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Patent Agency Ranking
公开(公告)号：US20170179559A1
公开(公告)日：2017-06-22
申请号：US15452186
申请日：2017-03-07
Applicant: Intel Corporation
Inventor： Purna C. Subedi , Ian Burke , Vien Van Tran
CPC classification number: H01P1/2053 , H01P1/205 , H01P1/208 , H01P7/04
Abstract: A coupling is provided for coupling non-adjacent resonators of a radio frequency filter. The coupling joins together non-adjacent resonators with a metal strip. The metal strip is physically connected to but electrically isolated from resonators located between the connected non-adjacent resonators. The metal strips include tabs the length of which may be varied. The coupling works with different resonator configurations including horizontally aligned resonators. The coupling allows for the jumping of an even number of resonators can produce zeros at high and low bands. A single coupling of this configuration enables two negative couplings.
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公开(公告)号：US20170271744A1
公开(公告)日：2017-09-21
申请号：US15421640
申请日：2017-02-01
Applicant: Intel Corporation
Inventor： Ian Burke , Jason Cook , Ahmad Khanifar
CPC classification number: H01P11/007 , C23C18/1653 , C23C18/1657 , C23C28/021 , C23C28/023 , C25D1/02 , C25D7/00 , H01P1/208 , H01P1/2138 , H01P11/008 , H01Q9/0407
Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
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公开(公告)号：US09876262B2
公开(公告)日：2018-01-23
申请号：US15452186
申请日：2017-03-07
Applicant: Intel Corporation
Inventor： Purna C. Subedi , Ian Burke , Vien Van Tran
CPC classification number: H01P1/2053 , H01P1/205 , H01P1/208 , H01P7/04
Abstract: A coupling is provided for coupling non-adjacent resonators of a radio frequency filter. The coupling joins together non-adjacent resonators with a metal strip. The metal strip is physically connected to but electrically isolated from resonators located between the connected non-adjacent resonators. The metal strips include tabs the length of which may be varied. The coupling works with different resonator configurations including horizontally aligned resonators. The coupling allows for the jumping of an even number of resonators can produce zeros at high and low bands. A single coupling of this configuration enables two negative couplings.
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公开(公告)号：US09692098B2
公开(公告)日：2017-06-27
申请号：US14500440
申请日：2014-09-29
Applicant: Intel Corporation
Inventor： Purna Subedi , Ian Burke , Vien Van Tran
CPC classification number: H01P1/2053 , H01P1/205 , H01P1/208 , H01P7/04
Abstract: A coupling is provided for coupling non-adjacent resonators of a radio frequency filter. The coupling joins together non-adjacent resonators with a metal strip. The metal strip is physically connected to but electrically isolated from resonators located between the connected non-adjacent resonators. The metal strips include tabs the length of which may be varied. The coupling works with different resonator configurations including horizontally aligned resonators. The coupling allows for the jumping of an even number of resonators can produce zeros at high and low bands. A single coupling of this configuration enables two negative couplings.
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公开(公告)号：US09312594B2
公开(公告)日：2016-04-12
申请号：US13626700
申请日：2012-09-25
Applicant: Intel Corporation
Inventor： Ian Burke , Jason Cook , Ahmad Khanifar
CPC classification number: H01P11/007 , C23C18/1605 , C23C18/1653 , C23C28/021 , C23C28/023 , H01P1/208 , H01P7/06 , H01P11/008
Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and radio subsystems such as antennas and filters. The novel structures are fabricated by electroplating the required structure over a mold, housing, or substrate. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
Abstract translation: 实施例提供了一种用于减少射频空腔滤波器和诸如天线和滤波器的无线电子系统中的结构重量的新型制造方法和结构。 通过在模具，壳体或基底上电镀所需的结构来制造新颖的结构。 电沉积复合层可以由具有补偿热膨胀系数的几层金属或金属合金形成。 第一层或顶层是在预期的操作频率下具有厚度为皮肤深度的几倍的高导电性材料或诸如银的化合物。 顶层提供了这种过滤器结构所需的重要的低损耗性能和高Q因子，而随后的复合层提供了机械强度。
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