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公开(公告)号:US08449339B2
公开(公告)日:2013-05-28
申请号:US12948977
申请日:2010-11-18
申请人: Shutesh Krishnan , Soon Wei Wang
发明人: Shutesh Krishnan , Soon Wei Wang
IPC分类号: H01R9/24
CPC分类号: H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要: A connector assembly and a method for manufacturing the connector assembly. In accordance with embodiments, the connector assembly includes an electrical connector having first and second surfaces and first and second ends. A layer of electrically insulating material is formed from or on a portion of the first surface at the first end. Optionally, a layer of electrically insulating material can be formed from or on the second surface.
摘要翻译: 连接器组件和用于制造连接器组件的方法。 根据实施例,连接器组件包括具有第一和第二表面以及第一和第二端的电连接器。 电绝缘材料层由第一端部的第一表面的一部分上形成,或者在第一端的一部分上形成。 可选地,电绝缘材料层可以从第二表面上或在第二表面上形成。
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公开(公告)号:US07589400B2
公开(公告)日:2009-09-15
申请号:US11206166
申请日:2005-08-18
申请人: Hiroshi Hozoji , Toshiaki Morita , Satoru Shigeta , Tokihito Suwa
发明人: Hiroshi Hozoji , Toshiaki Morita , Satoru Shigeta , Tokihito Suwa
IPC分类号: H01L23/495 , H01L23/48
CPC分类号: H02M7/003 , H01L24/37 , H01L24/40 , H01L24/84 , H01L24/91 , H01L24/95 , H01L25/072 , H01L2224/16245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37644 , H01L2224/37655 , H01L2224/4007 , H01L2224/40095 , H01L2224/40137 , H01L2224/40225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2224/0401
摘要: The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer.Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.
摘要翻译: 逆变器具有用于导通或切断电流的多个臂,并且每个臂具有开关装置和用于连接开关装置的第一和第二布线层。 每个臂的第一和第二布线层分别形成在绝缘基板上,并且开关装置的一个面固定到第一布线层,并且第二布线层和开关装置的另一个面通过层叠电连接 导体和层状导体具有第一和第二连接,并且所述层叠导体的第一连接固定到所述开关装置的另一面,并且所述层叠导体的第二连接固定到所述第二布线层。 由此,可以实现逆变器的大电流,并且可以提高逆变器或车辆驱动单元的组装能力。
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公开(公告)号:US20060071860A1
公开(公告)日:2006-04-06
申请号:US11206166
申请日:2005-08-18
申请人: Hiroshi Hozoji , Toshiaki Morita , Satoru Shigeta , Tokihito Suwa
发明人: Hiroshi Hozoji , Toshiaki Morita , Satoru Shigeta , Tokihito Suwa
IPC分类号: H01Q1/38
CPC分类号: H02M7/003 , H01L24/37 , H01L24/40 , H01L24/84 , H01L24/91 , H01L24/95 , H01L25/072 , H01L2224/16245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37644 , H01L2224/37655 , H01L2224/4007 , H01L2224/40095 , H01L2224/40137 , H01L2224/40225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48472 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2224/0401
摘要: The inverter has a plurality of arms for conducting or cutting off a current and each arm has a switching device and a first and a second wiring layer for connecting the switching device. The first and second wiring layers of each arm are respectively formed on insulating substrates, and one face of the switching device is fixed to the first wiring layer, and the second wiring layer and the other face of the switching device are electrically connected by a laminal conductor, and the laminal conductor has a first and a second connection, and the first connection of the laminal conductor is fixed to the other face of the switching device, and the second connection of the laminal conductor is fixed to the second wiring layer. Thereby, a large current of the inverter can be realized and the assembly capacity of the inverter or the vehicle drive unit will be improved.
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公开(公告)号:US09633967B2
公开(公告)日:2017-04-25
申请号:US14910355
申请日:2014-10-06
申请人: NSK Ltd.
发明人: Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi , Ryoichi Suzuki
IPC分类号: H01L29/66 , H01L27/08 , H01L23/00 , H01L25/07 , H01L25/18 , H01L23/373 , H01L23/498 , H01L23/492 , H01L29/739 , H01L29/78
CPC分类号: H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
摘要: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
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公开(公告)号:US20140312497A1
公开(公告)日:2014-10-23
申请号:US13866811
申请日:2013-04-19
发明人: Kok Chai Goh , Meng Tong Ong
CPC分类号: H01L24/27 , H01L21/561 , H01L21/568 , H01L23/28 , H01L23/3107 , H01L23/3135 , H01L23/36 , H01L23/49524 , H01L23/60 , H01L24/31 , H01L24/37 , H01L24/40 , H01L24/84 , H01L24/96 , H01L24/97 , H01L2224/04034 , H01L2224/056 , H01L2224/05647 , H01L2224/24245 , H01L2224/37147 , H01L2224/37611 , H01L2224/4005 , H01L2224/40101 , H01L2224/40105 , H01L2224/40245 , H01L2224/84002 , H01L2224/84005 , H01L2224/848 , H01L2224/84801 , H01L2224/84897 , H01L2224/96 , H01L2224/97 , H01L2924/1306 , H01L2924/13091 , H01L2924/00 , H01L2924/00012 , H01L2224/84 , H01L2924/00014 , H01L2924/01322 , H01L2924/014
摘要: A method and apparatus for packaging a semiconductor chip is presented. A semiconductor device includes a chip, a lead, and an encapsulant. The encapsulant includes a stabilization layer, a laminate molding layer connected to the stabilization layer, and a conductive strip connected to the laminate molding layer. The conductive strip electrically connects the contact area of the chip to the lead.
