Abstract:
The present disclosure provides a sensing device and a method for manufacturing the same. The method for manufacturing the sensing device includes the following steps: providing a first temporary substrate, wherein the first temporary substrate includes: a first carrier; a first substrate disposed on the first carrier; and a plurality of sensing elements disposed on the first substrate; providing a second temporary substrate, wherein the second temporary substrate includes: a second carrier; and a second substrate disposed on the second carrier; assembling the first temporary substrate and the second temporary substrate to bond the first substrate and the second substrate; removing the first carrier and disposing the first substrate on a supporting film; and removing the second carrier, wherein the first substrate and the second substrate are respectively a flexible substrate.
Abstract:
An optical sensing module and an electronic device are provided. The optical sensing module includes a substrate, a plurality of optical sensing elements, and a light-blocking element. The substrate has a sensing region and a non-sensing region around the sensing region. The plurality of optical sensing elements is disposed on the sensing region. The light-blocking element is disposed on the non-sensing region and a portion of the sensing region. The light-blocking element overlaps a portion of the plurality of optical sensing elements in a normal direction of the substrate.
Abstract:
A biometric sensing device and a display apparatus including the same are provided. The biometric sensing device includes a first thin film transistor, a second thin film transistor, and a photodiode. The first thin film transistor has a gate. The second thin film transistor has a semiconductor layer and a non-gate electrode terminal. The non-gate electrode terminal is electrically connected to the gate of the first thin film transistor. The photodiode contacts a semiconductor layer.
Abstract:
The display device includes a first substrate; an active layer disposed on the first substrate; a first insulation layer disposed on the active layer; a first electrode layer disposed on the first insulation layer including a gate electrode line extending along a first direction and a protruding portion extending along a second direction; a second insulation layer disposed on the first electrode layer; and a second electrode layer disposed on the second insulation layer. The second electrode layer includes a date line extending along the second direction and a conductive layer. The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion has a first maximum width A along the first direction, and the second conductive portion has a second maximum width B along the first direction. The first maximum width A is less than the second maximum width B.
Abstract:
An array substrate structure including a first substrate, a plurality of thin film transistors, a first dielectric layer, a second dielectric layer, and a second electrode layer is provided. Each of the thin film transistors has a patterned first electrode layer which is disposed on the first electrode layer and has a first through hole. The second dielectric layer is disposed on the first dielectric layer and has a second through hole. The second through hole is connected to the first through hole, such that the second electrode layer is electrically connected to the first electrode layer via the first through hole and the second through hole.
Abstract:
A card device and a manufacturing method thereof are disclosed. The card device includes a first substrate, a circuit board, a sensing module and a second substrate. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing module is disposed in the accommodating recess. The sensing module includes a sensing unit and a protective layer formed on the sensing unit, and the sensing unit is electrically connected to the circuit board. The second substrate is disposed on the circuit board. The second substrate includes an opening, and the opening exposes the protective layer.
Abstract:
The display device includes a first substrate; an active layer disposed on the first substrate; a first insulation layer disposed on the active layer; a first electrode layer disposed on the first insulation layer including a gate electrode line extending along a first direction and a protruding portion extending along a second direction; a second insulation layer disposed on the first electrode layer; and a second electrode layer disposed on the second insulation layer. The second electrode layer includes a date line extending along the second direction and a conductive layer. The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion has a first maximum width A along the first direction, and the second conductive portion has a second maximum width B along the first direction. The first maximum width A is less than the second maximum width B.
Abstract:
The display device includes a first substrate; an active layer disposed on the first substrate; a first insulation layer disposed on the active layer; a first electrode layer disposed on the first insulation layer including a gate electrode line extending along a first direction and a protruding portion extending along a second direction; a second insulation layer disposed on the first electrode layer; and a second electrode layer disposed on the second insulation layer. The second electrode layer includes a date line extending along the second direction and a conductive layer. The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion has a first maximum width A along the first direction, and the second conductive portion has a second maximum width B along the first direction. The first maximum width A is less than the second maximum width B.
Abstract:
A display panel that includes a first light-shielding layer, a semiconductor layer, an insulating layer, and a gate line are successively on a substrate is provided. A contact hole passes through the insulating layer to expose the semiconductor layer. A metal layer is on the insulating layer and electrically connected to the semiconductor layer through the contact hole. The first light-shielding layer includes an overlapping region that overlaps with the metal layer and has a first width in a first direction. A minimum distance in the first direction between the edge of the metal layer adjacent to the gate line and the bottom of the contact hole is defined as a second width. The first direction is substantially perpendicular to an extending direction of the gate line, and a ratio of the first width to the second width is in a range between 0.2 and 0.8.
Abstract:
A display panel is disclosed, which comprises a first substrate including: a base substrate; a semiconductor layer; a first insulating layer; a first scan line and a second scan line extended along a first direction respectively and portions of the first scan line and the second scan line overlapping with the semiconductor layer; a second insulating layer; a data line extended along a second direction and electrically connecting to the semiconductor layer through a first contact via, wherein the second direction is different from the first direction; and a first metal pad and a second metal pad electrically connecting to the semiconductor layer through two second contact vias respectively; wherein the first contact via and the two second contact vias are disposed between the first scan line and the second scan line.