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    Electronic package with passive component between substrates
    1.
    发明授权
    Electronic package with passive component between substrates 有权

    公开(公告)号：US11264315B2

    公开(公告)日：2022-03-01

    申请号：US15845531

    申请日：2017-12-18

    申请人： Intel Corporation

    发明人： Eng Huat Goh ,  Min Suet Lim ,  Jiun Hann Sir ,  Hoay Tien Teoh ,  Jimmy Huat Since Huang

    IPC分类号： H01L23/498 ,  H05K1/18 ,  H01L21/56 ,  H01L23/522 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H05K3/34

    摘要： An electronic package with passive components located between a first substrate and a second substrate. The electronic package can include a first substrate including a device interface for communication with an electronic device. An interposer can be electrically coupled to the first substrate. A second substrate can be offset from the first substrate at a distance. The second substrate can be electrically coupled to the first substrate through the interposer. A passive component can be attached to one of the first substrate or the second substrate. The passive component can be located between the first substrate and the second substrate. A height of the passive component can be is less than the distance between the first substrate and the second substrate. The second substrate can include a die interface configured for communication with a die. The die interface can be communicatively coupled to the passive component.

    ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
    2.
    发明申请
    ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES 有权

    公开(公告)号：US20220139814A1

    公开(公告)日：2022-05-05

    申请号：US17579186

    申请日：2022-01-19

    申请人： Intel Corporation

    发明人： Eng Huat Goh ,  Min Suet Lim ,  Jiun Hann Sir ,  Hoay Tien Teoh ,  Jimmy Huat Since Huang

    IPC分类号： H01L23/498 ,  H05K1/18 ,  H01L21/56 ,  H01L23/522 ,  H01L23/00 ,  H01L23/538

    摘要： An electronic package with passive components located between a first substrate and a second substrate. The electronic package can include a first substrate including a device interface for communication with an electronic device. An interposer can be electrically coupled to the first substrate. A second substrate can be offset from the first substrate at a distance. The second substrate can be electrically coupled to the first substrate through the interposer. A passive component can be attached to one of the first substrate or the second substrate. The passive component can be located between the first substrate and the second substrate. A height of the passive component can be is less than the distance between the first substrate and the second substrate. The second substrate can include a die interface configured for communication with a die. The die interface can be communicatively coupled to the passive component.

    ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES
    5.
    发明申请
    ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES 审中-公开

    公开(公告)号：US20190103346A1

    公开(公告)日：2019-04-04

    申请号：US15845531

    申请日：2017-12-18

    申请人： Intel Corporation

    发明人： Eng Huat Goh ,  Min Suet Lim ,  Jiun Hann Sir ,  Hoay Tien Teoh ,  Jimmy Huat Since Huang

    IPC分类号： H01L23/498 ,  H05K1/18 ,  H01L21/56 ,  H01L23/538 ,  H01L23/522 ,  H01L23/00

    摘要： An electronic package with passive components located between a first substrate and a second substrate. The electronic package can include a first substrate including a device interface for communication with an electronic device. An interposer can be electrically coupled to the first substrate. A second substrate can be offset from the first substrate at a distance. The second substrate can be electrically coupled to the first substrate through the interposer. A passive component can be attached to one of the first substrate or the second substrate. The passive component can be located between the first substrate and the second substrate. A height of the passive component can be is less than the distance between the first substrate and the second substrate. The second substrate can include a die interface configured for communication with a die. The die interface can be communicatively coupled to the passive component.