公开(公告)号：US20240113048A1

公开(公告)日：2024-04-04

申请号：US17957590

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Srinivasan Raman ,  Benjamin Duong ,  Jason Scott Steill ,  Shayan Kaviani ,  Srinivas Venkata Ramanuja Pietambaram ,  Suddhasattwa Nad ,  Brandon C. Marin ,  Gang Duan ,  Yi Yang

IPC: H01L23/64 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

CPC classification number: H01L23/647 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866

Abstract: Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.

公开(公告)号：US20240006298A1

公开(公告)日：2024-01-04

申请号：US17855040

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Suddhasattwa Nad ,  Steve Cho ,  Marcel Arlan Wall ,  Onur Ozkan ,  Ali Lehaf ,  Yi Yang ,  Jason Scott Steill ,  Gang Duan ,  Brandon C. Marin ,  Jeremy D. Ecton ,  Srinivas Venkata Ramanuja Pietambaram ,  Haifa Hariri ,  Bai Nie ,  Hiroki Tanaka ,  Kyle Mcelhinny ,  Jason Gamba ,  Venkata Rajesh Saranam ,  Kristof Darmawikarta ,  Haobo Chen

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49894 ,  H01L23/49816 ,  H01L21/4853 ,  H01L21/481 ,  H01L23/49838

Abstract: An electronic device may include an integrated circuit, for instance a semiconductor die. The electronic device may include a substrate having a first layer and a second layer. The first and second layers may include interconnects recessed below a surface of the substrate. The substrate may include a passivation layer directly coupled with portions of the interconnects. A solder resist material may at least partially cover portions of the passivation layer directly coupled with the first interconnect surface.

公开(公告)号：US20240113046A1

公开(公告)日：2024-04-04

申请号：US17957257

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Jason Scott Steill ,  Shayan Kaviani ,  Srinivas Venkata Ramanuja Pietambaram ,  Suddhasattwa Nad ,  Benjamin Duong ,  Srinivasan Raman ,  Yi Yang

IPC: H01L23/62 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L23/64

CPC classification number: H01L23/62 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/645 ,  H01L23/647 ,  H01L24/24 ,  H01L2224/24145 ,  H01L2924/12036

Abstract: Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.