公开(公告)号：US20180350767A1

公开(公告)日：2018-12-06

申请号：US16054009

申请日：2018-08-03

Applicant: Intel Corporation

Inventor： Jonathon R. Carstens ,  Michael S. Brazel ,  Russell S. Aoki ,  Laura S. Mortimer

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/008 ,  B23K1/19 ,  B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  H01L23/34 ,  H01L23/498 ,  B23K101/42 ,  H05K3/12 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K3/06 ,  B23K3/0638 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/345 ,  H01L23/49816 ,  H01L24/75 ,  H01L2224/81007 ,  H01L2224/81024 ,  H01L2224/81035 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/15321 ,  H05K3/1225 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2203/166

Abstract: Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.