公开(公告)号：US20040173901A1

公开(公告)日：2004-09-09

申请号：US10382680

申请日：2003-03-05

Applicant: Intel Corporation

Inventor： Debendra Mallik ,  Robert L. Sankman

IPC: H01L023/48

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H05K1/182 ,  H05K2201/09054 ,  H05K2201/1056 ,  H05K2201/10734 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One ore more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

Abstract translation: 一种用于制造具有改善的热传导特性和高频响应的封装的方法和装置。 诸如铜的相对厚的封装衬底具有结合到一个面的布线层，使相对的面露出，例如是用于连接到散热器的表面。 将一个或多个芯片接合到布线层，并且在芯片的周边周围设置连接器阵列（例如焊球），以连接到印刷电路板。 在一些实施例中，印刷电路板具有一个孔，芯片延伸进入以允许更小的外部连接焊球。 在一些实施例中，第二散热器通过PCB孔连接到芯片的背面。

公开(公告)号：US20040135240A1

公开(公告)日：2004-07-15

申请号：US10744316

申请日：2003-12-22

Applicant: INTEL CORPORATION

Inventor： Hong Xie ,  Debendra Mallik

IPC: H01L023/02

CPC classification number: H01L23/16 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0231 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/2009

Abstract: A molded stiffener for a package substrate is presented. The stiffener includes a molded portion. The molded portion is molded of an electrically nonconductive molding compound. A plurality of capacitors are embedded in the molded portion. The capacitors are constructed and arranged to be electrically connected to the package substrate. As such, power delivery performance is improved, and mechanical strength is added to the substrate.