公开(公告)号：US20160141248A1

公开(公告)日：2016-05-19

申请号：US14882524

申请日：2015-10-14

Applicant: Infineon Technologies AG

Inventor： Frank PUESCHNER ,  Jens POHL ,  Thomas SPOETTL ,  Peter STAMPKA

IPC: H01L23/538 ,  H01L23/66 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/5388 ,  G06K19/072 ,  G06K19/07747 ,  G06K19/07754 ,  G06K19/07784 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

Abstract translation: 芯片卡模块布置可以包括彼此相对的第一表面和第二表面，以及用于表面上的一个或多个半导体芯片的芯片插座。 芯片卡模块装置还可以包括在两个表面中的一个表面上的连接材料接收区域，连接材料接收区域仅占据表面的一部分。

公开(公告)号：US20150069132A1

公开(公告)日：2015-03-12

申请号：US14483174

申请日：2014-09-11

Applicant: Infineon Technologies AG

Inventor： Frank PUESCHNER ,  Thomas Spoettl ,  Jens POHL ,  Peter STAMPKA

IPC: G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07728 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07775 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/83 ,  H01L2224/83201 ,  H01L2224/83902 ,  H01L2924/06 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/00

Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

Abstract translation: 一种用于制造智能卡模块装置的方法包括：将智能卡模块布置在第一载体层上，其中第一载体层没有用于接收智能卡模块的预制智能卡模块插座切口。 智能卡模块包括：基板; 衬底上的芯片; 在芯片和衬底之间的第一机械加强结构。 第一机械加强结构覆盖芯片表面的至少一部分。 该方法还包括将第二载体层应用于智能卡模块，其中第二载体层没有用于接收智能卡模块的预制智能卡模块插座切口; 以及将第一载体层与第二载体层层压或压制中的至少一个，使得智能卡模块被第一载体层和第二载体层包围。

公开(公告)号：US20150333397A1

公开(公告)日：2015-11-19

申请号：US14710689

申请日：2015-05-13

Applicant: Infineon Technologies AG

Inventor： Martin BUCHSBAUM ,  Josef GRUBER ,  Juergen HOELZL ,  Frank PUESCHNER ,  Peter STAMPKA

IPC: H01Q1/50 ,  H01Q1/22 ,  H03H7/38 ,  H01Q7/08

Abstract: Various embodiments provide a communication module having a carrier, a loop antenna, a modulation circuit which is coupled to the loop antenna and is configured to modulate or demodulate signals which are received or transmitted using the loop antenna, and an impedance matching circuit for matching the impedance of the loop antenna to the input impedance of the modulation circuit. The modulation circuit and the impedance matching circuit are arranged inside the loop antenna on or in the carrier.

Abstract translation: 各种实施例提供具有载体，环形天线，耦合到环形天线的调制电路的通信模块，并且被配置为调制或解调使用环形天线接收或发送的信号，以及阻抗匹配电路，用于匹配 环形天线的阻抗与调制电路的输入阻抗。 调制电路和阻抗匹配电路布置在载体上或载体中的环形天线内。

公开(公告)号：US20150144697A1

公开(公告)日：2015-05-28

申请号：US14549578

申请日：2014-11-21

Applicant: Infineon Technologies AG

Inventor： Martin KLIMKE ,  Berndt GAMMEL ,  Frank PUESCHNER ,  Peter STAMPKA

IPC: G06K7/12

CPC classification number: G06K19/07381 ,  G06K19/06009 ,  G06K19/077

Abstract: One embodiment describes a chip arrangement having a chip carrier; a chip which is arranged in or on the chip carrier; a light sensor arrangement; a transparent layer which covers the light sensor arrangement, the light sensor arrangement being set up to determine a light pattern of light received by the light sensor arrangement from outside the chip arrangement through the transparent layer; and a test circuit which is set up to check whether the light pattern matches a reference light pattern and to output a signal on the basis of the result of the check.

Abstract translation: 一个实施例描述了具有芯片载体的芯片布置; 布置在芯片载体上或芯片载体上的芯片; 光传感器装置; 覆盖所述光传感器装置的透明层，所述光传感器装置被设置为通过所述透明层从所述芯片布置的外部确定由所述光传感器装置接收的光的光图案; 以及测试电路，其被设置为检查光图案是否与参考光图案匹配并且基于检查结果输出信号。

公开(公告)号：US20140353384A1

公开(公告)日：2014-12-04

申请号：US14287265

申请日：2014-05-27

Applicant: Infineon Technologies AG

Inventor： Juergen HOEGERL ,  Frank PUESCHNER ,  Peter STAMPKA

IPC: G06K19/077 ,  H01L23/538

CPC classification number: G06K19/07707 ,  G06K19/07749 ,  G06K19/07775 ,  H01L23/5386 ,  H01L23/5388 ,  H01L2224/16225 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A smart card module includes a carrier; a chip arrangement arranged over a first side of the carrier; and an antenna arranged over a second side of the carrier, wherein the second side of the carrier is opposite the first side of the carrier. The antenna is electrically conductively connected to the chip arrangement in order to transmit electrical signals. The smart card module further includes a display module arranged over the first side of the carrier; and at least one electrical line structure arranged on the first side of the carrier, which electrical line structure electrically conductively connects the chip arrangement and the display module to one another.

Abstract translation: 智能卡模块包括载体; 布置在所述载体的第一侧上的芯片布置; 以及布置在所述载体的第二侧上的天线，其中所述载体的第二侧与所述载体的第一侧相对。 天线导电地连接到芯片布置，以便传输电信号。 智能卡模块还包括布置在载体的第一侧上的显示模块; 以及布置在所述载体的第一侧上的至少一个电线结构，所述电线结构将所述芯片布置和所述显示模块彼此导电地连接。