹爪,其具有较短的臂和较长的臂。 较长的手臂较重,因此在保持架的静止状态下,保持夹爪变为打开位置。 当轴开始旋转时,夹爪在离心力的作用下转动到用较短的臂夹持基板的位置。 当杆被拉下时,较长臂的端部与基座平台接触并转动到夹紧位置。 本发明的衬底保持器允许当衬底的背面不可用于处理液体时,衬底在平台上方的位置和衬底在基底衬底上的位置的夹持和释放。

    Temperature-controlled substrate holder for processing in fluids
    5.
    发明授权
    Temperature-controlled substrate holder for processing in fluids 有权
    用于在流体中加工的温度控制的基板支架

    公开(公告)号:US06908512B2

    公开(公告)日:2005-06-21

    申请号:US10247895

    申请日:2002-09-20

    摘要: A substrate holder has a disk-like body with a central recess having diameter smaller than the diameter of the substrate placed onto the upper surface of the holder. The substrate can be clamped in place by the clamps of the edge-grip mechanism or placed into a seat without the use of clamps. In both cases, the substrate forms a partial wall that confines the heating/cooling recess or chamber. The aforementioned recess is filled with a cooling or heating liquid (depending on the mode of metal deposition) selectively supplied from a liquid heating or cooling system. In order to ensure in the working chamber above the substrate a pressure slightly higher than the pressure in the cooling/heating recess, the working chamber is first filled with the working solution under the atmospheric pressure, and then the recess is filled with a heating or cooling liquid with simultaneous increase of pressure in the working chamber to a level slightly exceeding the pressure in the recess. The substrate holder of the invention provides direct heat/cool-exchange between the heating/cooling medium and the substrate and allows instantaneous change of temperature of the heating/cooling liquid.

    摘要翻译: 衬底保持器具有盘状体,其具有直径小于放置在保持器的上表面上的衬底的直径的中心凹部。 基板可以通过边缘抓握机构的夹具夹紧就位,或者不使用夹具而放置在座中。 在这两种情况下,基板形成限制加热/冷却凹部或室的局部壁。 上述凹部填充有从液体加热或冷却系统选择性地供应的冷却或加热液体(取决于金属沉积的模式)。 为了确保在基板上方的工作室内的压力略高于冷却/加热凹槽中的压力,工作室首先在大气压力下被工作溶液填充,然后用加热或 冷却液体,同时将工作室中的压力提高到稍微超过凹部中的压力的​​水平。 本发明的衬底保持器在加热/冷却介质和衬底之间提供直接的热/冷交换,并且允许加热/冷却液体的温度的瞬时变化。

    Apparatus and method for electroless deposition of materials on semiconductor substrates
    6.
    发明授权
    Apparatus and method for electroless deposition of materials on semiconductor substrates 有权
    在半导体衬底上无电沉积材料的装置和方法

    公开(公告)号:US08906446B2

    公开(公告)日:2014-12-09

    申请号:US13408039

    申请日:2012-02-29

    IPC分类号: C23C18/16 H01L21/288

    摘要: An apparatus is provided having a closable chamber that can be sealed and is capable of withstanding an increased pressure and high temperature. The chamber has several inlet ports for the supply of various process liquids, such as deposition solutions, DI water for rinsing, etc., and a port for the supply of a gas under pressure. The apparatus also includes a solution heater and a control system for controlling temperature and pressure in the chamber. Uniform deposition is achieved by carrying out the deposition process under pressure and under temperature slightly below the boiling point of the solution. The solution can be supplied from above via a shower head formed in the cover, or through the bottom of the chamber. Rinsing or other auxiliary solutions are supplied via a radially moveable chemical dispensing arm that can be arranged above the substrate parallel thereto.

    摘要翻译: 提供一种装置,其具有能够被密封并且能够承受增加的压力和高温的可关闭室。 该室具有用于供应各种处理液体的多个入口,例如沉积溶液,用于冲洗的去离子水等,以及用于在压力下供应气体的端口。 该装置还包括解决方案加热器和用于控制室内的温度和压力的控制系统。 通过在压力下和稍低于溶液沸点的温度下进行沉积工艺来实现均匀沉积。 该解决方案可以从上面通过形成在盖中的淋浴喷头或者通过室的底部供应。 冲洗或其它辅助溶液经由可平行于其上的衬底上方的可径向移动的化学分配臂供应。

    Apparatus and method for electroless deposition of materials on semiconductor substrates
    7.
    发明授权
    Apparatus and method for electroless deposition of materials on semiconductor substrates 有权
    在半导体衬底上无电沉积材料的装置和方法

    公开(公告)号:US08128987B2

    公开(公告)日:2012-03-06

    申请号:US11138531

    申请日:2005-05-26

    IPC分类号: C23C18/16

    摘要: A method for electroless deposition from a deposition solution in a working chamber, where the process can include heating the deposition solution to its boiling point and subsequently reducing the temperature of the deposition solution to a working temperature range that is between approximately 1% and approximately 25% below the boiling point of said solution under a predetermined pressure; and the process also can include heating the deposition solution while filling an enclosed area of the chamber such that the deposition solution reaches its boiling point immediately after the enclosed area is filled.

    摘要翻译: 一种用于从工作室中的沉积溶液进行无电沉积的方法,其中该方法可以包括将沉积溶液加热至其沸点,随后将沉积溶液的温度降低至大约1%至大约25之间的工作温度范围 低于所述溶液在预定压力下的沸点%; 并且该方法还可以包括在填充室的封闭区域期间加热沉积溶液,使得沉积溶液在填充封闭区域之后立即达到其沸点。