公开(公告)号：US20190131218A1

公开(公告)日：2019-05-02

申请号：US15797297

申请日：2017-10-30

申请人： Infineon Technologies AG

发明人： Wu Hu LI ,  Edmund RIEDL ,  Thomas HOREDT ,  Ali MAZLOUM-NEJADARI

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/14 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49568 ,  H01L21/4821 ,  H01L23/14 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/32245 ,  H01L2224/3512 ,  H01L2224/3716 ,  H01L2224/37572 ,  H01L2224/37611 ,  H01L2224/37616 ,  H01L2224/37618 ,  H01L2224/37639 ,  H01L2224/37644 ,  H01L2224/37647 ,  H01L2224/37655 ,  H01L2224/37664 ,  H01L2224/40175 ,  H01L2224/48245 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/2064 ,  H01L2924/20641

摘要： A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.