公开(公告)号：US11837592B2

公开(公告)日：2023-12-05

申请号：US17827944

申请日：2022-05-30

Applicant: InnoLux Corporation

Inventor： Wei-Cheng Chu ,  Ming-Fu Jiang ,  Chia-Cheng Liu ,  Chih-Yuan Lee

IPC: H01L25/16 ,  H01L33/58 ,  H01L25/075 ,  H01L33/62 ,  H01L33/52

CPC classification number: H01L25/167 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.

公开(公告)号：US10672829B2

公开(公告)日：2020-06-02

申请号：US16209998

申请日：2018-12-05

Applicant: Innolux Corporation

Inventor： Wei-Cheng Chu ,  Ming-Fu Jiang ,  Gu-Jhong Jhang

IPC: H01L29/18 ,  H01L27/15 ,  H01L33/44 ,  H01L25/075 ,  H01L33/62

Abstract: The disclosure provides a manufacturing method of an LED display device, including the following steps: providing a substrate; forming at least one first bonding pad and at least one second bonding pad on the substrate; forming at least one spacer on the substrate, wherein the spacer is located between the first bonding pad and the second bonding pad, and a height of the spacer is P μm; providing a conductive paste layer above the substrate, wherein the conductive paste layer includes a plurality of conductive particles; and bonding at least one LED on the substrate, wherein the LED includes a first electrode and a second electrode, and the first electrode and the second electrode have a height H μm. The first electrode and the second electrode of the LED are respectively electrically connected to the first bonding pad and the second bonding pad of the substrate through the conductive particles of the conductive paste layer, and H+3.5 μm≥P μm≥H+0.48 μM.

公开(公告)号：US20190306990A1

公开(公告)日：2019-10-03

申请号：US16446653

申请日：2019-06-20

Applicant: Innolux Corporation

Inventor： Wei-Cheng Chu ,  Chia-Cheng Liu ,  Chih-Yuan Lee ,  Chin-Lung Ting ,  Tong-Jung Wang

IPC: H05K3/32 ,  G02F1/1345 ,  H05K3/46 ,  H05K3/06 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H05K1/18

Abstract: A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.

公开(公告)号：US12148740B2

公开(公告)日：2024-11-19

申请号：US18305509

申请日：2023-04-24

Applicant: InnoLux Corporation

Inventor： Yuan-Lin Wu ,  Kuan-Feng Lee ,  Wei-Cheng Chu

IPC: H01L25/075 ,  H01L33/20 ,  H01L33/58 ,  H01L33/62

Abstract: A display device is provided. The display device includes a substrate having a surface including a display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes an electrode; and a plurality of bonding pads disposed on the substrate; a conductive element disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; and a first matrix element disposed on the substrate, wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve.

公开(公告)号：US10825787B2

公开(公告)日：2020-11-03

申请号：US16148253

申请日：2018-10-01

Applicant: InnoLux Corporation

Inventor： Wei-Cheng Chu ,  Ming-Fu Jiang ,  Chia-Cheng Liu ,  Tong-Jung Wang

IPC: H01L23/00 ,  H01L25/10 ,  H01L25/18 ,  H01L27/12

Abstract: A first electronic element is disclosed, which includes: a first substrate having a first surface; a first electrode pad disposed on the first surface, wherein the first electrode pad has a second surface away from the first substrate; and an insulating layer disposed on the first surface, wherein the insulating layer includes an opening, the opening is disposed correspondingly to the first electrode pad, and the opening overlaps the first electrode pad in a normal direction of the first surface, wherein the insulating layer has a third surface away from the first substrate, a distance between the third surface and the second surface in the normal direction of the first surface is defined as a first distance, and the first distance is greater than 0 μm and less than or equal to 14 μm. In addition, the disclosure further provides an electronic device including the first electronic element.

公开(公告)号：US10186548B2

公开(公告)日：2019-01-22

申请号：US15678128

申请日：2017-08-16

Applicant: Innolux Corporation

Inventor： Wei-Cheng Chu ,  Ming-Fu Jiang ,  Gu-Jhong Jhang

IPC: H01L27/15 ,  H01L33/44 ,  H01L25/075 ,  H01L33/62

Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P μm. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H μm. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 μm≥P μm≥H+0.48 μm.

公开(公告)号：US20180053808A1

公开(公告)日：2018-02-22

申请号：US15678128

申请日：2017-08-16

Applicant: Innolux Corporation

Inventor： Wei-Cheng Chu ,  Ming-Fu Jiang ,  Gu-Jhong Jhang

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/44

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/62 ,  H01L2933/0066

Abstract: The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P μm. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H μm. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 μm≧P μm≧H+0.48 μm.

公开(公告)号：US11510321B2

公开(公告)日：2022-11-22

申请号：US17188554

申请日：2021-03-01

Applicant: InnoLux Corporation

Inventor： Wei-Cheng Chu ,  Chia-Cheng Liu ,  Ming-Fu Jiang

IPC: H05K1/11 ,  H05K3/20

Abstract: An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

公开(公告)号：US10340256B2

公开(公告)日：2019-07-02

申请号：US15593626

申请日：2017-05-12

Applicant: InnoLux Corporation

Inventor： Yuan-Lin Wu ,  Kuan-Feng Lee ,  Wei-Cheng Chu

IPC: H01L25/075 ,  H01L33/38 ,  H01L33/20 ,  H01L33/58 ,  H01L33/62

Abstract: A display device is provided. The display device includes a substrate having a surface including a display area and a non-display area adjacent to the display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes a contact electrode; and an anisotropic conductive layer disposed between the substrate and the plurality of light-emitting diodes, wherein the anisotropic conductive layer has a cross-sectional sidewall profile, and at least a part of the cross-sectional sidewall profile of the anisotropic conductive layer is in a shape of curve.

公开(公告)号：US11373945B2

公开(公告)日：2022-06-28

申请号：US16899780

申请日：2020-06-12

Applicant: InnoLux Corporation

Inventor： Wei-Cheng Chu ,  Chih-Yuan Lee ,  Yun-Chih Tsai

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H05K1/11

Abstract: An electronic device includes a substrate, a first conductive pad and a chip. The first conductive pad is disposed on the substrate. The chip includes a second conductive pad electrically connected to the first conductive pad, and the first conductive pad is disposed between the substrate and the second conductive pad. The first conductive pad has a first groove.