公开(公告)号：US20230369071A1

公开(公告)日：2023-11-16

申请号：US18226129

申请日：2023-07-25

Applicant: Intel Corporation

Inventor： Omkar G. KARHADE ,  Nitin A. DESHPANDE ,  Debendra MALLIK ,  Bassam M. ZIADEH ,  Yoshihiro TOMITA

IPC: H01L21/56 ,  H01L23/16 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00

CPC classification number: H01L21/563 ,  H01L23/16 ,  H01L23/562 ,  H01L25/0657 ,  H01L24/97 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2224/48465 ,  H01L2225/06541 ,  H01L2224/13082 ,  H01L2224/73204 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2224/81007 ,  H01L2224/14181 ,  H01L2224/0401 ,  H01L2224/97 ,  H01L2224/81191 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16225 ,  H01L2225/06568 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2225/06513 ,  H01L24/13 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/81203 ,  H01L2224/81211 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/81011 ,  H01L24/81 ,  H01L2924/2064 ,  H01L24/83 ,  H01L2224/26175 ,  H01L24/14 ,  H01L24/73 ,  H01L24/16 ,  H01L2924/1434 ,  H01L2225/06517 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/15311

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

公开(公告)号：US20200350181A1

公开(公告)日：2020-11-05

申请号：US16915290

申请日：2020-06-29

Applicant: Intel Corporation

Inventor： Omkar G. KARHADE ,  Nitin A. DESHPANDE ,  Debendra MALLIK ,  Bassam M. ZIADEH ,  Yoshihiro TOMITA

IPC: H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L23/16

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

公开(公告)号：US20190341271A1

公开(公告)日：2019-11-07

申请号：US16515981

申请日：2019-07-18

Applicant: Intel Corporation

Inventor： Omkar G. KARHADE ,  Nitin A. DESHPANDE ,  Debendra MALLIK ,  Bassam M. ZIADEH ,  Yoshihiro TOMITA

IPC: H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/16 ,  H01L25/18

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

公开(公告)号：US20250096009A1

公开(公告)日：2025-03-20

申请号：US18961031

申请日：2024-11-26

Applicant: Intel Corporation

Inventor： Omkar G. KARHADE ,  Nitin A. DESHPANDE ,  Debendra MALLIK ,  Bassam M. ZIADEH ,  Yoshihiro TOMITA

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/16 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.

公开(公告)号：US20220230892A1

公开(公告)日：2022-07-21

申请号：US17715923

申请日：2022-04-07

Applicant: Intel Corporation

Inventor： Omkar G. KARHADE ,  Nitin A. DESHPANDE ,  Debendra MALLIK ,  Bassam M. ZIADEH ,  Yoshihiro TOMITA

IPC: H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L23/16

Abstract: Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.