摘要翻译: 提出了一种用于封装半导体芯片的方法和装置。 半导体器件包括芯片,引线和密封剂。 密封剂包括稳定层,连接到稳定层的层压成型层和连接到层压成型层的导电条。 导电带将芯片的接触区域电连接到引线。
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公开(公告)号:US08451621B2
公开(公告)日:2013-05-28
申请号:US12948970
申请日:2010-11-18
申请人: Shutesh Krishnan , Soon Wei Wang
发明人: Shutesh Krishnan , Soon Wei Wang
IPC分类号: H05K7/00
CPC分类号: H05K7/00 , H01L23/3121 , H01L23/3677 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/074 , H01L2224/05554 , H01L2224/291 , H01L2224/32225 , H01L2224/32235 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/37147 , H01L2224/37611 , H01L2224/37624 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/4007 , H01L2224/40095 , H01L2224/40106 , H01L2224/40225 , H01L2224/40227 , H01L2224/4103 , H01L2224/41052 , H01L2224/45014 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/83851 , H01L2224/85423 , H01L2224/85447 , H01L2924/00014 , H01L2924/014 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , Y10T29/49117 , Y10T29/4913 , H01L2924/00012 , H01L2924/00 , H01L2224/84
摘要: A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component includes stacked semiconductor die. In accordance with embodiments, the semiconductor component includes a substrate having a component receiving area and a plurality of bond pads. A semiconductor chip is attached to the component receiving area. An electrical connector is coupled to the semiconductor chip and the substrate. A second semiconductor chip is mounted or attached to one of the ends of the electrical connector such that this end is positioned between the semiconductor chips. A second electrical connector is coupled between the second semiconductor chip and the substrate. A third semiconductor chip is mounted over or attached to the second electrical connector such that a portion is between the second and third semiconductor chips.
摘要翻译: 半导体部件及半导体部件的制造方法,其特征在于,所述半导体部件具有堆叠的半导体管芯。 根据实施例,半导体部件包括具有部件接收区域和多个接合焊盘的基板。 半导体芯片附接到部件接收区域。 电连接器耦合到半导体芯片和基板。 第二个半导体芯片被安装或连接到电连接器的一个端部,使得该端部位于半导体芯片之间。 第二电连接器耦合在第二半导体芯片和基板之间。 第三半导体芯片安装在第二电连接器上或附着到第二电连接器,使得一部分在第二和第三半导体芯片之间。
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公开(公告)号:US20190131218A1
公开(公告)日:2019-05-02
申请号:US15797297
申请日:2017-10-30
发明人: Wu Hu LI , Edmund RIEDL , Thomas HOREDT , Ali MAZLOUM-NEJADARI
IPC分类号: H01L23/495 , H01L21/48 , H01L23/14 , H01L23/31 , H01L23/00
CPC分类号: H01L23/49568 , H01L21/4821 , H01L23/14 , H01L23/3107 , H01L23/36 , H01L23/3675 , H01L23/49524 , H01L23/49562 , H01L23/49582 , H01L24/32 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L2224/32245 , H01L2224/3512 , H01L2224/3716 , H01L2224/37572 , H01L2224/37611 , H01L2224/37616 , H01L2224/37618 , H01L2224/37639 , H01L2224/37644 , H01L2224/37647 , H01L2224/37655 , H01L2224/37664 , H01L2224/40175 , H01L2224/48245 , H01L2224/73263 , H01L2224/73265 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/2064 , H01L2924/20641
摘要: A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.
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公开(公告)号:US09418918B2
公开(公告)日:2016-08-16
申请号:US14667979
申请日:2015-03-25
申请人: NXP B.V.
IPC分类号: H01L23/495 , H01L23/00
CPC分类号: H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/84 , H01L2224/352 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/37611 , H01L2224/37639 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/84801 , H01L2924/00014
摘要: There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die.
摘要翻译: 公开了一种用于连接到半导体器件裸片的引线,该引线包括夹持部分。 夹持部分包括具有从其延伸的两个或更多个突起的主表面,用于连接到半导体器件裸片的接合焊盘。
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公开(公告)号:US20150287666A1
公开(公告)日:2015-10-08
申请号:US14667979
申请日:2015-03-25
申请人: NXP B.V.
IPC分类号: H01L23/495
CPC分类号: H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/84 , H01L2224/352 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/37611 , H01L2224/37639 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/84801 , H01L2924/00014
摘要: There is disclosed a lead for connection to a semiconductor device die, the lead comprising a clip portion. The clip portion comprises a major surface having two or more protrusions extending therefrom for connection to a bond pad of the semiconductor device die.
摘要翻译: 公开了一种用于连接到半导体器件裸片的引线,该引线包括夹持部分。 夹持部分包括具有从其延伸的两个或更多个突起的主表面,用于连接到半导体器件裸片的接合焊盘。
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公开(公告)号:US20160181221A1
公开(公告)日:2016-06-23
申请号:US14910355
申请日:2014-10-06
申请人: NSK LTD.
发明人: Takashi SUNAGA , Noboru KANEKO , Osamu MIYOSHI , Ryoichi SUZUKI
IPC分类号: H01L23/00 , H01L23/498 , H01L23/492 , H01L29/78 , H01L29/739
CPC分类号: H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
摘要: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
摘要翻译: 提供通过焊料具有高可靠性的电连接并且便宜的半导体模块。 电极接合部的与裸芯片FET的栅电极接合的面相对的基板接合部的接合面与与其他布线图案的被接合面相对的基板接合部的接合面包含 在金属板连接器的焊接期间使从熔融焊料产生的废气从放置在接合面和待接合面之间的焊料脱离的脱气释放机构。
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